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公开(公告)号：US5258226A
公开(公告)日：1993-11-02
申请号：US714955
申请日：1991-06-13
IPC分类号： B32B27/00 , B32B7/02 , B32B27/18 , C08J5/18 , C08K5/00 , C08L23/08 , C08L23/12 , C08L23/20 , C08L23/28 , B32B27/08 , C08L23/02
CPC分类号： C08L23/12 , B32B27/18 , C08J5/18 , C08K5/0066 , C08L53/00 , C08L23/0853 , C08L23/20 , C08L23/286 , Y10S428/92 , Y10S428/921 , Y10T428/269 , Y10T428/31909 , Y10T428/31913
摘要： The invention provides a film composition comprising a thermoplastic polymer having a melt flow rate of 20 to 2000 (g/10 min), and a flame-retardant, and a self-extinguishing laminated film comprising at least two thermoplastic polymer films, at least one of the thermoplastic polymer films being a meltable film prepared from the composition.
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公开(公告)号：US4266370A
公开(公告)日：1981-05-12
申请号：US76948
申请日：1979-09-19
CPC分类号： C08L23/02 , A01G9/1438 , C08L23/06 , C08L23/0853 , C08L23/10 , C08L31/04 , C08L59/00
摘要： A resin composition in the form of a covering film or sheet comprising (A) 100 parts by weight of a thermoplastic olefinic resin and (B) about 1 to about 20 parts by weight of an acetal resin; and a method for maintaining an agricultural locus at temperatures suitable for the growth of plants, using above covering film or sheet.
摘要翻译： 一种覆盖膜或片的形式的树脂组合物，其包含（A）100重量份的热塑性烯烃树脂和（B）约1至约20重量份的缩醛树脂; 以及使用上述覆盖膜或片材将农业基因座保持在适于植物生长的温度下的方法。
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3.发明授权Agricultural covering film or sheet and method for thermal insulation from a blend of an olefin resin and an acetal resin 失效农业覆盖膜或片材以及由烯烃树脂和缩醛树脂的共混物进行绝热的方法
公开(公告)号：US4220736A
公开(公告)日：1980-09-02
申请号：US911956
申请日：1978-06-01
摘要： A resin composition in the form of a covering film or sheet comprising (A) 100 parts by weight of a thermoplastic olefinic resin and (B) about 1 to about 20 parts by weight of an acetal resin; and a method for maintaining an agricultural locus at temperatures suitable for the growth of plants, using above covering film or sheet.
摘要翻译： 一种覆盖膜或片的形式的树脂组合物，其包含（A）100重量份的热塑性烯烃树脂和（B）约1至约20重量份的缩醛树脂; 以及使用上述覆盖膜或片材将农业基因座保持在适于植物生长的温度下的方法。
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公开(公告)号：US06562217B1
公开(公告)日：2003-05-13
申请号：US09403271
申请日：1999-12-27
申请人： Yoshiaki Tanaka , Yoshiaki Kodera , Manabu Matsubara , Kazuhiko Kanki , Tatsuo Suzuki , Kazuo Ukai
发明人： Yoshiaki Tanaka , Yoshiaki Kodera , Manabu Matsubara , Kazuhiko Kanki , Tatsuo Suzuki , Kazuo Ukai
IPC分类号： C25D700
CPC分类号： C23C18/1619 , C23C18/1653 , C23C18/31 , C25D5/10 , C25D7/00 , C25D17/22 , H01L21/6715 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05572 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/0568 , H01L2224/13099 , H01L2224/13561 , H01L2224/136 , H01L2224/13609 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/12044 , H01L2924/13034 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T428/26 , Y10T428/2991 , Y10T428/2998 , H01L2924/00 , H01L2924/00014 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2924/013
摘要： A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid. The apparatus comprises: a disk-shaped bottom plate secured to the top part of a vertical drive shaft; a porous body arranged on the upper surface of the outer periphery of the bottom plate and allowing only the plating liquid to pass therethrough; a contact ring arranged on the upper surface of the porous body to conduct electricity; a hollow cover including a truncated cone cover with an opening at its upper central portion and a hollow cylinder of the same diameter as that of the opening attached to the upper end of the truncated cone cover, the upper end portion of the hollow cylinder being folded back on the inner wall side thereof; a rotatable processing chamber formed so as to hold the porous body and the contact ring between the outer periphery of the hollow cover and the bottom plate; a supply pipe to supply the plating liquid from the opening into the processing chamber; a container to receive the plating liquid scattered from the pores of the porous body; a discharge pipe to discharge the plating liquid collected in the container; and an electrode inserted from the opening to contact the plating liquid.
摘要翻译： 一种制造导电颗粒的方法，其有效地允许在每个颗粒上形成均匀厚度的镀层，而不会使电镀液体中的颗粒聚集。 该装置包括：固定到垂直驱动轴的顶部的盘形底板; 多孔体，其布置在所述底板的外周的上表面上，并且仅允许所述电镀液体通过; 接触环，布置在所述多孔体的上表面上以导电; 一个中空的盖子，它包括一个在其上部中心部分具有一个开口的截锥形盖子，以及一个中空圆柱体，该中空圆柱体的直径与安装在截头锥形盖子上端的开口直径相同，中空圆柱体的上端部分被折叠 回到其内壁侧; 可旋转处理室，其形成为将多孔体和接触环保持在中空盖的外周与底板之间; 供给管，用于将电镀液体从开口供给到处理室中; 容纳从多孔体的孔隙散布的镀液的容器; 排出管，用于排出收集在容器中的电镀液; 以及从开口插入以接触电镀液体的电极。
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5.发明授权公开(公告)号：US06906427B2
公开(公告)日：2005-06-14
申请号：US10379582
申请日：2003-03-06
申请人： Yoshiaki Tanaka , Yoshiaki Kodera , Manabu Matsubara , Kazuhiko Kanki , Tatsuo Suzuki , Kazuo Ukai
发明人： Yoshiaki Tanaka , Yoshiaki Kodera , Manabu Matsubara , Kazuhiko Kanki , Tatsuo Suzuki , Kazuo Ukai
CPC分类号： C23C18/1619 , C23C18/1653 , C23C18/31 , C25D5/10 , C25D7/00 , C25D17/22 , H01L21/6715 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05572 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/0568 , H01L2224/13099 , H01L2224/13561 , H01L2224/136 , H01L2224/13609 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/12044 , H01L2924/13034 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T428/26 , Y10T428/2991 , Y10T428/2998 , H01L2924/00 , H01L2924/00014 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2924/013
摘要： An electrical connection is formed by using a double laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle by electroless plating and electroplating and a layer of a low-melting-point metal on the surface of the conductive metal layer and wherein the conductive metal layer comprises a plurality of metal layers.
摘要翻译： 通过使用通过化学镀和电镀在球形弹性基体颗粒的表面上设置有导电金属层的双层压导电细颗粒和导电性表面上的低熔点金属层形成电连接 金属层，其中所述导电金属层包括多个金属层。
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6.发明授权
公开(公告)号：US4250661A
公开(公告)日：1981-02-17
申请号：US68965
申请日：1979-08-23
CPC分类号： B32B27/42 , A01G9/1438 , Y10S47/06 , Y10T428/249992 , Y10T428/31859 , Y10T428/3192 , Y10T428/31928 , Y10T428/31935 , Y10T428/31942
摘要： A covering multilayer film or sheet structure for agricultural application, which consists essentially of:(1) a film or sheet of a resin composition comprising (A) 100 parts by weight of a thermoplastic resin selected from the group consisting of olefinic resins and vinyl chloride resins and (B) about 1 to about 40 parts by weight of an acetal resin, and(2) a layer of the thermoplastic resin (A) laminated to at least one surface of the film or sheet (1); and a method for maintaining an agricultural locus at temperatures suitable for the growth of plants, using aforesaid covering multilayer film or sheet.
摘要翻译： 一种用于农业应用的覆盖多层膜或片结构，其基本上由以下组成：（1）树脂组合物的膜或片，其包含（A）100重量份的选自烯烃树脂和氯乙烯的热塑性树脂 树脂和（B）约1至约40重量份的缩醛树脂，和（2）层压到膜或片材（1）的至少一个表面上的热塑性树脂层（A）; 以及使用上述覆盖多层膜或片材将农业基因座保持在适于植物生长的温度下的方法。
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7.发明授权
公开(公告)号：US4214034A
公开(公告)日：1980-07-22
申请号：US911955
申请日：1978-06-01
CPC分类号： B32B27/42 , Y10T428/249992 , Y10T428/249993 , Y10T428/31859 , Y10T428/3192 , Y10T428/31928 , Y10T428/31935 , Y10T428/31942
摘要： A covering multilayer film or sheet structure for agricultural application, which consists essentially of:(1) a film or sheet of a resin composition comprising (A) 100 parts by weight of a thermoplastic resin selected from the group consisting of olefinic resins and vinyl chloride resins and (B) about 1 to about 40 parts by weight of an acetal resin,and(2) a layer of the thermoplastic resin (A) laminated to at least one surface of the film or sheet (1); and a method for maintaining an agricultural locus at temperatures suitable for the growth of plants, using aforesaid covering multilayer film or sheet.
摘要翻译： 一种用于农业应用的覆盖多层膜或片结构，其基本上由以下组成：（1）树脂组合物的膜或片，其包含（A）100重量份的选自烯烃树脂和氯乙烯的热塑性树脂 树脂和（B）约1至约40重量份的缩醛树脂，和（2）层压到膜或片材（1）的至少一个表面上的热塑性树脂层（A）; 以及使用上述覆盖多层膜或片材将农业基因座保持在适于植物生长的温度下的方法。
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8.发明申请公开(公告)号：US20060286369A1
公开(公告)日：2006-12-21
申请号：US11506940
申请日：2006-08-21
申请人： Yoshiaki Tanaka , Yoshiaki Kodera , Manabu Matsubara , Kazuhiko Kanki , Tatsuo Suzuki , Kazuo Ukai
发明人： Yoshiaki Tanaka , Yoshiaki Kodera , Manabu Matsubara , Kazuhiko Kanki , Tatsuo Suzuki , Kazuo Ukai
CPC分类号： C23C18/1619 , C23C18/1653 , C23C18/31 , C25D5/10 , C25D7/00 , C25D17/22 , H01L21/6715 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05572 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/0568 , H01L2224/13099 , H01L2224/13561 , H01L2224/136 , H01L2224/13609 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/12044 , H01L2924/13034 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T428/26 , Y10T428/2991 , Y10T428/2998 , H01L2924/00 , H01L2924/00014 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2924/013
摘要： An electrical connection is formed by using a double laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle by electroless plating and electroplating and a layer of a low-melting-point-metal on the surface of the conductive metal layer and wherein the conductive metal layer comprise a plurality of metal layers.
摘要翻译： 通过使用通过化学镀和电镀在球形弹性基体颗粒的表面上设置有导电金属层的双层压导电细粒而形成电连接，并且在该表面上形成低熔点金属层 导电金属层，并且其中所述导电金属层包括多个金属层。
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