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公开(公告)号：US08656777B2
公开(公告)日：2014-02-25
申请号：US13172159
申请日：2011-06-29
申请人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
发明人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
摘要： An electronic component analyzing apparatus is provided with a fixing part configured to hold a substrate to which an electronic component is soldered; a gripper configured to grip the electronic component; a transmission part coupled to the gripper, and configured to transmit an external force to the gripper as a force acting in a direction away from the substrate; and a support part configured to pivotally support the transmission part.
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公开(公告)号：US08701488B2
公开(公告)日：2014-04-22
申请号：US13172159
申请日：2011-06-29
申请人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
发明人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
CPC分类号： G01R31/2867 , G01N3/08 , G01N3/24 , G01N2033/0078 , G01N2203/0062 , G01N2203/0296 , H05K3/22 , H05K3/3436 , H05K2201/10734 , H05K2203/0195 , H05K2203/162 , H05K2203/176
摘要： An electronic component analyzing apparatus is provided with a fixing part configured to hold a substrate to which an electronic component is soldered; a gripper configured to grip the electronic component; a transmission part coupled to the gripper, and configured to transmit an external force to the gripper as a force acting in a direction away from the substrate; and a support part configured to pivotally support the transmission part.
摘要翻译： 一种电子部件分析装置，具备：固定部，其被构造成保持焊接有电子部件的基板; 构造成夹持电子部件的夹持器; 传动部分，其联接到所述夹持器，并且构造成作为沿远离所述基底的方向作用的力将外力传递到所述夹持器; 以及构造成枢转地支撑所述变速部的支撑部。
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3.发明授权公开(公告)号：US08338715B2
公开(公告)日：2012-12-25
申请号：US12222178
申请日：2008-08-04
申请人： Yoshikazu Hirano , Mitsunori Abe
发明人： Yoshikazu Hirano , Mitsunori Abe
CPC分类号： H05K1/03 , H01L24/16 , H01L24/81 , H01L2224/16058 , H01L2224/16105 , H01L2224/16238 , H01L2924/3841 , H05K1/111 , H05K3/3442 , H05K3/3484 , H05K2201/09381 , H05K2201/10636 , H05K2201/10727 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T29/4913
摘要： A printed circuit board provided with board electrodes, wherein each board electrode is provided with a board electrode base, for carrying by soldering a bottom electrode arranged at a bottom of an electronic device inside from outer edges of the electronic device, arranged inside from the outer edges of the electronic device and a projection projecting out from the board electrode base, narrower in width than the board electrode base, and connected to an interconnect of the printed circuit board.
摘要翻译： 一种设置有板电极的印刷电路板，其中每个板电极设置有电路板电极基座，用于通过将布置在电子设备的底部的底部电极的内部从电子设备的外边缘焊接到内部而布置在外部 电子装置的边缘和从基板电极基底突出的突起，其宽度比板电极基底窄，并连接到印刷电路板的互连。
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4.发明申请公开(公告)号：US20090056985A1
公开(公告)日：2009-03-05
申请号：US12222178
申请日：2008-08-04
申请人： Yoshikazu Hirano , Mitsunori Abe
发明人： Yoshikazu Hirano , Mitsunori Abe
CPC分类号： H05K1/03 , H01L24/16 , H01L24/81 , H01L2224/16058 , H01L2224/16105 , H01L2224/16238 , H01L2924/3841 , H05K1/111 , H05K3/3442 , H05K3/3484 , H05K2201/09381 , H05K2201/10636 , H05K2201/10727 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T29/4913
摘要： A printed circuit board provided with board electrodes, wherein each board electrode is provided with a board electrode base, for carrying by soldering a bottom electrode arranged at a bottom of an electronic device inside from outer edges of the electronic device, arranged inside from the outer edges of the electronic device and a projection projecting out from the board electrode base, narrower in width than the board electrode base, and connected to an interconnect of the printed circuit board.
摘要翻译： 一种设置有板电极的印刷电路板，其中每个板电极设置有电路板电极基座，用于通过将布置在电子设备的底部的底部电极的内部从电子设备的外边缘焊接到内部而布置在外部 电子装置的边缘和从基板电极基底突出的突起，其宽度比板电极基底窄，并连接到印刷电路板的互连。
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公开(公告)号：US20110154888A1
公开(公告)日：2011-06-30
申请号：US12737999
申请日：2009-09-17
IPC分类号： G01N11/02
CPC分类号： G01N35/08 , G01F1/704 , G01F1/7086 , G01N2015/1006 , G01N2015/105 , G01N2015/1495
摘要： The present invention relates to an analysis apparatus 1 comprising a resistive body 2 for giving a travel resistance to a sample, and power sources 33, 54 for giving power to cause the sample to pass through the resistive body 2. The power sources 33, 54 include a pressurizing mechanism 33 arranged at an upstream side of the resistive body 2 and a pressure-reduction mechanism 54 arranged at a downstream side of the resistive body. The pressurizing mechanism 33 and the pressure-reduction mechanism 54 are each a tube pump, for example. The resistive body 2 is provided with a plurality of minute fluid channels, for example.
摘要翻译： 本发明涉及一种分析装置1，其包括用于赋予样品行进阻力的电阻体2，以及用于给予试样通过电阻体2的电力的电源33,54。电源33,54 包括布置在电阻体2的上游侧的加压机构33和布置在电阻体的下游侧的减压机构54。 加压机构33和减压机构54例如都是管式泵。 电阻体2例如具有多个微小的流体通道。
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6.发明授权Analysis device provided with flow sensor, and flow sensor adjustment method 有权分析装置配有流量传感器，流量传感器调节方式公开(公告)号：US08424391B2
公开(公告)日：2013-04-23
申请号：US12737993
申请日：2009-09-17
IPC分类号： G01F1/00
CPC分类号： G01N35/08 , G01F1/704 , G01F1/708 , G01F1/7086
摘要： The present invention relates to a method of adjusting a flow rate sensor 52 for measuring a travel time of a sample passing through a resistive body. The flow rate sensor 52 includes a straight tube 56, and plural photo sensors 52A to 52E for detecting interfaces 82A, 82B between a gas 80 and a liquid 81 traveling in the straight tube 56. Respective positions of the plural photo sensors 52A to 52E are adjusted by detecting the interfaces 82A, 82B by using such photo sensors 52A to 52E.
摘要翻译： 本发明涉及一种调节流量传感器52的方法，用于测量通过电阻体的样品的行进时间。 流量传感器52包括直管56和用于检测在直管56内行进的气体80和液体81之间的接口82A，82B的多个光传感器52A至52E。多个光传感器52A至52E的各个位置是 通过使用这样的光传感器52A至52E检测接口82A，82B进行调整。
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7.发明申请公开(公告)号：US20110174081A1
公开(公告)日：2011-07-21
申请号：US12737993
申请日：2009-09-17
IPC分类号： G01F1/00
CPC分类号： G01N35/08 , G01F1/704 , G01F1/708 , G01F1/7086
摘要： The present invention relates to a method of adjusting a flow rate sensor 52 for measuring a travel time of a sample passing through a resistive body. The flow rate sensor 52 includes a straight tube 56, and plural photo sensors 52A to 52E for detecting interfaces 82A, 82B between a gas 80 and a liquid 81 traveling in the straight tube 56. Respective positions of the plural photo sensors 52A to 52E are adjusted by detecting the interfaces 82A, 82B by using such photo sensors 52A to 52E.
摘要翻译： 本发明涉及一种调节流量传感器52的方法，用于测量通过电阻体的样品的行进时间。 流量传感器52包括直管56和用于检测在直管56内行进的气体80和液体81之间的接口82A，82B的多个光传感器52A至52E。多个光传感器52A至52E的各个位置是 通过使用这样的光传感器52A至52E检测接口82A，82B进行调整。
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公开(公告)号：US08429984B2
公开(公告)日：2013-04-30
申请号：US12737992
申请日：2009-09-17
IPC分类号： G01F1/74
CPC分类号： G01N35/08 , G01F1/704 , G01F1/7086 , G01N33/49
摘要： The present invention relates to a flow rate sensor 52 which causes a gas 80 included in a liquid 81 to travel in a piping 56, and which measures a flow speed of a sample by detecting the gas 80. The flow rate sensor 52 is configured to maintain a contact area of the gas with respect to the piping 56 at constant or at substantially constant.
摘要翻译： 本发明涉及一种流量传感器52，其使包含在液体81中的气体80在管道56中行进，并且通过检测气体80来测量样品的流速。流量传感器52被配置为 以恒定或基本恒定的方式保持气体相对于管道56的接触面积。
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公开(公告)号：US20110162458A1
公开(公告)日：2011-07-07
申请号：US12737992
申请日：2009-09-17
IPC分类号： G01F1/74
CPC分类号： G01N35/08 , G01F1/704 , G01F1/7086 , G01N33/49
摘要： The present invention relates to a flow rate sensor 52 which causes a gas 80 included in a liquid 81 to travel in a piping 56, and which measures a flow speed of a sample by detecting the gas 80. The flow rate sensor 52 is configured to maintain a contact area of the gas with respect to the piping 56 at constant or at substantially constant.
摘要翻译： 本发明涉及一种流量传感器52，其使包含在液体81中的气体80在管道56中行进，并且通过检测气体80来测量样品的流速。流量传感器52被配置为 以恒定或基本恒定的方式保持气体相对于管道56的接触面积。
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公开(公告)号：US06482676B2
公开(公告)日：2002-11-19
申请号：US08886557
申请日：1997-07-01
申请人： Kazuhisa Tsunoi , Akira Fujii , Shunji Baba , Yoshikazu Hirano
发明人： Kazuhisa Tsunoi , Akira Fujii , Shunji Baba , Yoshikazu Hirano
IPC分类号： H01L2148
CPC分类号： H01L24/12 , H01L21/563 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/1134 , H01L2224/11822 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/00 , H01L2224/05599
摘要： A method of mounting a semiconductor chip part on a substrate, which is capable of realizing high efficiency and high reliability of the mounting works. A leading end of a conductive wire is contact-bonded onto each pad of a semiconductor chip part, followed by tearing of the wire, to form a two-step bump having an upper step portion and a lower step portion larger in volume than the upper step portion. Only the upper step portions of the bumps are then brought in press-contact with a single flattening tool member having a flat surface in such a manner that heights of all of the bumps are made nearly equal to each other. A conductive paste is stuck on the bumps, and the substrate is coated with an adhesive. Thus, the semiconductor chip part is heated and pressurized onto the substrate by a mounting tool in such a state in which the pads are aligned with the corresponding lands of the substrate, to plastically deform the whole of the upper step portions and the lower step portions of the bumps.
摘要翻译： 一种将半导体芯片部件安装在基板上的方法，其能够实现安装工作的高效率和高可靠性。 导电线的前端接触接合到半导体芯片部件的每个焊盘上，随后撕裂导线，以形成具有上部台阶部分和下部台阶部分的体积比上部大的两级凸块 步骤部分。 然后仅使凸块的上阶梯部分与具有平坦表面的单个平坦化工具构件压接，使得所有凸块的高度彼此几乎相等。 将导电糊粘贴在凸块上，并且用粘合剂涂覆基底。 因此，通过安装工具将半导体芯片部分加热并加压到衬底上，在这种状态下，焊盘与衬底的相应焊盘对准，使整个上部台阶部分和下部分部分塑性变形 的颠簸。
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