摘要:
The present invention provides an epoxy resin composition which can provide a cured composite product having a high heat resistance, and an excellent mechanical strength at a high temperature.The present invention provides an epoxy resin composition comprising, as essential components: (a) an epoxy resin; (b) a curing agent for epoxy resins, (c) a silane compound having at least one epoxy group or a group being capable of reacting by addition to an epoxy group in a molecule, and at least two alkoxy groups connected to silicone atom in a molecule, and (d) a catalyst for condensation polymerization of a silane compound, and a cured composite product obtained by curing the composition.
摘要:
An epoxy resin composition which can be crushed at an ordinary temperature and which comprises respective components described below,(a) 10 to 80 parts by weight of a 4,4'-biphenol type epoxy resin which is crystalline at an ordinary temperature,(b) 20 to 90 parts by weight of a noncrystalline epoxy resin having a softening point of 35.degree. C. to 55.degree. C.
摘要:
To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d): (a) Epoxy resin (b) Epoxy resin hardener comprising a partially aromatic-esterified phenol aralkyl resin having a conversion of esterification of 10 to 90 mol % as the main component (c) Silica powder filler (d) Cure accelerator.
摘要:
The process for producing a modified epoxy resin comprises reacting (a) an epoxy resin having at least two epoxy groups per one molecule, and (b) a specific active ester group-containing compound having at least two aromatic ring-bonded active ester groups per one molecule, in proportions such that the amount of the active ester groups in the active ester group-containing compound is from about 0.05 to about 0.95 mol per mole of the epoxy group in the epoxy resin, and the modified epoxy obtained by this process, and a composition of the epoxy resin and a curing agent are encompassed.
摘要:
The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.
摘要:
An epoxy resin composition is provided comprising a biphenol-type epoxy resin and a polyhydric phenol resin curing agent derived from a polyhydric phenol compound having 2 or more phenolic hydroxyl groups attached at adjacent positions on the aromatic ring. A cured product with excellent stability and strength at high temperatures can be obtained useful as adhesives, castings, sealing materials, moldings, and laminates.
摘要:
The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.
摘要:
An electrical encapsulation composition is disclosed comprising (a) an epoxy resin which is the product of glycidating a polyphenolic compound which is the condensation product of (i) a substituted phenol which can be represented by the formula ##STR1## in which each R is selected independently from hydrogen, C.sub.1-5 alkyl and phenyl, with the provisos that at least two R groups are not hydrogen and that the R groups may be bonded in a ring structure, and (ii) an aromatic aldehyde or aromatic ketone having a phenolic hydroxyl group as represented by the general formula ##STR2## in which R' is selected from hydrogen, C.sub.1-5 alkyl and phenyl, R" is selected from C.sub.1-5 alkyl, phenyl, methoxy and halogen, and n is an integer from 0 to 4; (b) a curing agent for the epoxy resin; and (c) an inorganic filler.
摘要:
Thin cast sheets having an excellent quality are obtained by continuous casting in which a semi-solidified metal slurry is fed from a continuous production device of the semi-solidified metal slurry through a discharge nozzle provided with means for heating the nozzle itself into a twin roll type continuous strip caster, at where the slurry is rapidly quenched and solidified to fine a structure and dispersion of precipitate.
摘要:
An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.