公开(公告)号：US20090029161A1

公开(公告)日：2009-01-29

申请号：US12219064

申请日：2008-07-15

申请人： Yasunori Karasawa ,  Mikihiro Kashio ,  Masahito Nakabayashi ,  Mamoru Kobayashi

发明人： Yasunori Karasawa ,  Mikihiro Kashio ,  Masahito Nakabayashi ,  Mamoru Kobayashi

IPC分类号： B32B27/36 ,  C08F120/18

CPC分类号： C08F220/34 ,  C09J7/385 ,  C09J2201/606 ,  C09J2433/00 ,  Y10T428/2891

摘要： The present inventions are a pressure-sensitive adhesive composition comprising a poly(meth)acrylate compound that contains a repeating unit shown by the following formula (1) in its molecule and has a melting point of 50° C. or less; a pressure-sensitive adhesive layer comprising a crosslinked product of the pressure-sensitive adhesive composition; and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer and a support, the pressure-sensitive adhesive layer being provided on one side or both sides of the support material. wherein X+ and Y− represent a combination of a counter cation and a counter anion which may form an ion pair, R represents a hydrogen atom or a methyl group, and A represents a linking group.

摘要翻译： 本发明是一种压敏粘合剂组合物，其包含在分子中含有下式（1）所示的重复单元且熔点为50℃以下的聚（甲基）丙烯酸酯化合物; 包含所述压敏粘合剂组合物的交联产物的压敏粘合剂层; 以及包含所述压敏粘合剂层和支持体的压敏粘合片，所述压敏粘合剂层设置在所述支撑材料的一侧或两侧。 其中X +和Y-表示可形成离子对的抗衡阳离子和抗衡阴离子的组合，R表示氢原子或甲基，A表示连接基团。

公开(公告)号：US20100003481A1

公开(公告)日：2010-01-07

申请号：US12448150

申请日：2007-12-20

申请人： Masahito Nakabayashi ,  Tatsuo Fukuda ,  Yasunori Karasawa ,  Naofumi Izumi

发明人： Masahito Nakabayashi ,  Tatsuo Fukuda ,  Yasunori Karasawa ,  Naofumi Izumi

IPC分类号： B32B17/10 ,  B32B7/02

CPC分类号： H01L51/0096 ,  G02F1/1333 ,  G02F1/133345 ,  G02F2202/28 ,  H01L29/78603 ,  Y02E10/549 ,  Y10T428/24959 ,  Y10T428/269

摘要： (1) A display substrate for embedding pixel-controlling elements comprising an adhesive layer and a thermoplastic film having a thickness of 50 to 500 μm which are laminated successively to a base plate successively in this order, wherein a storage modulus (E′) of the adhesive layer is 1.0×106 Pa or greater at 100 to 200° C., and (2) a display substrate for embedding pixel-controlling elements comprising an adhesive layer, a gas barrier layer and a thermoplastic film having a thickness of 50 to 500 pm which are laminated to a base plate successively in this order, wherein a storage modulus (E′) of the adhesive layer is 1.0×104 Pa or greater at 100 to 200° C., and a thickness of the gas barrier layer is 25 nm or greater. A pixel-controlling substrate in which pixel-controlling elements for controlling individual pixels for a display are embedded can be prepared with excellent quality using the display substrate.

摘要翻译： （1）一种嵌入像素控制元件的显示基板，其特征在于，具有粘合剂层和厚度为50〜500μm的热塑性膜，依次依次层叠到基板上，其中，储能模量（E'）为 粘合层在100〜200℃下为1.0×10 6 Pa以上，（2）用于嵌入像素控制元件的显示基板，包括粘合剂层，阻气层和厚度为50〜500的热塑性膜 pm，其依次层叠到基板上，其中在100至200℃下粘合剂层的储能模量（E'）为1.0×10 4 Pa以上，阻气层的厚度为25nm 或更大。 可以使用显示基板以优异的质量来制备其中嵌入用于控制用于显示器的各个像素的像素控制元件的像素控制基板。

公开(公告)号：US08716401B2

公开(公告)日：2014-05-06

申请号：US12625862

申请日：2009-11-25

申请人： Yasunori Karasawa ,  Isao Ichikawa

发明人： Yasunori Karasawa ,  Isao Ichikawa

IPC分类号： C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  H05K1/02

CPC分类号： C08G59/686 ,  C08G59/38 ,  C08K5/50 ,  C08K5/55 ,  C08L33/04 ,  C08L33/08 ,  C08L63/00 ,  C08L63/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J133/00 ,  C09J163/00 ,  C09J163/04 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

摘要翻译： 半导体芯片层叠体包括多个半导体芯片和层叠多个半导体芯片的粘合剂层，其中粘合剂层由包含丙烯酸类聚合物（A）的粘合剂组合物构成; 环氧树脂（B）; 热固化剂（C）; 和作为热固化促进剂的某些有机鏻化合物（D），相对于环氧树脂（B）和热固化剂（C）的总计100重量份，有机鏻化合物（D）的含量为0.001〜 15重量份。

公开(公告)号：US20100133703A1

公开(公告)日：2010-06-03

申请号：US12625862

申请日：2009-11-25

申请人： Yasunori Karasawa ,  Isao Ichikawa

发明人： Yasunori Karasawa ,  Isao Ichikawa

IPC分类号： H01L23/00 ,  C09J163/04 ,  B32B27/38

CPC分类号： C08G59/686 ,  C08G59/38 ,  C08K5/50 ,  C08K5/55 ,  C08L33/04 ,  C08L33/08 ,  C08L63/00 ,  C08L63/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J133/00 ,  C09J163/00 ,  C09J163/04 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organic phosphine compound (D) as a thermal curing accelerator, and the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

摘要翻译： 半导体芯片层叠体包括多个半导体芯片和层叠多个半导体芯片的粘合剂层，其中粘合剂层由包含丙烯酸类聚合物（A）的粘合剂组合物构成; 环氧树脂（B）; 热固化剂（C）; 和作为热固化促进剂的某些有机膦化合物（D），有机膦化合物（D）的含量相对于环氧树脂（B）和热固化剂（C）的总量相对于100重量份，为 0.001〜15重量份。

公开(公告)号：US08445092B2

公开(公告)日：2013-05-21

申请号：US12812932

申请日：2009-01-28

申请人： Yasunori Karasawa ,  Tatsuo Fukuda

发明人： Yasunori Karasawa ,  Tatsuo Fukuda

IPC分类号： H05K1/16 ,  C08L33/10

CPC分类号： H01L21/6835 ,  C08G18/6229 ,  C08G18/672 ,  C08G18/8116 ,  C09D175/04 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/145 ,  H01L24/19 ,  H01L24/20 ,  H01L24/31 ,  H01L24/82 ,  H01L24/83 ,  H01L24/96 ,  H01L2221/68359 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K1/032 ,  H05K1/185 ,  Y10T428/22 ,  Y10T428/24 ,  Y10T428/24008 ,  H01L2924/00 ,  H01L2924/3512

摘要： A resin sheet for circuit boards (2) obtained from a macromolecular material of the energy ray curable type and used for embedding circuit chips, which has a double bond concentration of 4.5 to 25 mmol/g before being cured by irradiation with an energy ray; a sheet for circuit boards including the resin sheet for circuit boards, one face of the resin sheet being formed on a support (1); and a circuit board for displays (5) which is obtained by embedding circuit chips (3) into a face of the resin sheet for circuit boards in the sheet for circuit boards, followed by curing the resin sheet by irradiation with an energy ray. The resin sheet for circuit boards (2) can be advantageously used for producing circuit boards having embedded circuit chips for controlling each pixel of displays, in particular, flat panel displays efficiently with excellent quality and productivity.

摘要翻译： 由能量射线固化型高分子材料得到的电路板用树脂片（2），用于在通过用能量射线照射固化之前具有4.5〜25mmol / g的双键浓度的电路芯片的嵌入电路芯片; 用于电路板的电路板，包括用于电路板的树脂片，树脂片的一个表面形成在支撑件（1）上; 以及通过将电路芯片（3）嵌入到用于电路板的电路板的电路板的表面中而获得的用于显示器（5）的电路板，然后通过用能量射线照射来固化树脂片。 用于电路板（2）的树脂片可以有利地用于制造具有嵌入式电路芯片的电路板，用于以优异的质量和生产率有效地控制显示器的每个像素，特别是平板显示器。

公开(公告)号：US20110048779A1

公开(公告)日：2011-03-03

申请号：US12812932

申请日：2009-01-28

申请人： Yasunori Karasawa ,  Tatsuo Fukuda

发明人： Yasunori Karasawa ,  Tatsuo Fukuda

IPC分类号： H05K1/16 ,  C08L33/10

CPC分类号： H01L21/6835 ,  C08G18/6229 ,  C08G18/672 ,  C08G18/8116 ,  C09D175/04 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/145 ,  H01L24/19 ,  H01L24/20 ,  H01L24/31 ,  H01L24/82 ,  H01L24/83 ,  H01L24/96 ,  H01L2221/68359 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K1/032 ,  H05K1/185 ,  Y10T428/22 ,  Y10T428/24 ,  Y10T428/24008 ,  H01L2924/00 ,  H01L2924/3512

摘要： A resin sheet for circuit boards (2) obtained from a macromolecular material of the energy ray curable type and used for embedding circuit chips, which has a double bond concentration of 4.5 to 25 mmol/g before being cured by irradiation with an energy ray; a sheet for circuit boards including the resin sheet for circuit boards, one face of the resin sheet being formed on a support (1); and a circuit board for displays (5) which is obtained by embedding circuit chips (3) into a face of the resin sheet for circuit boards in the sheet for circuit boards, followed by curing the resin sheet by irradiation with an energy ray. The resin sheet for circuit boards (2) can be advantageously used for producing circuit boards having embedded circuit chips for controlling each pixel of displays, in particular, flat panel displays efficiently with excellent quality and productivity.

摘要翻译： 由能量射线固化型高分子材料得到的电路板用树脂片（2），用于在通过用能量射线照射固化之前具有4.5〜25mmol / g的双键浓度的电路芯片的嵌入电路芯片; 用于电路板的电路板，包括用于电路板的树脂片，树脂片的一个表面形成在支撑件（1）上; 以及通过将电路芯片（3）嵌入到用于电路板的电路板的电路板的表面中而获得的用于显示器（5）的电路板，随后通过用能量射线照射来固化树脂片。 用于电路板（2）的树脂片可以有利地用于制造具有嵌入式电路芯片的电路板，用于以优异的质量和生产率有效地控制显示器的每个像素，特别是平板显示器。