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    ETCHING DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING SAME
    1.
    发明申请
    ETCHING DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING SAME 有权
    蚀刻装置和使用其制造印刷电路板的方法

    公开(公告)号：US20120031873A1

    公开(公告)日：2012-02-09

    申请号：US13087390

    申请日：2011-04-15

    Applicant: YAO-WEN BAI

    Inventor： YAO-WEN BAI

    IPC: H05K3/22 ,  C23F1/08

    CPC classification number: H05K3/429 ,  H05K1/0251 ,  H05K3/0088 ,  H05K3/068 ,  H05K2203/0763

    Abstract: In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed.

    Abstract translation: 在制造印刷电路板的方法中，提供了包括多个电镀通孔（PTH）的基板。 每个PTH具有在其内壁上电镀的导电层，并且包括电连接部分和短截线。 在与基座相邻的基板的表面上形成保护层。 提供了一种蚀刻装置，包括对应于PTH的上板和多个喷管。 每个喷射管包括超过上板的突出部分。 衬底被布置成使得保护层与上板接触并且突出部分被接收在短截线中。 之后，突出部分喷涂蚀刻剂以蚀刻并去除短截线的导电层，并且去除保护层。

    METHOD FOR FORMING ELECTRICAL TRACES ON SUBSTRATE
    4.
    发明申请
    METHOD FOR FORMING ELECTRICAL TRACES ON SUBSTRATE 有权
    在基板上形成电路的方法

    公开(公告)号：US20100129532A1

    公开(公告)日：2010-05-27

    申请号：US12570040

    申请日：2009-09-30

    Applicant: YAO-WEN BAI ,  CHENG-HSIEN LIN

    Inventor： YAO-WEN BAI ,  CHENG-HSIEN LIN

    IPC: B05D5/12

    CPC classification number: H05K3/105 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/44 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/125

    Abstract: A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces.

    Abstract translation: 在衬底上形成电迹线的方法包括以下步骤：提供衬底; 在基板上使用油墨印刷油墨图案，所述油墨包括含有银离子的水性介质和热敏还原剂; 加热油墨图案以将银离子还原成银颗粒，从而形成半成品痕迹; 并通过化学镀在半成品迹线上形成金属外涂层，从而获得图案化的电迹线。

    METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH THICK TRACES
    5.
    发明申请
    METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH THICK TRACES 有权
    用于制造具有厚度线的印刷电路板的方法

    公开(公告)号：US20110215069A1

    公开(公告)日：2011-09-08

    申请号：US12853304

    申请日：2010-08-10

    Applicant: YAO-WEN BAI ,  PAN TANG ,  XIAO-PING LI

    Inventor： YAO-WEN BAI ,  PAN TANG ,  XIAO-PING LI

    IPC: H05K3/00

    CPC classification number: H05K3/00

    Abstract: A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern.

    Abstract translation: 制造印刷电路板的方法包括以下步骤。 提供了包括与第一表面相对的第一表面和第二表面的第一导电层。 直接形成在第二表面上的多个第一迹线。 第一绝缘层形成在第一导电层的第二表面和第一迹线的表面上。 蚀刻导电层以形成多个第二迹线，第二迹线叠加第一迹线，第一迹线和第二迹线构成电路图案。

    METHOD OF FORMING ELECTRICAL TRACES
    6.
    发明申请
    METHOD OF FORMING ELECTRICAL TRACES 审中-公开
    形成电路的方法

    公开(公告)号：US20100021652A1

    公开(公告)日：2010-01-28

    申请号：US12494279

    申请日：2009-06-30

    Applicant: CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

    Inventor： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

    IPC: B05D3/06

    CPC classification number: H05K3/185 ,  H05K3/105 ,  H05K2203/013 ,  H05K2203/125

    Abstract: A method of forming electrical traces includes the steps of: providing a substrate; printing an ink pattern using a silver containing ink on the substrate, the ink comprising an aqueous carrier medium having dissolved therein a water-soluble light sensitive silver salt; irradiating the ink pattern to reduce silver salt therein to silver particles thereby forming an underlayer; and electroless plating a metal overcoat layer on the underlayer thereby obtaining electrical traces.

    Abstract translation: 形成电迹线的方法包括以下步骤：提供衬底; 在基材上使用含银墨水印刷油墨图案，该油墨包含其中溶解有水溶性光敏银盐的水性载体介质; 照射油墨图案以将其中的银盐还原成银颗粒，从而形成底层; 并在底层上无电镀覆金属外涂层，从而获得电迹线。

    ELECTROPLATING METHOD
    8.
    发明申请
    ELECTROPLATING METHOD 失效
    电镀方法

    公开(公告)号：US20090159452A1

    公开(公告)日：2009-06-25

    申请号：US12164429

    申请日：2008-06-30

    Applicant: SHING-TZA LIOU ,  YAO-WEN BAI ,  RUI ZHANG ,  QIU-YUE ZHANG

    Inventor： SHING-TZA LIOU ,  YAO-WEN BAI ,  RUI ZHANG ,  QIU-YUE ZHANG

    IPC: C25D5/02

    CPC classification number: C25D5/54 ,  C25D5/02 ,  C25D5/56

    Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.

    Abstract translation: 电镀方法包括以下步骤：提供具有连接到第一部分的第一部分和第二部分的基板; 在所述第二部分的表面上形成金属层; 将基板的第一部分浸入电解液中，向金属层施加电流以用金属层电镀基板的第一部分; 以及在电镀所述基板的第一部分期间沿着远离所述电解质溶液的方向移动所述基板。 该方法可以提高所得镀层的均匀性。

    PRINTED CIRCUIT BOARD WITH CARBON NANOTUBE BUNDLE
    9.
    发明申请
    PRINTED CIRCUIT BOARD WITH CARBON NANOTUBE BUNDLE 审中-公开
    印刷电路板与碳纳米管组件

    公开(公告)号：US20110186339A1

    公开(公告)日：2011-08-04

    申请号：US12795839

    申请日：2010-06-08

    Applicant: YAO-WEN BAI ,  PAN TANG ,  XIAO-PING LI

    Inventor： YAO-WEN BAI ,  PAN TANG ,  XIAO-PING LI

    IPC: H05K1/00

    CPC classification number: H05K1/00

    Abstract: A printed circuit board includes a composite layer, a first electrically conductive pattern, and a second electrically conductive pattern. The composite layer includes a polymer matrix and an electrically conductive pin embedded therein. The polymer matrix has a first surface and an opposite second surface. The pin includes a catalyst block and a carbon nanotube bundle grown on the catalyst block. The catalyst block is exposed at the first surface, and the carbon nanotube bundle is exposed at the second surface. The first pattern is formed on the first surface, and includes a first electrical contact, which is electrically coupled to the catalyst block. The second pattern is formed on the second surface, and includes a second electrical contact, which is electrically coupled to the carbon nanotube bundle.

    Abstract translation: 印刷电路板包括复合层，第一导电图案和第二导电图案。 复合层包括聚合物基质和嵌入其中的导电针。 聚合物基质具有第一表面和相对的第二表面。 该销包括在催化剂块上生长的催化剂嵌段和碳纳米管束。 催化剂块在第一表面露出，碳纳米管束在第二表面露出。 第一图案形成在第一表面上，并且包括电耦合到催化剂块的第一电接触。 第二图案形成在第二表面上，并且包括电耦合到碳纳米管束的第二电接触。

    METHOD OF FORMING ELECTRICAL TRACES ON SUBSTRATE
    10.
    发明申请
    METHOD OF FORMING ELECTRICAL TRACES ON SUBSTRATE 审中-公开
    在基板上形成电路的方法

    公开(公告)号：US20100021653A1

    公开(公告)日：2010-01-28

    申请号：US12330577

    申请日：2008-12-09

    Applicant: CHENG-HSIEN LIN ,  YAO-WEN BAI ,  QIU-YUE ZHANG ,  RUI ZHANG

    Inventor： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  QIU-YUE ZHANG ,  RUI ZHANG

    IPC: C08J7/18

    CPC classification number: H05K3/105 ,  H05K3/106 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/125

    Abstract: An exemplary method for forming electrical traces on a substrate includes flowing steps. Firstly, a circuit pattern is formed on the substrate by printing a silver ions-containing ink. The ink comprises an aqueous carrier medium, and a silver halide emulsion soluble in the aqueous carrier medium. Secondly, an irradiation ray irradiates the circuit pattern to reduce the silver ions into silver to form a silver particle circuit pattern comprised of silver particles. Thirdly, a metal overcoat layer is electroless-plated on the silver particle circuit pattern thereby obtaining electrical traces.

    Abstract translation: 在衬底上形成电迹线的示例性方法包括流动步骤。 首先，通过印刷含银离子的油墨在基板上形成电路图案。 油墨包含水性载体介质和可溶于载体介质的卤化银乳剂。 其次，照射线照射电路图案，将银离子还原为银，形成由银粒子构成的银粒子电路图案。 第三，将金属覆盖层无电镀在银粒子电路图案上，从而获得电迹线。

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