公开(公告)号：US20110011631A1

公开(公告)日：2011-01-20

申请号：US12585006

申请日：2009-08-31

申请人： Won Hee YOO ,  Byeung Gyu CHANG ,  Yong Suk KIM

发明人： Won Hee YOO ,  Byeung Gyu CHANG ,  Yong Suk KIM

IPC分类号： H05K1/09 ,  B05D5/12 ,  H05K1/03

CPC分类号： H05K3/4007 ,  H05K1/0306 ,  H05K3/248 ,  H05K3/38 ,  H05K2203/0278 ,  H05K2203/1476

摘要： The present invention relates to a ceramic substrate and a method of manufacturing the same. The ceramic substrate includes: a ceramic base; an electrode pattern formed on at least one surface of the ceramic base at predetermined internal and external depths; and electrode material filled in the inside of the electrode pattern. The method of manufacturing the ceramic substrate includes: coating first electrode material on at least one surface of a ceramic base; forming a surface layer built-in electrode pattern by pressurizing the coated first electrode material; primarily firing the ceramic base on which the surface layer built-in electrode pattern is formed; coating second electrode material on the surface layer built-in electrode pattern; and secondarily firing the ceramic base on which the second electrode material is coated.

摘要翻译： 陶瓷基板及其制造方法技术领域本发明涉及陶瓷基板及其制造方法。 陶瓷基板包括：陶瓷基体; 在预定的内部和外部深度形成在所述陶瓷基体的至少一个表面上的电极图案; 以及填充在电极图案内部的电极材料。 制造陶瓷基板的方法包括：在陶瓷基体的至少一个表面上涂覆第一电极材料; 通过对所涂覆的第一电极材料进行加压来形成表面层内置的电极图案; 主要烧制形成表面层内置电极图案的陶瓷基底; 在表面层上涂覆第二电极材料内置的电极图案; 并二次烧制涂覆有第二电极材料的陶瓷基底。

公开(公告)号：US20100059266A1

公开(公告)日：2010-03-11

申请号：US12405729

申请日：2009-03-17

申请人： Won Hee YOO ,  Byeung Gyu CHANG ,  Taek Jung LEE ,  Yong Suk KIM

发明人： Won Hee YOO ,  Byeung Gyu CHANG ,  Taek Jung LEE ,  Yong Suk KIM

IPC分类号： H05K1/11 ,  C03B25/00

CPC分类号： H05K3/4629 ,  B32B18/00 ,  C04B37/005 ,  C04B2237/04 ,  C04B2237/32 ,  C04B2237/52 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/595 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1126 ,  H05K2203/1476

摘要： Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.

摘要翻译： 提供一种制造陶瓷多层电路基板的方法。 形成多个陶瓷块，每个陶瓷块中的一个或多个具有通孔电极的陶瓷生片分别彼此层叠，然后烧制。 烧制的陶瓷块彼此对准。 制备一个或多个接合生片，每个接合生片具有与陶瓷块的通孔电极对应的位置的接合电极。 每个接合生片被插入在彼此相对的一对陶瓷块之间。 陶瓷块和接合生片结合，然后烧制。

公开(公告)号：US20100051173A1

公开(公告)日：2010-03-04

申请号：US12411156

申请日：2009-03-25

申请人： Yong Suk KIM ,  Byeung Gyu CHANG ,  Taek Jung LEE

发明人： Yong Suk KIM ,  Byeung Gyu CHANG ,  Taek Jung LEE

IPC分类号： C04B33/32

CPC分类号： H05K3/4611 ,  C04B33/32 ,  H05K3/4629 ,  H05K2203/0789 ,  H05K2203/308

摘要： There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed.

摘要翻译： 提供一种制造多层陶瓷基板的方法，该方法包括：提供层叠有多个低温烧结生片的非烧结多层陶瓷基板; 在非烧结多层陶瓷基板的顶表面和底表面中的至少一个上设置难以烧结的约束生片; 烧结其上设置有难烧结约束层的非烧结多层陶瓷衬底; 将烧结的多层陶瓷衬底浸入酸性溶液中; 并且激活硬烧结约束层和酸性溶液之间的接触，从而去除硬烧结约束层。

公开(公告)号：US20130162371A1

公开(公告)日：2013-06-27

申请号：US13427829

申请日：2012-03-22

申请人： Sang Moon Lee ,  Sung Kwon WI ,  Jeong Bok KWAK ,  Won Chul SIM ,  Young Seuck YOO ,  Yong Suk KIM

发明人： Sang Moon Lee ,  Sung Kwon WI ,  Jeong Bok KWAK ,  Won Chul SIM ,  Young Seuck YOO ,  Yong Suk KIM

IPC分类号： H03H7/01

CPC分类号： H01F17/0013 ,  H01F2003/106 ,  H01F2017/0066 ,  H03H7/0153 ,  H03H2001/0092

摘要： The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer provided on the lower magnetic body and including at least one conductor pattern; and an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite provided on the primary ferrite composite to cover a pore formed on a surface of the primary ferrite composite, and a method of manufacturing the same.According to the present invention, it is possible to implement a filter for removing noise with high performance and characteristics by increasing magnetic permeability and improving impedance characteristics through simple structure and process.

摘要翻译： 本发明公开了一种消除噪声的滤波器，包括：下磁体; 绝缘层，设置在下磁体上并且包括至少一个导体图案; 以及设置在所述绝缘层上的初级铁氧体复合体的上磁体及在所述一次铁氧体复合体上设置的次级铁氧体复合体，以覆盖在所述一次铁氧体复合体的表面上形成的孔及其制造方法。 根据本发明，通过简单的结构和工艺，通过提高磁导率和改善阻抗特性，可以实现具有高性能和特性的噪声去除滤波器。

公开(公告)号：US20130141205A1

公开(公告)日：2013-06-06

申请号：US13420540

申请日：2012-03-14

申请人： Sang Moon LEE ,  Yong Suk KIM ,  Jeong Bok KWAK ,  Young Seuck YOO ,  Sung Kwon WI

发明人： Sang Moon LEE ,  Yong Suk KIM ,  Jeong Bok KWAK ,  Young Seuck YOO ,  Sung Kwon WI

IPC分类号： H01F5/00

CPC分类号： H01F5/003

摘要： A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.

摘要翻译： 在磁性基板上形成为螺旋状的线圈部的导体图案，其包括：主导体图案; 以及形成在主导体图案上的次级导体图案。 主导体图案形成为具有电连接到第一水平部分的一个表面的端部的第一水平部分和第一垂直部分的纵向部分。 次级导体图案形成为具有包括对应于第一水平部分的第二水平部分的纵向部分和与第二水平部分的一个表面的端部电连接的第二垂直部分。

公开(公告)号：US20110025593A1

公开(公告)日：2011-02-03

申请号：US12728087

申请日：2010-03-19

申请人： Won Do KEE ,  Seung Se KIM ,  Yong Suk KIM ,  Chan Sung JEONG

发明人： Won Do KEE ,  Seung Se KIM ,  Yong Suk KIM ,  Chan Sung JEONG

IPC分类号： G09G3/36 ,  G02F1/13357

CPC分类号： G02F1/133615 ,  G02B6/0036 ,  G02B6/008 ,  G02B6/0085 ,  G02B6/0088 ,  G02F1/133608

摘要： A backlight unit includes a plurality of light sources emitting light in a direct direction with a predetermined orientation angle, and a light guide panel having a light incident section and a light emitting section. The light incident section has a first surface to receive light emitted from one or more of the light sources in the first direction and the light emitting section is to emit light received from the light incident section in a second direction. In addition, a height of an elevated structure, extending from an upper surface of the light incident section to an upper surface of the light emitting section, is greater than or substantially equal to a height of a distal end of the light emitting section.

摘要翻译： 背光单元包括以预定取向角沿直接方向发光的多个光源，以及具有光入射部和发光部的导光板。 光入射部分具有第一表面，以在第一方向上接收从一个或多个光源发射的光，并且发光部分沿第二方向发射从光入射部分接收的光。 此外，从光入射部分的上表面延伸到发光部分的上表面的升高的结构的高度大于或基本上等于发光部分的远端的高度。

公开(公告)号：US20100014281A1

公开(公告)日：2010-01-21

申请号：US12273401

申请日：2008-11-18

申请人： Yong Suk KIM

发明人： Yong Suk KIM

IPC分类号： G02F1/13357 ,  H01J61/92

CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device package and other devices using the light emitting device package are discussed. According to an embodiment, the light emitting device package includes a package body; at least one light emitting device disposed in the package body; at least one pair of leads electrically connected with the light emitting device; and a lens over the light emitting device and having at least one recess at an upper portion of the lens, the shortest distance from the light emitting device to a lowest portion of the recess being greater than approximately D1/7 and smaller than approximately D1/2.4, wherein D1 is a diameter of the lens.

摘要翻译： 讨论了使用发光器件封装的发光器件封装和其它器件。 根据实施例，发光器件封装包括封装体; 设置在所述包装体内的至少一个发光装置; 与发光装置电连接的至少一对引线; 以及在该发光器件上方的透镜，并且在该透镜的上部具有至少一个凹部，从该发光器件到该凹部的最低部分的最短距离大于约D1 / 7且小于约D1 / 2.4，其中D1是透镜的直径。

公开(公告)号：US20130049917A1

公开(公告)日：2013-02-28

申请号：US13596606

申请日：2012-08-28

申请人： Yong Suk KIM ,  Sung Kwon Wi ,  Sang Moon Lee ,  Young Seuck Yoo ,  Jeong Bok Kwak

发明人： Yong Suk KIM ,  Sung Kwon Wi ,  Sang Moon Lee ,  Young Seuck Yoo ,  Jeong Bok Kwak

IPC分类号： H01F5/00

CPC分类号： H01F17/0006 ,  H01F41/041 ,  H01F2017/0066 ,  H01F2017/0073

摘要： Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component.

摘要翻译： 这里公开了在磁性基板上形成为椭圆线圈形状的电子部件的导体图案，该导体图案包括：直部; 以及弯曲部分，其两侧连接到所述直线部分，其中所述弯曲部分的线宽小于所述直线部分的线宽度，以及包括所述弯曲部分的电子部件。 利用根据本发明的导体图案和包括它们的电子部件，可以实现高精度细线宽度和高分辨率导体图案以改善连接性，从而提高电子部件的特性和可靠性。

公开(公告)号：US20090136179A1

公开(公告)日：2009-05-28

申请号：US12359842

申请日：2009-01-26

申请人： Yong Suk KIM ,  Hoon HUR

发明人： Yong Suk KIM ,  Hoon HUR

IPC分类号： G02B6/00 ,  H01L21/00

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/2704 ,  B29C2045/14327 ,  B29L2031/3475 ,  B29L2031/747 ,  H01L33/52

摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

摘要翻译： 公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装 。 发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

公开(公告)号：US20080211987A1

公开(公告)日：2008-09-04

申请号：US11862084

申请日：2007-09-26

申请人： Yong Suk KIM ,  Hoon Hurh ,  Geun Ho Kim

发明人： Yong Suk KIM ,  Hoon Hurh ,  Geun Ho Kim

IPC分类号： G02F1/1335 ,  F21V17/00

CPC分类号： H05K1/142 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446

摘要： A backlight unit including a circuit board mounted with light emitting diodes and formed with connecting pads electrically connected with the light emitting diodes, a driver installed on one surface of the circuit board and configured to drive the light emitting diodes, a connector coupled to the connecting pads of the circuit board, in which the connector has a connecting direction changed toward the driver, and a connecting line for connecting the connector to the driver.

摘要翻译： 一种背光单元，包括安装有发光二极管并形成有与发光二极管电连接的连接焊盘的电路板，安装在电路板的一个表面上并被配置为驱动发光二极管的驱动器，连接器连接到连接 电路板的焊盘，其中连接器具有朝向驱动器的连接方向，以及用于将连接器连接到驱动器的连接线。