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公开(公告)号：US6012624A
公开(公告)日：2000-01-11
申请号：US17742
申请日：1998-02-03
CPC分类号： H05K3/3494 , B23K1/012 , B23K1/018 , H05K13/0486 , H05K3/3447 , B23K2201/40 , H05K2203/081 , H05K2203/086 , H05K2203/087 , H05K3/3489
摘要： A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).
摘要翻译： 用于焊接针孔电子电路部件的工具包括：工具板，其具有与其上焊接有电路部件的电路板的孔对应的一组通孔。 板与工具板对齐，热气通过一组板通孔供应，以回流板孔中的焊料。 该工具特别适用于拆卸和更换固定电路元件。 特定气体（例如氮气）的使用允许在不使用焊剂的情况下进行焊接。 该工具的优点在于它防止燃烧电路板和/或无意地回流安装在电路板上的其他电路部件（通过将热气体仅基本上引导到电路板的含焊料孔上）。
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公开(公告)号：US5758815A
公开(公告)日：1998-06-02
申请号：US782022
申请日：1997-01-07
CPC分类号： H05K3/3494 , B23K1/012 , B23K1/018 , H05K13/0486 , H05K3/3447 , B23K2201/40 , H05K2203/081 , H05K2203/086 , H05K2203/087 , H05K3/3489
摘要： A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).
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公开(公告)号：US5613633A
公开(公告)日：1997-03-25
申请号：US433638
申请日：1995-05-02
CPC分类号： H05K3/3494 , B23K1/012 , B23K1/018 , H05K13/0486 , H05K3/3447 , B23K2201/40 , H05K2203/081 , H05K2203/086 , H05K2203/087 , H05K3/3489
摘要： A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).
摘要翻译： 用于焊接针孔电子电路部件的工具包括：工具板，其具有与其上焊接有电路部件的电路板的孔对应的一组通孔。 板与工具板对齐，热气通过一组板通孔供应，以回流板孔中的焊料。 该工具特别适用于拆卸和更换固定电路元件。 特定气体（例如氮气）的使用允许在不使用焊剂的情况下进行焊接。 该工具的优点在于它防止燃烧电路板和/或无意地回流安装在电路板上的其他电路元件（通过将热气体仅基本上引导到电路板的含焊料孔上）。
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公开(公告)号：US5788143A
公开(公告)日：1998-08-04
申请号：US399265
申请日：1995-05-17
CPC分类号： H01L21/67144 , H01L21/4853 , H05K13/0465 , H05K3/3478 , H01L2224/11334 , H01L2224/742 , H01L2924/01322 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0485 , H05K2203/082 , H05K3/3489 , Y10T29/49126 , Y10T29/49144
摘要： Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.
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公开(公告)号：US06254923B1
公开(公告)日：2001-07-03
申请号：US09099883
申请日：1998-01-12
IPC分类号： B05D512
CPC分类号： H01L21/67144 , H01L21/4853 , H01L2224/11334 , H01L2224/742 , H01L2924/01322 , H05K3/3478 , H05K3/3489 , H05K13/0465 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0485 , H05K2203/082 , Y10T29/49126 , Y10T29/49144
摘要： Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.
摘要翻译： 焊料颗粒220沉积在位于衬底301上的直接芯片连接（DCA）部位的金属化触点上。触点302涂覆有一层焊剂303.拾取头211位于焊料颗粒220的贮存器201中 并且颗粒被吸引到头部的端部213中的孔。 孔具有对应于衬底上的金属化接触的覆盖区的布置。 头211定位成邻近衬底301并且颗粒220被释放。 颗粒220粘附到涂覆在触点302上的焊剂303上。颗粒被回流，平整并再次涂覆有焊剂。 然后将集成电路芯片放置在平整浮雕501上，并且浮雕再次回流以将芯片附接到触点302上。
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6.发明授权Method of forming high lateral voltage isolation structure involving two separate trench fills 有权形成高横向电压隔离结构的方法，涉及两个单独的沟槽填充公开(公告)号：US08815700B2
公开(公告)日：2014-08-26
申请号：US12315934
申请日：2008-12-08
申请人： Peter J. Hopper , William French , Kyuwoon Hwang
发明人： Peter J. Hopper , William French , Kyuwoon Hwang
IPC分类号： H01L21/76
CPC分类号： H01L21/76283
摘要： In a SOI process, a high lateral voltage isolation structure is formed by providing at least two concentric dielectric filled trenches, removing the semiconductor material between the dielectric filled trenches and filling the resultant gap with dielectric material to define a single wide dielectric filled trench.
摘要翻译： 在SOI工艺中，通过提供至少两个同心的电介质填充的沟槽来形成高横向电压隔离结构，去除介电填充的沟槽之间的半导体材料，并用电介质材料填充所得的间隙以限定单个宽的电介质填充的沟槽。
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公开(公告)号：US08524548B2
公开(公告)日：2013-09-03
申请号：US13094645
申请日：2011-04-26
申请人： William French , Vladislav Vashchenko , Richard Wendell Foote, Jr. , Alexei Sadovnikov , Punit Bhola , Peter J. Hopper
发明人： William French , Vladislav Vashchenko , Richard Wendell Foote, Jr. , Alexei Sadovnikov , Punit Bhola , Peter J. Hopper
IPC分类号： H01L29/66
CPC分类号： H01L29/7824 , H01L21/26586 , H01L29/0653 , H01L29/0878 , H01L29/1095 , H01L29/66689 , H01L29/7835 , H01L29/78603
摘要： A lateral DMOS transistor formed on a silicon-on-insulator (SOI) structure has a higher breakdown voltage that results from a cavity that is formed in the bulk region of the SOI structure. The cavity exposes a portion of the bottom surface of the insulator layer of the SOI structure that lies directly vertically below the drift region of the DMOS transistor.
摘要翻译： 形成在绝缘体上硅（SOI）结构上的横向DMOS晶体具有较高的击穿电压，该击穿电压是由在SOI结构的体区形成的空穴产生的。 空腔暴露SOI结构的绝缘体层的底部表面的一部分，其直接位于DMOS晶体管的漂移区的垂直下方。
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公开(公告)号：US08466535B2
公开(公告)日：2013-06-18
申请号：US13208890
申请日：2011-08-12
申请人： Peter J. Hopper , William French , Ann Gabrys , Martin Fallon
发明人： Peter J. Hopper , William French , Ann Gabrys , Martin Fallon
IPC分类号： H01L27/06
CPC分类号： H01L23/5256 , H01L23/48 , H01L25/0655 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2924/10253 , H01L2924/13091 , H01L2924/30107 , H04L25/0266 , H01L2924/00015 , H01L2924/00 , H01L2924/00014
摘要： The spikes in current and voltage that result from the failure of a galvanic dielectric layer are safely contained by a galvanic isolation fuse that pops and forms and open circuit between a high-voltage die and a low-voltage die in response to the failure of the galvanic dielectric layer.
摘要翻译： 由电流介电层故障引起的电流和电压尖峰由电流隔离保险丝安全地包含，该电隔离保险丝响应于高压管芯和低压管芯之间的电流隔离保险丝 电介质层。
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公开(公告)号：US20130001735A1
公开(公告)日：2013-01-03
申请号：US13170451
申请日：2011-06-28
申请人： Peter J. Hopper , William French , Ann Gabrys
发明人： Peter J. Hopper , William French , Ann Gabrys
CPC分类号： H01L23/3732 , H01L23/147 , H01L23/49894 , H01L25/0655 , H01L2224/16225 , H01L2224/48227 , H01L2924/10253 , H01L2924/19107 , H01L2924/00
摘要： A galvanic isolation integrated circuit system includes a semiconductor substrate; a layer of thermally conductive material, e.g., CVD nano- or poly-diamond thin film or boron nitride CVD thin film, formed over the semiconductor substrate; a first integrated circuit structure formed over the layer of thermally conductive material; a second integrated circuit structure formed over the layer of thermally conductive material, the second integrated circuit structure being spaced apart from the first integrated circuit structure; and a galvanic isolation structure formed over the layer of thermally conductive material between the first and second integrated circuit structures and connected to the first integrated circuit structure and the second integrated circuit structure.
摘要翻译： 电隔离集成电路系统包括半导体衬底; 形成在半导体衬底上的导热材料层，例如CVD纳米或多晶金刚石薄膜或氮化硼CVD薄膜; 形成在导热材料层上的第一集成电路结构; 形成在所述导热材料层上的第二集成电路结构，所述第二集成电路结构与所述第一集成电路结构间隔开; 以及在第一和第二集成电路结构之间形成在导热材料层上并连接到第一集成电路结构和第二集成电路结构的电流隔离结构。
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10.发明授权Self-propelled robotic device that moves through bodily and other passageways 有权通过身体和其他通道移动的自行式机器人装置公开(公告)号：US08303484B2
公开(公告)日：2012-11-06
申请号：US12621719
申请日：2009-11-19
IPC分类号： A61B1/00
CPC分类号： A61B1/041 , A61B1/00082 , A61B1/00156 , A61B1/005 , A61B1/31 , A61B8/12 , A61B8/429 , A61B8/4472
摘要： A self-propelled robotic device moves through bodily and other passageways by inflating regions of an overlying bladder along the length of the robotic device in a sequence that imparts motion to the device. The regions of the overlying bladder are inflated by energizing a plurality of coils, which are surrounded by a ferrofluid, in a sequence. The ferrofluid responds to the magnetic field created by an energized coil by creating a bulge in the side wall of the overlying bladder.
摘要翻译： 自动推进的机器人装置通过身体和其他通道沿着机器人装置的长度沿着向装置施加运动的顺序使覆盖的膀胱的区域膨胀而移动。 通过对由铁磁流体包围的多个线圈进行顺序地激励上覆的气囊的区域来充气。 铁磁流体通过在上覆气囊的侧壁中产生凸起来响应由通电线圈产生的磁场。
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