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公开(公告)号：US06742884B2
公开(公告)日：2004-06-01
申请号：US09838685
申请日：2001-04-19
IPC分类号： E03F100
CPC分类号： B41J2/14008 , H01L21/0271 , H01L21/0332 , H01L21/0337
摘要： A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.
摘要翻译： 描述用于掩蔽待蚀刻表面的方法和系统。 液滴源喷射掩模材料的液滴以沉积在待蚀刻的薄膜或其它衬底表面上。 控制薄膜或基板表面的温度，使得液滴在与薄膜或基板表面接触时快速冷冻。 然后蚀刻薄膜或衬底。 蚀刻后，去除掩模材料。
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公开(公告)号：US07033516B2
公开(公告)日：2006-04-25
申请号：US10334595
申请日：2002-12-30
IPC分类号： B44C1/22
CPC分类号： G03F7/2018 , B41C1/025 , B41M3/006 , B41M5/0011 , G02F1/1303 , H01L27/1292
摘要： A method and system for fabricating an array of electronic devices, typically a display or sensor is described. In the method, a droplet source ejects droplets of a masking material for deposit on a thin film or substrate surface to mask an element of the array of electronic devices. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.
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公开(公告)号：US06872320B2
公开(公告)日：2005-03-29
申请号：US09838684
申请日：2001-04-19
CPC分类号： G03F7/2018 , B41C1/025 , B41M3/006 , B41M5/0011 , G02F1/1303 , H01L27/1292
摘要： A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.
摘要翻译： 描述用于掩蔽待蚀刻表面的方法和系统。 液滴源喷射掩模材料的液滴以沉积在待蚀刻的薄膜或其它衬底表面上。 控制薄膜或基板表面的温度，使得液滴在与薄膜或基板表面接触时快速冷冻。 然后蚀刻薄膜或衬底。 蚀刻后，去除掩模材料。
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4.发明授权公开(公告)号：US06972261B2
公开(公告)日：2005-12-06
申请号：US10186092
申请日：2002-06-27
IPC分类号： B05D1/26 , B05D1/32 , B05D7/00 , H01L21/033 , H01L21/288 , H01L21/311 , H01L21/3205 , H01L21/3213 , H01L21/336 , H01L29/786 , H01L51/00 , H01L51/05 , H01L51/40 , H01L21/302
CPC分类号： H01L51/0004 , B82Y30/00 , H01L21/0337 , H01L21/31144 , H01L21/32139 , H01L29/66765 , H01L51/0021 , H01L51/0023 , H01L51/0541
摘要： A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.
摘要翻译： 描述用于掩蔽待蚀刻表面的方法和系统。 该方法包括加热相变掩模材料和使用液滴源来喷射掩模材料的液滴以沉积在待蚀刻的薄膜或其它基底表面上的操作。 控制薄膜或基板表面的温度，使得在与薄膜或基板表面接触之后液滴快速冷冻。 然后通常通过在表面上沉积自组装的单层来处理薄膜或基底以改变表面特性。 沉积后，去除掩模材料。 然后将感兴趣的材料沉积在衬底上，使得材料仅粘附到最初不被掩模覆盖的区域，使得掩模用作负抗蚀剂。 使用这样的技术，可以制造小于最小液滴印刷的装置的特征尺寸。
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5.发明授权公开(公告)号：US07223700B2
公开(公告)日：2007-05-29
申请号：US11251525
申请日：2005-10-14
IPC分类号： H01L21/302
CPC分类号： H01L51/0004 , B82Y30/00 , H01L21/0337 , H01L21/31144 , H01L21/32139 , H01L29/66765 , H01L51/0021 , H01L51/0023 , H01L51/0541
摘要： A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.
摘要翻译： 描述用于掩蔽待蚀刻表面的方法和系统。 该方法包括加热相变掩模材料和使用液滴源来喷射掩模材料的液滴以沉积在待蚀刻的薄膜或其它基底表面上的操作。 控制薄膜或基板表面的温度，使得在与薄膜或基板表面接触之后液滴快速冷冻。 然后通常通过在表面上沉积自组装的单层来处理薄膜或基底以改变表面特性。 沉积后，去除掩模材料。 然后将感兴趣的材料沉积在衬底上，使得材料仅粘附到最初不被掩模覆盖的区域，使得掩模用作负抗蚀剂。 使用这样的技术，可以制造小于最小液滴印刷的装置的特征尺寸。
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公开(公告)号：US07811692B2
公开(公告)日：2010-10-12
申请号：US12257820
申请日：2008-10-24
申请人： Raj B. Apte , David G. Duff , Christian G. Van de Walle , Jeng Ping Lu , Alberto Salleo , Stephen D. White
发明人： Raj B. Apte , David G. Duff , Christian G. Van de Walle , Jeng Ping Lu , Alberto Salleo , Stephen D. White
IPC分类号： H01M8/22
CPC分类号： H01M8/1016 , H01M8/1004 , H01M8/1097 , H01M8/241 , H01M8/2418 , H01M8/242 , H01M8/2483 , Y02P70/56
摘要： An improved fuel cell is described. The invention addresses the problem of mechanical failure in thin electrolytes. One embodiment varies the thickness of the electrolyte and positions at least either the anode or cathode in the recessed region to provide a short travel distance for ions traveling from the anode to the cathode or from the cathode to the anode. A second embodiment uses a uniquely shaped manifold cover to allow close positioning of the anode to the cathode. Using the described structures results in a substantial improvement in fuel cell reliability and performance.
摘要翻译： 描述了改进的燃料电池。 本发明解决了薄电解液中机械故障的问题。 一个实施例改变电解质的厚度并且在凹陷区域中至少位于阳极或阴极之间，以便为从阳极到阴极或从阴极到阳极的离子提供短的行进距离。 第二实施例使用独特形状的歧管盖，以允许阳极到阴极的紧密定位。 使用所述结构可以显着提高燃料电池的可靠性和性能。
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公开(公告)号：US20090073242A1
公开(公告)日：2009-03-19
申请号：US12273575
申请日：2008-11-19
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14475 , Y10T29/42 , Y10T29/49401
摘要： A fluid ejector including a silicon wafer having a first side and a second side. A multi-layer monolithic structure is formed on the first side of the silicon wafer. The multi-layer monolithic structure includes a first structure layer formed on the first side of the silicon wafer, and the first structure layer has an aperture. A second structure layer has a horizontal portion and closed, filled trenches or vertical sidewalls. The first structure layer, horizontal portion and the closed, filled trenches or vertical sidewalls of the second structure layer define a fluid cavity. An actuator is associated with the horizontal portion of the second structure layer, and an etched portion of the silicon wafer defines an open area which exposes the aperture in the first structure layer.
摘要翻译： 一种流体喷射器，包括具有第一侧和第二侧的硅晶片。 在硅晶片的第一侧上形成多层整体结构。 多层单片结构包括形成在硅晶片的第一侧上的第一结构层，第一结构层具有孔。 第二结构层具有水平部分和闭合的填充沟槽或垂直侧壁。 第二结构层的第一结构层，水平部分和闭合填充的沟槽或垂直侧壁限定流体腔。 致动器与第二结构层的水平部分相关联，并且硅晶片的蚀刻部分限定露出第一结构层中的孔的开放区域。
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公开(公告)号：US20090047558A1
公开(公告)日：2009-02-19
申请号：US12257820
申请日：2008-10-24
申请人： Raj B. Apte , David G. Duff , Christian G. Van de Walle , Jeng Ping Lu , Alberto Salleo , Stephen D. White
发明人： Raj B. Apte , David G. Duff , Christian G. Van de Walle , Jeng Ping Lu , Alberto Salleo , Stephen D. White
CPC分类号： H01M8/1016 , H01M8/1004 , H01M8/1097 , H01M8/241 , H01M8/2418 , H01M8/242 , H01M8/2483 , Y02P70/56
摘要： An improved fuel cell is described. The invention addresses the problem of mechanical failure in thin electrolytes. One embodiment varies the thickness of the electrolyte and positions at least either the anode or cathode in the recessed region to provide a short travel distance for ions traveling from the anode to the cathode or from the cathode to the anode. A second embodiment uses a uniquely shaped manifold cover to allow close positioning of the anode to the cathode. Using the described structures results in a substantial improvement in fuel cell reliability and performance.
摘要翻译： 描述了改进的燃料电池。 本发明解决了薄电解液中机械故障的问题。 一个实施例改变电解质的厚度并且在凹陷区域中至少位于阳极或阴极之间，以便为从阳极到阴极或从阴极到阳极的离子提供短的行进距离。 第二实施例使用独特形状的歧管盖，以允许阳极到阴极的紧密定位。 使用所述结构可以显着提高燃料电池的可靠性和性能。
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公开(公告)号：US5150134A
公开(公告)日：1992-09-22
申请号：US706708
申请日：1991-05-29
申请人： Lorin K. Hansen , Stephen D. White
发明人： Lorin K. Hansen , Stephen D. White
CPC分类号： B41J2/395
摘要： An electrostatic recorder for applying electrical charges, in image configuration, upon a movable image recording member, the recorder including a stylus electrode array and a counter electrode array which electrode arrays are aligned with one another on opposite surfaces of the image recording member and are positioned so as to extend across the direction of movement of the image recording member. The counter electrode array comprises a base member supporting a plurality of electrically conductive traces thereon, each extending substantially in the direction of movement of the recording member. The conductive traces are interconnected by a layer of resistive material, and contact pads are connected to periodically spaced conductive traces so as to apply electrical potentials to spaced regions of the counter electrode array. Those conductive traces located intermediate the periodically spaced conductive traces are electrically floating when electrical potentials are applied to the spaced conductive traces.
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公开(公告)号：US07905580B2
公开(公告)日：2011-03-15
申请号：US12273575
申请日：2008-11-19
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14475 , Y10T29/42 , Y10T29/49401
摘要： A fluid ejector including a silicon wafer having a first side and a second side. A multi-layer monolithic structure is formed on the first side of the silicon wafer. The multi-layer monolithic structure includes a first structure layer formed on the first side of the silicon wafer, and the first structure layer has an aperture. A second structure layer has a horizontal portion and closed, filled trenches or vertical sidewalls. The first structure layer, horizontal portion and the closed, filled trenches or vertical sidewalls of the second structure layer define a fluid cavity. An actuator is associated with the horizontal portion of the second structure layer, and an etched portion of the silicon wafer defines an open area which exposes the aperture in the first structure layer.
摘要翻译： 一种流体喷射器，包括具有第一侧和第二侧的硅晶片。 在硅晶片的第一侧上形成多层整体结构。 多层单片结构包括形成在硅晶片的第一侧上的第一结构层，第一结构层具有孔。 第二结构层具有水平部分和闭合的填充沟槽或垂直侧壁。 第二结构层的第一结构层，水平部分和闭合填充的沟槽或垂直侧壁限定流体腔。 致动器与第二结构层的水平部分相关联，并且硅晶片的蚀刻部分限定露出第一结构层中的孔的开放区域。
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