公开(公告)号：US07315086B2

公开(公告)日：2008-01-01

申请号：US11181145

申请日：2005-07-13

申请人： Dong-Han Kim ,  Sa-Yoon Kang ,  Seok-Won Lee

发明人： Dong-Han Kim ,  Sa-Yoon Kang ,  Seok-Won Lee

IPC分类号： H01L23/42 ,  H01L23/58 ,  H01L23/14

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/11334 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the film. The film has a number of holes through which the conductive patterns are partly exposed. A number of conductive bumps on an active surface of the IC chip face the inner surface of the film and enter corresponding holes in the non-conductive film to mechanically join and electrically couple to the conductive patterns. The disclosed COB package and a related manufacturing method allow a reduction in production cost, simplified process, better electrical connections, and improved reliability.

摘要翻译： 片上芯片（COB）封装具有倒装芯片组装结构，用于集成电路（IC）卡。 COB封装具有作为非导电膜的外表面上的接触端子的导电图案和膜的内表面上的IC芯片。 该膜具有多个孔，导电图案通过该孔部分露出。 IC芯片的有源表面上的多个导电凸块面向薄膜的内表面，并且在非导电薄膜中进入相应的孔以机械地连接并电耦合到导电图案。 所公开的COB封装和相关制造方法允许降低生产成本，简化工艺，更好的电连接和改进的可靠性。

公开(公告)号：US20060091511A1

公开(公告)日：2006-05-04

申请号：US11181145

申请日：2005-07-13

申请人： Dong-Han Kim ,  Sa-Yoon Kang ,  Seok-Won Lee

发明人： Dong-Han Kim ,  Sa-Yoon Kang ,  Seok-Won Lee

IPC分类号： H01L23/02

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/11334 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the film. The film has a number of holes through which the conductive patterns are partly exposed. A number of conductive bumps on an active surface of the IC chip face the inner surface of the film and enter corresponding holes in the non-conductive film to mechanically join and electrically couple to the conductive patterns. The disclosed COB package and a related manufacturing method allow a reduction in production cost, simplified process, better electrical connections, and improved reliability.

摘要翻译： 片上芯片（COB）封装具有倒装芯片组装结构，用于集成电路（IC）卡。 COB封装具有作为非导电膜的外表面上的接触端子的导电图案和膜的内表面上的IC芯片。 该膜具有多个孔，导电图案通过该孔部分露出。 IC芯片的有源表面上的多个导电凸块面向薄膜的内表面，并且在非导电薄膜中进入相应的孔以机械地连接并电耦合到导电图案。 所公开的COB封装和相关制造方法允许降低生产成本，简化工艺，更好的电连接和改进的可靠性。

公开(公告)号：US20070015338A1

公开(公告)日：2007-01-18

申请号：US11487484

申请日：2006-07-17

申请人： Seok-Won Lee ,  Kyoung-Sei Choi ,  Dong-Han Kim ,  Young-Hoon Ro

发明人： Seok-Won Lee ,  Kyoung-Sei Choi ,  Dong-Han Kim ,  Young-Hoon Ro

IPC分类号： H01L21/76

CPC分类号： H01L23/49855 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/90 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/90 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H05K3/244 ,  H05K3/4084 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/049 ,  H05K2203/1189 ,  H05K2203/1461 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A substrate, a smart card module having the substrate and methods for fabricating the same are provided. A substrate having metal patterns formed on both sides and applicable to both wire bonding and flip chip bonding, a smart card module having the same and methods of fabricating the same are also provided. The substrate may include an insulating layer, an upper metal pattern, a bottom metal pattern, a first plating layer, a second plating layer and a substrate. The insulating layer may have a plurality of via holes. The upper metal pattern may be formed on the insulating layer and side surfaces of the plurality of via holes. The bottom metal pattern may be formed on the bottom of the insulating layer and electrically connected to the upper metal pattern. The first plating layer may be formed on the upper metal pattern and the upper surface of the bottom metal pattern. The second plating layer may be formed on the bottom of the bottom metal pattern. The substrate may include contact holes having side surfaces of the plurality of via holes covered by the upper metal pattern and the first plating layer. The bottom surface of the insulating layer may be supported by the bottom metal pattern and the first plating layer.

摘要翻译： 提供基板，具有基板的智能卡模块及其制造方法。 还提供了一种具有形成在两面上并且适用于引线接合和倒装芯片接合的金属图案的基板，具有该金属图案的智能卡模块及其制造方法。 基板可以包括绝缘层，上金属图案，底金属图案，第一镀层，第二镀层和基板。 绝缘层可以具有多个通孔。 上部金属图案可以形成在多个通孔的绝缘层和侧表面上。 底部金属图案可以形成在绝缘层的底部并且电连接到上部金属图案。 第一镀层可以形成在上金属图案和底部金属图案的上表面上。 第二镀层可以形成在底部金属图案的底部上。 基板可以包括具有由上金属图案和第一镀层覆盖的多个通孔的侧表面的接触孔。 绝缘层的底面可以由底部金属图案和第一镀层支撑。

公开(公告)号：US09947684B2

公开(公告)日：2018-04-17

申请号：US15241781

申请日：2016-08-19

申请人： Joyoung Park ,  Yong-Hyun Kwon ,  Jeongsoo Kim ,  Seok-Won Lee ,  Jinwoo Park ,  Oik Kwon ,  Seungpil Chung

发明人： Joyoung Park ,  Yong-Hyun Kwon ,  Jeongsoo Kim ,  Seok-Won Lee ,  Jinwoo Park ,  Oik Kwon ,  Seungpil Chung

IPC分类号： H01L27/11 ,  H01L27/11582 ,  H01L27/11568

CPC分类号： H01L27/11582 ,  H01L27/11565 ,  H01L27/11568 ,  H01L27/1157 ,  H01L27/11575

摘要： A semiconductor device includes a substrate including a cell region and a connection region. A stack is disposed on the substrate. A vertical channel structure penetrates the stack in the cell region. The stack includes electrode patterns and insulating patterns which are alternatingly and repeatedly stacked on the substrate. Each of the electrode patterns may extend in a first direction and include a pad portion. The pad portion is positioned in the connection region. The pad portion includes a first sidewall and a second sidewall that extend in the first direction on opposite sides of the pad portion. The first sidewall has a recessed portion that is recessed in a second direction crossing the first direction toward the second sidewall.

公开(公告)号：US20110270530A1

公开(公告)日：2011-11-03

申请号：US13124121

申请日：2009-12-08

申请人： Seok-Won Lee

发明人： Seok-Won Lee

IPC分类号： G06F19/00

CPC分类号： G01N33/74 ,  G01N2333/575 ,  G01N2800/12 ,  G01N2800/347

摘要： The present invention relates to methods for the diagnosis and evaluation of BNP-related diseases. In particular, patient test samples are analyzed for the presence and amount of a plurality of natriuretic peptides, and a combined natriuretic peptide result is used as a diagnostic marker.

摘要翻译： 本发明涉及用于诊断和评估BNP相关疾病的方法。 特别地，对多个利尿钠肽的存在和量的患者测试样品进行分析，并且使用组合的利钠肽结果作为诊断标记。

公开(公告)号：US20090228253A1

公开(公告)日：2009-09-10

申请号：US12351808

申请日：2009-01-09

申请人： William J. Tolone ,  Elwood Wray Johnson ,  Kyle Joseph Thieman ,  David Wilson ,  Marc Thomas Calello ,  Wei-ning Xiang ,  Andrew Marcellus Stogner ,  Seok-Won Lee ,  Michael Russel

发明人： William J. Tolone ,  Elwood Wray Johnson ,  Kyle Joseph Thieman ,  David Wilson ,  Marc Thomas Calello ,  Wei-ning Xiang ,  Andrew Marcellus Stogner ,  Seok-Won Lee ,  Michael Russel

IPC分类号： G06G7/48

CPC分类号： G06Q10/10 ,  G06Q10/06

摘要： A system for simulating interdependencies between multiple critical physical infrastructure models includes a first infrastructure data model that models a first physical infrastructure; a second infrastructure data model that models a second physical infrastructure, wherein the second physical infrastructure is a different physical infrastructure from the first physical infrastructure; a simulation engine adapted to automatically produce a change in the second infrastructure data model in response to a change in the first infrastructure data model; a user interface permitting a user to interact with the simulation engine; wherein the user interface and the simulation engine are configured such that the user can disable an element of the first physical infrastructure, and subsequently re-enable the element of the first physical infrastructure; wherein the first infrastructure data model comprises a transport network; and wherein the second infrastructure data model comprises a channel network.

摘要翻译： 用于模拟多个关键物理基础设施模型之间的相互依赖性的系统包括对第一物理基础设施建模的第一基础设施数据模型; 第二基础设施数据模型，其建模第二物理基础设施，其中所述第二物理基础设施是与所述第一物理基础设施不同的物理基础设施; 适于响应于第一基础设施数据模型的变化而自动产生第二基础设施数据模型的变化的模拟引擎; 允许用户与模拟引擎交互的用户界面; 其中所述用户界面和所述模拟引擎被配置为使得所述用户可以禁用所述第一物理基础设施的元素，并且随后重新启用所述第一物理基础设施的元素; 其中所述第一基础设施数据模型包括传输网络; 并且其中所述第二基础设施数据模型包括信道网络。

公开(公告)号：US20070164402A1

公开(公告)日：2007-07-19

申请号：US11332891

申请日：2006-01-17

申请人： Dae-Hoon Jung ,  Seok-Won Lee ,  Sang-Bae Park

发明人： Dae-Hoon Jung ,  Seok-Won Lee ,  Sang-Bae Park

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  G01L19/141 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.

公开(公告)号：US20060232996A1

公开(公告)日：2006-10-19

申请号：US11452006

申请日：2006-06-13

申请人： Dong-Hoon Kim ,  Jong-Dae Park ,  Kyu-Seok Kim ,  Jeong-Hwan Lee ,  Jae-Ho Jung ,  Byung-Woong Han ,  Min-Gyu Kim ,  Hyoung-Joo Kim ,  Tae-Jin Lee ,  Seok-Won Lee ,  Sang-Hoon Lee

发明人： Dong-Hoon Kim ,  Jong-Dae Park ,  Kyu-Seok Kim ,  Jeong-Hwan Lee ,  Jae-Ho Jung ,  Byung-Woong Han ,  Min-Gyu Kim ,  Hyoung-Joo Kim ,  Tae-Jin Lee ,  Seok-Won Lee ,  Sang-Hoon Lee

IPC分类号： F21V7/04

CPC分类号： G02B6/0021 ,  G02B6/0031 ,  G02B6/0068

摘要： A light guide plate includes a first surface having a light incident surface and a light reflect surface, a second surface facing the first surface, through which the reflected light exits, a first edge surface connected between edges of the light reflect surface and the second surface, and a second edge surface connected between edges of the light incident surface and the second surface, being opposite to the first edge surface. A light source is disposed on the light incident surface. A light guide plate may also include a stepped edge portion formed at a marginal area of the light guide plate on which a light source is combined. The stepped edge portion includes a light incident surface, a light reflect surface, an upper surface through which the reflected light exits the light guide plate, and a first edge surface connected between edges of the light reflect surface and the upper surface, being opposite to the stepped edge portion. A backlight assembly includes the light guide plate, a lamp unit including lamps and a lamp reflector that are disposed on the light incident surface, and a mold frame for receiving the stepped edge portion and the lamp unit.

摘要翻译： 导光板包括具有光入射表面和光反射表面的第一表面，面对第一表面的第二表面，反射光通过该第一表面，连接在光反射表面的边缘和第二表面之间的第一边缘表面 以及连接在所述光入射表面和所述第二表面的边缘之间的与所述第一边缘表面相对的第二边缘表面。 光源设置在光入射面上。 导光板还可以包括形成在其上组合有光源的导光板的边缘区域处的阶梯状边缘部分。 台阶边缘部分包括光入射表面，光反射表面，反射光离开导光板的上表面，以及连接在光反射表面和上表面的边缘之间的第一边缘表面，与第 台阶边缘部分。 背光组件包括导光板，包括灯的灯单元和设置在光入射表面上的灯反射器，以及用于接收台阶边缘部分和灯单元的模架。

公开(公告)号：US07086761B2

公开(公告)日：2006-08-08

申请号：US10512112

申请日：2003-02-10

申请人： Yong-Gwang Won ,  Jong-Dae Park ,  Seok-Won Lee

发明人： Yong-Gwang Won ,  Jong-Dae Park ,  Seok-Won Lee

IPC分类号： F21V29/00

CPC分类号： G02B6/0031 ,  F21V7/22 ,  F21V29/89 ,  G02B6/0068 ,  G02B6/0071 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133385 ,  G02F1/133615

摘要： There are provided a backlight assembly (200) and an LCD apparatus (110) having the same. A lamp unit (210, 220) is received in a first receiving container (300) having a first bottom surface (350) and a first sidewall (310) so that the lamp unit (210) faces the first sidewall. The lamp unit (210, 220) and the first receiving container (300) are received in a second receiving container (500) having a second bottom surface (550) and a second sidewall (510). A heat transfer member (261, 263) comprised of metal material having superior heat conductivity makes contact with the second receiving container (500) through the lamp unit (210, 220). The heat emitted from the lamp unit (210, 263) and discharged to exterior. Accordingly, the backlight assembly and the LCD apparatus may improve display characteristics thereof.

摘要翻译： 提供了具有该组件的背光组件（200）和LCD装置（110）。 灯单元（210,220）被容纳在具有第一底表面（350）和第一侧壁（310）的第一接收容器（300）中，使得灯单元（210）面向第一侧壁。 灯单元（210,220）和第一接收容器（300）被容纳在具有第二底面（550）和第二侧壁（510）的第二容纳容器（500）中。 由具有优异导热性的金属材料构成的传热构件（261,263）通过灯单元（210,220）与第二接收容器（500）接触。 从灯单元（210,263）发射的热量并排放到外部。 因此，背光组件和LCD装置可以改善其显示特性。

公开(公告)号：US20050259191A1

公开(公告)日：2005-11-24

申请号：US10850602

申请日：2004-05-20

申请人： Jong-Dae Park ,  Seok-Won Lee ,  Tae-Jin Lee

发明人： Jong-Dae Park ,  Seok-Won Lee ,  Tae-Jin Lee

IPC分类号： G02F1/13 ,  G02F1/1333 ,  G09G3/36

CPC分类号： G02F1/133308 ,  G02F2001/133311 ,  G02F2001/133317 ,  G02F2201/465

摘要： A supporting unit includes a first support frame, a second support frame and an impurity barrier. The first support frame supports an LCD panel, and includes an opening through which a light is supplied to the LCD panel. The second support frame is protruded from sides of the first support frame to surround sides of the LCD panel. The impurity barrier is disposed on a surface of the first support frame corresponding to the liquid crystal display panel to prevent an inflow of impurities into a space between the first support frame and the liquid crystal display panel. Therefore, the supporting unit for the LCD panel includes the impurity barrier to prevent the inflow of the impurities that is externally provided into the space between the supporting unit and the LCD panel, thereby improving image display quality.

摘要翻译： 支撑单元包括第一支撑框架，第二支撑框架和杂质屏障。 第一支撑框架支撑LCD面板，并且包括一个开口，通过该开口将光提供给LCD面板。 第二支撑框架从第一支撑框架的侧面突出以围绕LCD面板的侧面。 杂质阻挡层设置在与液晶显示面板对应的第一支撑框架的表面上，以防止杂质流入第一支撑框架和液晶显示面板之间的空间。 因此，用于LCD面板的支撑单元包括杂质阻挡层，以防止外部设置在支撑单元和LCD面板之间的空间中的杂质的流入，从而提高图像显示质量。