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    Thin-film magnetic head with improved wide area track erasure (WATE), method of manufacturing the same, head gimbal assembly, and hard disk drive
    3.
    发明授权
    Thin-film magnetic head with improved wide area track erasure (WATE), method of manufacturing the same, head gimbal assembly, and hard disk drive 有权
    具有改善的广域轨道擦除（WATE）的薄膜磁头，其制造方法，头万向架组件和硬盘驱动器

    公开(公告)号：US08824102B2

    公开(公告)日：2014-09-02

    申请号：US13099729

    申请日：2011-05-03

    申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Shigeki Tanemura ,  Kazuki Sato ,  Atsushi Iijima

    发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Shigeki Tanemura ,  Kazuki Sato ,  Atsushi Iijima

    IPC分类号： G11B5/31 ,  G11B5/127

    CPC分类号： G11B5/1278 ,  G11B5/3116 ,  Y10T29/49032 ,  Y10T428/1186

    摘要： A thin-film magnetic head includes a main magnetic pole layer, write shield layer, gap layer, and thin-film coils, which are laminated on a substrate. A return magnetic pole layer is spaced from the medium-opposing surface on the side opposite to the write shield layer with the main magnetic pole layer intervening therebetween. A connecting magnetic layer is formed using a magnetic material to connect the return magnetic pole layer to the write shield layer on the side closer to the medium-opposing surface than is the thin-film coil. The thin-film coil is wound as a flat spiral around the write shield layer. A part of the thin-film coil wound as the flat spiral is disposed only at a position distanced from the substrate than is the main magnetic pole layer.

    摘要翻译： 薄膜磁头包括层叠在基板上的主磁极层，写入屏蔽层，间隙层和薄膜线圈。 返回磁极层与写入屏蔽层相对的一侧的介质相对表面间隔开，主磁极层介于它们之间。 使用磁性材料形成连接磁性层，以使返回磁极层与薄膜线圈相比更靠近介质相对表面的一侧将写入屏蔽层连接。 薄膜线圈围绕写入屏蔽层缠绕成平坦的螺旋线。 作为扁平螺旋卷绕的薄膜线圈的一部分仅设置在与主磁极层相比离开基板的位置。

    Memory device and method of manufacturing the same
    5.
    发明授权
    Memory device and method of manufacturing the same 有权
    存储器件及其制造方法

    公开(公告)号：US08536712B2

    公开(公告)日：2013-09-17

    申请号：US13014093

    申请日：2011-01-26

    申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

    发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

    IPC分类号： H01L23/48 ,  H01L21/50

    CPC分类号： H01L25/18 ,  H01L23/49811 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2224/03 ,  H01L2924/00

    摘要： A memory device has a laminated chip package and a controller plate. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller plate. A plurality of opposing wiring electrodes are formed at an opposing surface of the controller plate. A plurality of outside wiring electrodes are formed on the rear side of the opposing surface. Connection electrodes connecting the opposing wiring electrodes and the outside wiring electrodes are formed on the side surface of the controller plate. The interposed chip has a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of the plurality of opposing wiring electrodes. The controller plate is laid on the interposed chip.

    摘要翻译： 存储器件具有层压芯片封装和控制器板。 在层叠芯片封装中，层叠多个存储芯片。 在层压芯片封装和控制板之间层压插入的芯片。 多个相对的布线电极形成在控制器板的相对表面处。 多个外部布线电极形成在相对表面的后侧。 连接相对的布线电极和外部布线电极的连接电极形成在控制器板的侧表面上。 插入的芯片具有多个插入的布线电极。 多个插入的布线电极形成有与多个相对的布线电极的配置图案相同的共同布置图案。 控制板放置在插入的芯片上。

    Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package
    6.
    发明授权
    Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package 有权
    层叠芯片封装，半导体衬底及其制造方法

    公开(公告)号：US08525167B2

    公开(公告)日：2013-09-03

    申请号：US12588713

    申请日：2009-10-26

    申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

    发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

    IPC分类号： H01L23/522

    CPC分类号： H01L23/3114 ,  H01L21/56 ,  H01L23/585 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06551

    摘要： In a laminated chip package, a plurality of semiconductor plates each having a semiconductor device and a wiring electrode connected to the semiconductor device are laminated. On a side surface for wiring of the laminated chip package, an end face of an inner electrode for examination formed inside the side surface for wiring in the semiconductor plate is formed. The laminated chip package further has an outer electrode for examination connecting the end faces of the inner electrodes for examination along a lamination direction of the semiconductor plates, only for two adjacent semiconductor plates among the semiconductor plates.

    摘要翻译： 在层压芯片封装中，层叠多个半导体装置和与该半导体装置连接的配线电极的半导体板。 在层叠芯片封装的布线侧面，形成在半导体板的配线用侧面的内侧电极的端面。 层叠芯片封装还具有用于检查的内部电极的端面沿着半导体板的层叠方向连接用于检查的外部电极，仅对于半导体板中的两个相邻的半导体板。

    Magnetic head for perpendicular magnetic recording with shield around main pole
    7.
    发明授权
    Magnetic head for perpendicular magnetic recording with shield around main pole 有权
    用于垂直磁记录的磁头与主极周围的屏蔽

    公开(公告)号：US08493687B2

    公开(公告)日：2013-07-23

    申请号：US12964313

    申请日：2010-12-09

    申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Kazuki Sato ,  Atsushi Iijima

    发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Kazuki Sato ,  Atsushi Iijima

    IPC分类号： G11B5/127

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/315

    摘要： A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section includes a yoke layer, and first and second coupling layers that magnetically couple the bottom shield and the yoke layer to each other. The first coupling layer is magnetically connected to the bottom shield. The second coupling layer magnetically couples the first coupling layer to the yoke layer. No end faces of the second coupling layer are exposed in the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other.

    摘要翻译： 磁头包括屏蔽，以及第一和第二返回路径部分。 屏蔽件具有位于面向介质的表面中以围绕主极端面的端面。 屏蔽包括底部屏蔽，两个侧面屏蔽和顶部屏蔽。 第一返回路径部分包括轭层，以及使底屏蔽和轭层彼此磁耦合的第一和第二耦合层。 第一耦合层磁性地连接到底部屏蔽。 第二耦合层将第一耦合层磁耦合到轭层。 没有第二耦合层的端面在面向介质的表面中露出。 第二返回路径部分将顶部屏蔽和主极彼此磁耦合。

    Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
    8.
    发明授权
    Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same 有权
    半导体衬底，层叠芯片封装，半导体板及其制造方法

    公开(公告)号：US08482105B2

    公开(公告)日：2013-07-09

    申请号：US12656458

    申请日：2010-01-29

    申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

    发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

    IPC分类号： H01L29/06 ,  H01L21/76

    CPC分类号： H01L21/50 ,  H01L21/768 ,  H01L23/28 ,  H01L23/498 ,  H01L2224/16145

    摘要： A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof.

    摘要翻译： 半导体基板具有沿划线形成的多个槽部。 半导体衬底包括：与所述多个沟槽部分中的至少任一个接触的单位区域; 以及布线电极，其部分布置在单元区域内。 此外，多个槽部具有宽口结构，其宽度在宽度方面比包括底部的槽下部宽的部分形成在其入口处。

    Layered chip package and method of manufacturing same
    9.
    发明授权
    Layered chip package and method of manufacturing same 有权
    分层芯片封装及其制造方法

    公开(公告)号：US08362602B2

    公开(公告)日：2013-01-29

    申请号：US12852767

    申请日：2010-08-09

    申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hiroshi Ikejima ,  Atsushi Iijima

    发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hiroshi Ikejima ,  Atsushi Iijima

    IPC分类号： H01L23/02

    CPC分类号： H01L25/50 ,  H01L23/5382 ,  H01L24/01 ,  H01L25/0657 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/07802 ,  H01L2924/00

    摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other.

    摘要翻译： 分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。 主体包括：主要部分，包括多个层部分; 多个第一端子，其设置在所述主体部的上表面并与所述布线连接; 以及多个第二端子，其设置在所述主体部的底面并与所述布线连接。 每个层部分包括半导体芯片。 多个第二端子被定位成在垂直于主体顶表面的方向上与多个第一端子重叠。 经由导线电连接的多对第一和第二端子包括定位为不彼此重叠的多对第一端子和第二端子。

    Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive
    10.
    发明授权
    Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive 有权
    热辅助磁头，制造方法，磁头万向节组件和硬盘驱动器

    公开(公告)号：US08325441B2

    公开(公告)日：2012-12-04

    申请号：US12662138

    申请日：2010-03-31

    申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hironori Araki ,  Shigeki Tanemura ,  Atsushi Iijima

    发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hironori Araki ,  Shigeki Tanemura ,  Atsushi Iijima

    IPC分类号： G11B5/02 ,  G11B11/10 ,  G11B5/31

    CPC分类号： G11B5/6005 ,  G02B6/122 ,  G11B5/3116 ,  G11B5/314 ,  G11B5/3163 ,  G11B5/6088 ,  G11B2005/0021

    摘要： A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure.

    摘要翻译： 一种热辅助磁头包括主磁极层，具有产生在介质相对表面内布置的近场光的产生端部分的近场光产生层和将光引导到近场光产生 层。 热辅助磁头包括基底层，基底槽部分的宽度随着深度方向逐渐变小并且在与介质相对表面相交的相交方向上延伸。 近场光产生层具有形成在基槽部内的内槽生成层。 槽内产生层沿着基部槽部的内壁面形成，具有薄膜状结构。