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公开(公告)号：US09966514B2
公开(公告)日：2018-05-08
申请号：US15192993
申请日：2016-06-24
Inventor： Chen-Ke Hsu , Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang , Chenjie Liao , Chih-Wei Chao , Qiuxia Lin
CPC classification number: H01L33/60 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2924/18162 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091
Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.
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公开(公告)号：US10367126B2
公开(公告)日：2019-07-30
申请号：US14725822
申请日：2015-05-29
Inventor： Junpeng Shi , Pei-Song Cai , Hao Huang , Zhenduan Lin , Chih-Wei Chao , Chen-Ke Hsu
IPC: H01L33/00 , H01L33/62 , H01L33/60 , H01L33/64 , H01L25/075
Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.
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公开(公告)号：US09219194B2
公开(公告)日：2015-12-22
申请号：US14588087
申请日：2014-12-31
Inventor： Junpeng Shi , Jiali Zhuo , Lixun Yang , Shaohua Huang
CPC classification number: H01L33/145 , H01L33/0079 , H01L33/385 , H01L33/405 , H01L33/46 , H01L2933/0016 , H01L2933/0025
Abstract: A flip-chip LED includes a substrate, having a surface with a p-region metal portion and an n-region metal portion separated from each other; a p-type epitaxial layer, an active layer and an n-type epitaxial layer successively laminated on the substrate; a reflection layer between the substrate and the p-type epitaxial layer; a current blocking layer between the reflection layer and the p-type epitaxial layer and positioned to prevent the current from concentrating on the edge of the LED; an insulating protection layer cladding the LED side wall and exposing part of the side wall of the n-type epitaxial layer; a P electrode connecting the metal reflection layer and the p-region metal portion of the substrate; and an N electrode connecting the side wall of the n-type epitaxial layer and n-region metal portion of the substrate.
Abstract translation: 倒装LED包括具有p区域金属部分的表面和分离的n区域金属部分的基板; p型外延层，有源层和n型外延层，依次层压在基板上; 在所述衬底和所述p型外延层之间的反射层; 反射层和p型外延层之间的电流阻挡层，并被定位成防止电流集中在LED的边缘上; 绝缘保护层包覆LED侧壁并暴露n型外延层的侧壁的一部分; 连接所述金属反射层和所述基板的p区域金属部的P电极; 以及连接n型外延层的侧壁和基板的n区金属部分的N电极。
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公开(公告)号：US12002796B2
公开(公告)日：2024-06-04
申请号：US17804888
申请日：2022-06-01
Inventor： Shunyi Chen , Junpeng Shi , Weng-Tack Wong , Chen-ke Hsu , Chih-Wei Chao
CPC classification number: H01L25/167 , H01L33/483 , H01L33/60 , H01L33/62
Abstract: An LED device includes a substrate, a conductive layer, an LED chip, and a discharge element. The substrate has upper and lower surfaces and four edges interconnected to one another and surrounding the upper surface. The conductive layer is formed on the upper surface, and has first and second regions electrically separated by a trench. The trench has a first segment inclined relative to each edge of the substrate by a predetermined angle ranging between 0 and 90 degrees, and a second segment connected to the first segment. The LED chip is disposed across the first segment, and the discharge element is disposed across the second segment, both interconnecting the first and second regions.
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公开(公告)号：US11538965B2
公开(公告)日：2022-12-27
申请号：US16948441
申请日：2020-09-18
Inventor： Junpeng Shi , Zhen-Duan Lin , Chen-Ke Hsu , Ping Zhang
IPC: H01L33/50 , H01L25/075
Abstract: A light-emitting diode (LED) filament structure includes a substrate, an LED chip unit, a first chromic layer, and a light conversion layer. The LED chip unit is disposed on the substrate, and includes first and second LED chips emitting different excitation lights. The first chromic layer covers the first and second LED chips. The light conversion layer covers the LED chip unit and the first chromic layer. The first chromic layer is configured to transition between an inactivated state and an activated state to prevent or allow the excitation light from the first or second LED chips to pass therethrough, so as to excite the light conversion layer to emit different excited lights having different color temperatures.
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Patent Agency Ranking
公开(公告)号：US11271362B2
公开(公告)日：2022-03-08
申请号：US16831512
申请日：2020-03-26
Inventor： Hui Chen , Junpeng Shi , Xinglong Li , Chi-Wei Liao , Weng-Tack Wong , Chih-Wei Chao , Chen-ke Hsu
IPC: H01S5/00 , H01S5/024 , H01S5/06 , H01S5/40 , H01S5/02255 , F21V7/00 , H01S5/02208
Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.
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公开(公告)号：USD768095S1
公开(公告)日：2016-10-04
申请号：US29541826
申请日：2015-10-08
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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公开(公告)号：US11217732B2
公开(公告)日：2022-01-04
申请号：US16810523
申请日：2020-03-05
Inventor： Senpeng Huang , Junpeng Shi , Weng-Tack Wong , Shunyi Chen , Zhenduan Lin , Chih-Wei Chao , Chen-Ke Hsu
Abstract: The present invention provides a white light LED package structure and a white light source system, which includes a substrate, an LED chip, and a wavelength conversion material layer. The peak emission wavelength of the LED chip is between 400 nm and 425 nm; the peak emission wavelength of the wavelength conversion material layer is between 440 nm and 700 nm, and the wavelength conversion material layer absorbs light emitted from the LED chip and emits a white light source; and the emission spectrum of the white light source is set as P(λ), the emission spectrum of a blackbody radiation having the same color temperature as the white light source is S(λ), P(λmax) is the maximum light intensity within 380-780 nm, S(λmax) is the maximum light intensity of the blackbody radiation within 380-780 nm, D(λ) is a difference between the spectrum of the white light LED and the spectrum of the blackbody radiation, and within 510-610 nm, the white light source satisfies: D(λ)=P(λ)/P(λmax)−S(W)/S(λmax), −0.15
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公开(公告)号：USD756942S1
公开(公告)日：2016-05-24
申请号：US29526620
申请日：2015-05-12
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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公开(公告)号：US12080989B2
公开(公告)日：2024-09-03
申请号：US18232919
申请日：2023-08-11
Inventor： Hui Chen , Junpeng Shi , Xinglong Li , Chi-Wei Liao , Weng-Tack Wong , Chih-Wei Chao , Chen-ke Hsu
IPC: H01S5/00 , H01S5/02255 , H01S5/024 , H01S5/06 , H01S5/40 , F21V7/00 , H01S5/02208
CPC classification number: H01S5/0087 , H01S5/02255 , H01S5/02461 , H01S5/0609 , H01S5/4012 , F21V7/0008 , H01S5/02208 , H01S5/02469 , H01S5/4056
Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.
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