摘要:
A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.
摘要:
A solid state imaging element including light receiving elements and microlenses is placed in a recess of a ceramic package. A black resin fills space between the ceramic package and the solid state imaging element.
摘要:
Provided is a solid-state image pickup device capable of suppressing deterioration of characteristic caused due to an antireflection film itself absorbing a light. In the solid-state image pickup device of the present invention, a plurality of color filters 8a, 8b, and 8c having spectral characteristics, respectively, different from each other are provided so as to correspond to a plurality of light reception sections 2, respectively, aligned on a semiconductor substrate 1. Further, a plurality of microlenses 10 are provided above the plurality of color filters 8a, 8b, and 8c, respectively. A plurality of antireflection films 11a are selectively formed on surfaces of the microlenses 10 provided above color filters 8b each having a predetermined spectral characteristic.
摘要:
Provided is a solid-state image pickup device capable of suppressing deterioration of characteristic caused due to an antireflection film itself absorbing a light. In the solid-state image pickup device of the present invention, a plurality of color filters 8a, 8b, and 8c having spectral characteristics, respectively, different from each other are provided so as to correspond to a plurality of light reception sections 2, respectively, aligned on a semiconductor substrate 1. Further, a plurality of microlenses 10 are provided above the plurality of color filters 8a, 8b, and 8c, respectively. A plurality of antireflection films 11a are selectively formed on surfaces of the microlenses 10 provided above color filters 8b each having a predetermined spectral characteristic.
摘要:
Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material of the reflection prevention coating onto microlenses of the solid-state imaging device. In the solid-state imaging device 1 according to the present invention, a barrier wall pattern 7 is formed, as a step alleviating structure, in dicing areas 5X formed between adjacent imaging areas 9. The barrier wall pattern 7 has a rectangular sectional form. With use of the barrier wall pattern 7 in the spincoating method, reflection prevention coating 8 is coated onto the microlenses 6 more evenly than in conventional cases.
摘要:
A light receiving region 21 and a floating diffusion region 22 are formed apart from each other in a semiconductor substrate 20 (S11), translucent adhesive 31 is applied to an area corresponding to the light receiving region 21 on the semiconductor substrate 20 (S22), and a translucent plate 30 is attached to the semiconductor substrate 20 on which the translucent adhesive 31 has been applied (S23). In this semiconductor manufacturing process, before the translucent adhesive 31 is applied, a dam member 24 is formed on the semiconductor substrate 20 so as to prevent the translucent adhesive 31 from flowing into an area corresponding to the floating diffusion region 22 on the semiconductor substrate 20 (S18).
摘要:
Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material of the reflection prevention coating onto microlenses of the solid-state imaging device. In the solid-state imaging device 1 according to the present invention, a barrier wall pattern 7 is formed, as a step alleviating structure, in dicing areas 5X formed between adjacent imaging areas 9. The barrier wall pattern 7 has a rectangular sectional form. With use of the barrier wall pattern 7 in the spincoating method, reflection prevention coating 8 is coated onto the microlenses 6 more evenly than in conventional cases.
摘要:
A memory controller receives an application identifier for identifying an application from an outside, an application, reference data to be referenced by the application, and a signature for the application and writes the application and the reference data. After receiving the application identifier from the outside, the memory controller accesses memory means which manages the application identifier and the application management state and reads out the management state of the target application. According to the management state, necessary data is decided. Since the judgment result is informed to the outside, there is no need of receiving applications more than necessary and it is possible to reduce the load on the signature process and the application reception process.
摘要:
An endoscope includes an operation portion side member, an insertion portion side member rotatable integrally with the insertion portion, an elastic member provided in one of the operation portion side member and the insertion portion side member, a frictional surface which is provided in the other of the operation portion side member and the insertion portion side member and which generates a frictional force between the frictional surface and the elastic member when the frictional surface is pressed onto the elastic member and the insertion portion is rotated, and a movement adjusting mechanism which relatively moves the operation portion side member and the insertion portion side member to continuously adjust press force acting between the elastic member and the frictional surface while deforming the elastic member.
摘要:
The present invention has as its objective to provide a display panel with silver electrodes without yellowing, and a method of producing such a display panel. After patterning and applying silver paste to form display electrodes on a substrate, glass paste is applied to form the dielectric layer, covering the electrodes, and both layers are simultaneously baked. Glass frit contained in the silver paste is chosen to have a lower softening point than die glass contained in the glass paste, and the baking process is divided into a first step, in which the baking temperature is equal to or higher than the softening point of the glass frit but lower than the softening point of the glass, and a second step, in which the baking temperature is higher than the softening point of the glass. This process allows a display panel to be produced with fewer bakings and reduced yellowing.