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公开(公告)号：US09966514B2
公开(公告)日：2018-05-08
申请号：US15192993
申请日：2016-06-24
Inventor： Chen-Ke Hsu , Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang , Chenjie Liao , Chih-Wei Chao , Qiuxia Lin
CPC classification number: H01L33/60 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2924/18162 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091
Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.
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Patent Agency Ranking
公开(公告)号：USD768095S1
公开(公告)日：2016-10-04
申请号：US29541826
申请日：2015-10-08
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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公开(公告)号：USD761215S1
公开(公告)日：2016-07-12
申请号：US29526628
申请日：2015-05-12
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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公开(公告)号：US10367126B2
公开(公告)日：2019-07-30
申请号：US14725822
申请日：2015-05-29
Inventor： Junpeng Shi , Pei-Song Cai , Hao Huang , Zhenduan Lin , Chih-Wei Chao , Chen-Ke Hsu
IPC: H01L33/00 , H01L33/62 , H01L33/60 , H01L33/64 , H01L25/075
Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.
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公开(公告)号：US11217732B2
公开(公告)日：2022-01-04
申请号：US16810523
申请日：2020-03-05
Inventor： Senpeng Huang , Junpeng Shi , Weng-Tack Wong , Shunyi Chen , Zhenduan Lin , Chih-Wei Chao , Chen-Ke Hsu
Abstract: The present invention provides a white light LED package structure and a white light source system, which includes a substrate, an LED chip, and a wavelength conversion material layer. The peak emission wavelength of the LED chip is between 400 nm and 425 nm; the peak emission wavelength of the wavelength conversion material layer is between 440 nm and 700 nm, and the wavelength conversion material layer absorbs light emitted from the LED chip and emits a white light source; and the emission spectrum of the white light source is set as P(λ), the emission spectrum of a blackbody radiation having the same color temperature as the white light source is S(λ), P(λmax) is the maximum light intensity within 380-780 nm, S(λmax) is the maximum light intensity of the blackbody radiation within 380-780 nm, D(λ) is a difference between the spectrum of the white light LED and the spectrum of the blackbody radiation, and within 510-610 nm, the white light source satisfies: D(λ)=P(λ)/P(λmax)−S(W)/S(λmax), −0.15
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公开(公告)号：USD756942S1
公开(公告)日：2016-05-24
申请号：US29526620
申请日：2015-05-12
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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