公开(公告)号：US5091282A

公开(公告)日：1992-02-25

申请号：US504300

申请日：1990-04-03

申请人： Yasunobu Onishi ,  Hirokazu Niki ,  Yoshihito Kobayashi ,  Rumiko Hayase ,  Toru Ushirogouchi

发明人： Yasunobu Onishi ,  Hirokazu Niki ,  Yoshihito Kobayashi ,  Rumiko Hayase ,  Toru Ushirogouchi

IPC分类号： G03F7/004 ,  G03F7/038 ,  G03F7/075

CPC分类号： G03F7/0757 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0755 ,  G03F7/0758 ,  Y10S430/124 ,  Y10S430/125

摘要： This invention includes a photosensitive composition containing an alkali-soluble resin and a compound represented by formula (I), (II) or (III) described in the claims and the specification, a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (IV) described in the claims and the specification and a basic compound, and a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (VI) described in the claims and the specification and a compound which produces an acid upon radiation of light. A pattern formation method using these photosensitive compositions includes the steps of dissolving any one of the above photosensitive compositions in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, and developing the exposed resin layer with an aqueous alkaline solution. When the first or second photosensitive composition is used, a good pattern can also be formed by a method including the steps of dissolving either the first or second photosensitive composition in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, heating the pattern-exposed resin layer, exposing the entire surface of the heated resin layer, and developing the entirely exposed resin layer with an aqueous alkaline solution.

公开(公告)号：USRE35821E

公开(公告)日：1998-06-09

申请号：US639973

申请日：1996-04-29

申请人： Hirokazu Niki ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Akitoshi Kumagae ,  Kazuo Sato ,  Masataka Miyamura ,  Yoshihito Kobayashi

发明人： Hirokazu Niki ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Akitoshi Kumagae ,  Kazuo Sato ,  Masataka Miyamura ,  Yoshihito Kobayashi

IPC分类号： G03F7/26 ,  G03F7/004 ,  G03F7/039 ,  G03F7/09 ,  G03F7/11 ,  G03F7/38 ,  H01L21/027 ,  G03C5/00

CPC分类号： G03F7/09 ,  G03F7/11 ,  G03F7/0045

摘要： A radiation-sensitive layer comprising as a main component a radiation-sensitive composition containing a compound capable of generating an acid when exposed to a chemical radiation and a compound having at least one linkage decomposable by an acid is formed on a substrate. An acidic coating layer is formed on the radiation-sensitive layer. The radiation-sensitive layer and the acidic coating layer are pattern-exposed to a chemical radiation. The radiation-sensitive layer and the acidic coating layer are baked and developed by using an aqueous alkaline solution to obtain a pattern comprising lines and spaces, each having a predetermined width. A fine pattern of a rectangular sectional shape can be formed without producing eaves caused by a surface inhibition layer layer, which is produced on the film surface.

摘要翻译： 一种辐射敏感层，其包含作为主要成分的含有当暴露于化学辐射时能够产生酸的化合物的辐射敏感性组合物和具有至少一个可被酸分解的键的化合物。 在辐射敏感层上形成酸性涂层。 辐射敏感层和酸性涂层图案暴露于化学辐射。 通过使用碱性水溶液来烘烤和显影辐射敏感层和酸性涂层，以获得每个具有预定宽度的线和间隔的图案。 可以形成矩形截面形状的精细图案，而不会在膜表面上产生由表面抑制层形成的檐。

公开(公告)号：US5580702A

公开(公告)日：1996-12-03

申请号：US357179

申请日：1994-12-13

申请人： Rumiko Hayase ,  Yasunobu Onishi ,  Hirokazu Niki ,  Noahiko Oyasato ,  Yoshihito Kobayashi ,  Shuzi Nayase

发明人： Rumiko Hayase ,  Yasunobu Onishi ,  Hirokazu Niki ,  Noahiko Oyasato ,  Yoshihito Kobayashi ,  Shuzi Nayase

IPC分类号： G03F7/023 ,  G03F7/039 ,  G03F7/30

CPC分类号： G03F7/0233 ,  G03F7/0392 ,  Y10S430/111 ,  Y10S430/146

摘要： Disclosed herein is a resist for forming patterns, which is greatly sensitive to ultraviolet rays an ionizing radiation, and which can therefore form a high-resolution resist pattern if exposed to ultra violet rays or an unionizing radiation. Hence, the resist is useful in a method of manufacturing semicon ductor devices having high integration densities. The resist comprises tert-butoxycarbonyl methoxypolyhydroxy styrene and an o-quinonediazide compound.

摘要翻译： 本文公开了用于形成图案的抗蚀剂，其对于紫外线对电离辐射非常敏感，并且因此如果暴露于紫外线或组合辐射则可形成高分辨率抗蚀剂图案。 因此，抗蚀剂可用于制造具有高积分密度的半导体器件的方法。 抗蚀剂包括叔丁氧基羰基甲氧基聚羟基苯乙烯和邻醌二叠氮化合物。

公开(公告)号：US5403695A

公开(公告)日：1995-04-04

申请号：US876457

申请日：1992-04-30

申请人： Rumiko Hayase ,  Yasunobu Onishi ,  Hirokazu Niki ,  Naohiko Oyasato ,  Yoshihito Kobayashi ,  Shuzi Hayase

发明人： Rumiko Hayase ,  Yasunobu Onishi ,  Hirokazu Niki ,  Naohiko Oyasato ,  Yoshihito Kobayashi ,  Shuzi Hayase

IPC分类号： G03F7/023 ,  G03F7/039 ,  G03F7/30

CPC分类号： G03F7/0233 ,  G03F7/0392 ,  Y10S430/111 ,  Y10S430/146

摘要： Disclosed herein is a resist for forming patterns, which is greatly sensitive to ultraviolet rays an ionizing radiation, and which can therefore form a high-resolution resist pattern if exposed to ultra violet rays or an unionizing radiation. Hence, the resist is useful in a method of manufacturing semicon ductor devices having high integration densities. The resist comprises tert-butoxycarbonyl methoxypolyhydroxy styrene and an o-quinonediazide compound.

摘要翻译： 本文公开了用于形成图案的抗蚀剂，其对于紫外线对电离辐射非常敏感，并且因此如果暴露于紫外线或组合辐射则可形成高分辨率抗蚀剂图案。 因此，抗蚀剂可用于制造具有高积分密度的半导体器件的方法。 抗蚀剂包括叔丁氧基羰基甲氧基聚羟基苯乙烯和邻醌二叠氮化合物。

公开(公告)号：US5326675A

公开(公告)日：1994-07-05

申请号：US987821

申请日：1992-12-09

申请人： Hirokazu Niki ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Akitoshi Kumagae ,  Kazuo Sato ,  Masataka Miyamura ,  Yoshihito Kobayashi

发明人： Hirokazu Niki ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Akitoshi Kumagae ,  Kazuo Sato ,  Masataka Miyamura ,  Yoshihito Kobayashi

IPC分类号： G03F7/26 ,  G03F7/004 ,  G03F7/039 ,  G03F7/09 ,  G03F7/11 ,  G03F7/38 ,  H01L21/027 ,  G03C5/00

CPC分类号： G03F7/09 ,  G03F7/11 ,  G03F7/0045

摘要： A radiation-sensitive layer comprising as a main component a radiation-sensitive composition containing a compound capable of generating an acid when exposed to a chemical radiation and a compound having at least one linkage decomposable by an acid is formed on a substrate. An acidic coating layer is formed on the radiation-sensitive layer. The radiation-sensitive layer and the acidic coating layer are pattern-exposed to a chemical radiation. The radiation-sensitive layer and the acidic coating layer are baked and developed by using an aqueous alkaline solution to obtain a pattern comprising lines and spaces, each having a predetermined width. A fine pattern of a rectangular sectional shape can be formed without producing eaves caused by a surface inhibition layer layer, which is produced on the film surface.

摘要翻译： 一种辐射敏感层，其包含作为主要成分的含有当暴露于化学辐射时能够产生酸的化合物的辐射敏感性组合物和具有至少一个可被酸分解的键的化合物。 在辐射敏感层上形成酸性涂层。 辐射敏感层和酸性涂层图案暴露于化学辐射。 通过使用碱性水溶液来烘烤和显影辐射敏感层和酸性涂层，以获得每个具有预定宽度的线和间隔的图案。 可以形成矩形截面形状的精细图案，而不会产生由在膜表面上产生的表面抑制层而引起的檐。

公开(公告)号：US5100768A

公开(公告)日：1992-03-31

申请号：US519397

申请日：1990-05-04

申请人： Hirokazu Niki ,  Yasunobu Onishi ,  Yoshihito Kobayashi ,  Rumiko Hayase

发明人： Hirokazu Niki ,  Yasunobu Onishi ,  Yoshihito Kobayashi ,  Rumiko Hayase

IPC分类号： G03F7/004

CPC分类号： G03F7/0045

摘要： A photosensitive composition contains an alkali-soluble polymer having a phenol skeleton in its structure and a heterocyclic compound represented by formula (I-1) or (I-2), formula (II-1) or (II-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) described in the claims and specification. A photosensitive composition containing a heterocyclic compound represented by formula (I-1) or (I-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) can be suitably used as a negative resist. A photosensitive composition containing a heterocyclic compound represented by formula (II-1) or (II-2) can be suitably used as a positive resist. A photosensitive composition containing an alkali-soluble polymer having a phenol skeleton in its structure and a polymer having a nitrogen-containing heterocyclic compound as a polymeric unit is also included in this invention. The latter photosensitive composition can further contain a heterocyclic compound represented by any of formulas (VI-1) to (VI-15) described in the claims and specification.

公开(公告)号：US5658706A

公开(公告)日：1997-08-19

申请号：US302319

申请日：1994-09-08

申请人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

发明人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

IPC分类号： C08K5/16 ,  C08L25/00 ,  C08L25/18 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

CPC分类号： G03F7/0045 ,  G03F7/039 ,  Y10S430/111

摘要： A resist composition for forming a pattern, which comprises (a) a compound represented by the following formula (1) and satisfying the following inequalities, ##STR1## wherein R.sup.1 is hydrogen atom or methyl group, R.sup.2 is a monovalent organic group, m is 0 or a positive integer, n is a positive integer, and m and n satisfying a condition of 0.03.ltoreq.n/(m+n).ltoreq.1, (b) a compound capable of generating an acid when irradiated with light, and (c) a nitrogen-containing compound, wherein a weight-average molecular weight, Mw and a number-average molecular weight, Mn satisfy the following inequality, 4,000.ltoreq.Mw.ltoreq.50,000, 1.10.ltoreq.Mw/Mn.ltoreq.2.50 (Mw and Mn respectively represent value converted in styrene).

摘要翻译： 用于形成图案的抗蚀剂组合物，其包含（a）由下式（1）表示的化合物并满足以下不等式，其中R 1是氢原子或甲基，R 2是一价有机基团 基团，m为0或正整数，n为正整数，m和n满足0.03≤n/（m + n）≤1的条件，（b）能够产生酸的化合物 当用光照射时，和（c）含氮化合物，其中重均分子量Mw和数均分子量Mn满足以下不等式：4,000

公开(公告)号：US5744281A

公开(公告)日：1998-04-28

申请号：US848747

申请日：1997-05-01

申请人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

发明人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

IPC分类号： G03F7/004 ,  G03F7/039

CPC分类号： G03F7/039 ,  G03F7/0045 ,  Y10S430/111

摘要： A resist composition for forming a pattern, which comprises (a) a compound represented by the following formula (1) and satisfying the following inequalities, ##STR1## wherein R.sup.1 is hydrogen atom or methyl group, R.sup.2 is a monovalent organic group, m is 0 or a positive integer, n is a positive integer, and m and n satisfying a condition of 0.03.ltoreq.n/(m+n).ltoreq.1, (b) a compound capable of generating an acid when irradiated with light, and (c) 4-phenylpyridine, wherein a weight-average molecular weight, Mw and a number-average molecular weight, Mn satisfy the following inequality, 4,000.ltoreq.Mw.ltoreq.50,000, 1.10.ltoreq.Mw/Mn.ltoreq.2.50 (Mw and Mn respectively represent value converted in styrene).

摘要翻译： 用于形成图案的抗蚀剂组合物，其包含（a）由下式（1）表示的化合物并满足以下不等式，其中R 1是氢原子或甲基，R 2是一价有机基团 基团，m为0或正整数，n为正整数，m和n满足0.03≤n/（m + n）≤1的条件，（b）能够产生酸的化合物 当用光照射时，和（c）4-苯基吡啶，其中重均分子量Mw和数均分子量Mn满足以下不等式：4,000

公开(公告)号：US5279921A

公开(公告)日：1994-01-18

申请号：US799320

申请日：1991-11-27

申请人： Yasunobu Onishi ,  Yoshihito Kobayashi ,  Hirokazu Niki

发明人： Yasunobu Onishi ,  Yoshihito Kobayashi ,  Hirokazu Niki

IPC分类号： C08K5/41 ,  C08K5/42 ,  C08L101/00 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027 ,  G03C1/73

CPC分类号： G03F7/0045 ,  Y10S430/122 ,  Y10S430/124

摘要： Disclosed is a pattern formation resist which can be exposed with deep UV, has a high dry etching resistance, has a large allowance in a development manipulation using an aqueous alkali solution, and can form a fine pattern having a good sectional shape. The resist comprises an alkali-soluble polymer and a compound represented by the following formula (I) and simultaneously containing, in a single molecule, a substituent which decomposes with an acid and a group which produces an acid with deep UV: ##STR1## wherein the substituent which decomposes with an acid is present in at least one of R.sub.1 to R.sub.4, and when R.sub.1 to R.sub.4 have a group except for the substituent which decomposes with an acid, R.sub.1 represents a nonsubstituted or substituted aliphatic hydrocarbon group, each of R.sub.2 and R.sub.3 independently represents a hydrogen atom or a non-substituted or substituted aliphatic hydrocarbon group, and R.sub.4 represents a nonsubstituted or substituted aliphatic hydrocarbon group.

摘要翻译： 公开了一种图案形成抗蚀剂，其可以用深紫外线曝光，具有高的耐干蚀刻性，在使用碱性水溶液的显影操作中具有大的余量，并且可以形成具有良好截面形状的精细图案。 抗蚀剂包含碱溶性聚合物和由下式（I）表示的化合物，并且在单分子中同时含有与酸分解的取代基和产生具有深UV的酸的基团：（*化学结构 *）（I）其中与酸分解的取代基存在于R 1至R 4中的至少一个中，并且当R 1至R 4具有除了与酸分解的取代基之外的基团时，R 1表示非取代或取代的脂族烃 基团，R2和R3各自独立地表示氢原子或未取代或取代的脂族烃基，R4表示非取代或取代的脂族烃基。

公开(公告)号：USRE38256E1

公开(公告)日：2003-09-23

申请号：US09448977

申请日：1999-11-24

申请人： Toru Ushirogouchi ,  Naomi Shida ,  Takuya Naito ,  Koji Asakawa ,  Akinori Hongu ,  Makoto Nakase ,  Hirokazu Niki

发明人： Toru Ushirogouchi ,  Naomi Shida ,  Takuya Naito ,  Koji Asakawa ,  Akinori Hongu ,  Makoto Nakase ,  Hirokazu Niki

IPC分类号： G03F7021

CPC分类号： G03F7/039 ,  G03F7/0045 ,  G03F7/0215 ,  G03F7/038 ,  Y10S430/107 ,  Y10S430/11 ,  Y10S430/111

摘要： Disclosed are a safe slurry photosensitive composition superior in image formation capabilities such as resolution and sensitivity and containing no harmful compound, and a safe water-soluble photosensitive composition capable of being dissolved in water without using any organic solvent while maintaining a sufficient sensitivity as a resist and containing no harmful substance. The slurry photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, at least one type of a resin with acid-crosslinkability or acid-decomposability, and a powder. Various devices can be manufactured by forming a layer of this photosensitive composition on a substrate, exposing the layer to light in accordance with a desired pattern, and heating the layer. The water-soluble photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, and an acetal resin. This water-soluble photosensitive composition is coated on a substrate and irradiated with light or ionizing radiation in accordance with a desired pattern. The resultant substrate is chemically amplified by heating and developed with water. This makes it possible to safely form a pattern without using any ventilator.