摘要:
A method of forming a transparent electrode includes forming a first transparent conductive material layer on a base; performing a plasma process on the first transparent conductive material layer such that the upper portion of the first transparent conductive material layer is changed into semitransparent; forming a second transparent conductive material layer on the first transparent conductive material layer; patterning the second transparent conductive material layer and the first transparent conductive material layer; and annealing the patterned second transparent conductive material layer and the patterned first transparent conductive material layer such that the upper portion of the first transparent conductive material layer is changed into transparent.
摘要:
An apparatus and method for fabricating a flat panel display device are discussed. According to an embodiment, the apparatus includes a coating line configured to form a transparent conductive metal layer on a substrate, a blackening line configured to blacken the transparent conductive metal layer, an exposure line configured to expose the blackened metal layer, a developing line configured to receive the exposed substrate having the blackened metal layer and to perform development on the received substrate to form a blackened metal pattern on the substrate, and an annealing line configured to perform annealing on the blackened metal pattern on the substrate to restore the blackened metal pattern to a transparent metal pattern.
摘要:
An array substrate for a liquid crystal display (LCD) device include: a substrate; a gate line formed in one direction on one surface of the substrate; a data line crossing the gate line to define a pixel area; a thin film transistor (TFT) configured at a crossing of the gate line and the data line; a pixel electrode formed at a pixel region of the substrate; an insulating film formed on the entire surface of the substrate including the pixel electrode and the TFT, including a first insulating film formed of a high temperature silicon nitride film and a second insulating film formed of a low temperature silicon nitride film, and having a contact hole having an undercut shape exposing the pixel electrode; a pixel electrode connection pattern formed within the contact hole having an undercut shape and connected with the pixel electrode and the TFT; and a plurality of common electrodes separately formed on the insulating film.
摘要:
A light emitting diode (“LED”) backlight assembly. The LED backlight assembly has a bottom container which has a bottom plate and a side edge surrounding the bottom plate, a plurality of light emitting diode printed circuit boards (“LED-PCBs”) on the bottom plate, and a connector which is closely located to edge located LEDs. The connector of the LED-PCB is closely located to an LED driving board, which is disposed at a lateral space of a lateral part of the bottom container to limit a vertical thickness of the backlight light assembly.
摘要:
A semiconductor device capable of reducing a thickness, an electronic product employing the same, and a method of fabricating the same are provided. The method of fabricating a semiconductor device includes preparing a semiconductor substrate having first and second active regions. A first transistor in the first active region includes a first gate pattern and first impurity regions. A second transistor the second active region includes a second gate pattern and second impurity regions. A first conductive pattern is on the first transistor, wherein at least a part of the first conductive pattern is disposed at a same distance from an upper surface of the semiconductor substrate as at least a part of the second gate pattern. The first conductive pattern may be formed on the first transistor while the second transistor is formed.
摘要:
A backlight assembly includes a lamp socket unit, a printed circuit board and a lower receiving container. The printed circuit board includes a cutout portion which receives the lamp socket unit therethrough. The lower receiving container receives the lamp socket unit and the printed circuit board. The lamp socket unit is coupled to the printed circuit board, and the printed circuit board, having the lamp socket unit coupled thereto, is disposed in the lower receiving container.
摘要:
Disclosed is a portable terminal, including, a first conductor formed on one surface of a board and having a contact surface, a second conductor formed at an outer periphery of the first conductor and having a support surface, and a metal dome supported by the support surface and transformed responsive to a key being pressed so as to contact the contact surface, wherein the contact surface is located at a position lower than the support surface so as to increase a transformation stroke of the metal dome.
摘要:
In a photoresist composition suitable for forming a photoresist pattern having a high profile angle, and a method of forming a photoresist pattern using the same, the photoresist composition includes an alkali-soluble resin, a quinone diazide containing compound, a compound represented by Formula 1, and a solvent: wherein R1, R2 and R3 are independently H, C1-4 alkyl, C2-4 alkenyl, C3-8 cycloalkyl, or C6-12 aryl.
摘要:
A supporting member for a liquid crystal display device comprises a base substrate, a lamp clip protruded from the base substrate in a first direction to hold a lamp that generates light, a supporting part protruded from the base substrate in the first direction to support a diffusion member that diffuses the light generated from the lamp, and a fixing clip protruded from the base substrate in a second direction substantially opposite to the first direction, wherein the fixing clip combines with a receiving container.
摘要:
A semiconductor memory device includes unit active regions, word lines extending in a first direction over the unit active region, bit lines extending on the word lines in a second direction substantially perpendicularly to the first direction, first pad contacts in contact with central portions of the unit active regions, the first pad contacts being arranged between the word lines, direct contacts electrically connected between the first pad contacts and the bit lines, second pad contacts in contact with edge portions of the unit active regions, the second pad contacts being arranged between the word lines and between the bit lines, buried contacts electrically connected to the second pad contacts, and capacitors electrically connected to the buried contacts.