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公开(公告)号：US5952439A
公开(公告)日：1999-09-14
申请号：US226539
申请日：1994-04-12
IPC分类号： C08G59/32 , C08G77/14 , C08L61/06 , C08L63/00 , C08L79/08 , C08L83/06 , C08L101/00 , C08G77/00 , C08L283/00
CPC分类号： C08L61/06 , C08G59/3254 , C08G77/14 , C08L101/00 , C08L79/08 , C08L83/06 , C08L63/00
摘要： There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90.degree. C. to 150.degree. C.
摘要翻译： 公开了一种固化性树脂组合物，其在固化前具有优异的流动性，并且可固化形成柔性，高度防潮并且耐热冲击性强的模制树脂，所述组合物包含（A）100重量份的可固化 树脂; 和（B）0.1〜500重量份具有通式（R1SiO3 / 2）a（R2R3SiO2 / 2）b（SiO4 / 2）c的含环氧基的有机硅树脂，其中R1，R2和R3各自表示基团 选自含有环氧基的有机基团和一价烃基，条件是所述含环氧基的有机基团包含所述有机硅树脂（B）中的总硅键合有机基团的0.1至40摩尔％ ，a为正数，b为零或正数，c为零或正数，b / a的值为零至10，c /（a + b + c）的值为零至0.3 所述有机硅树脂（B）的玻璃化转变温度为-90℃〜150℃。
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公开(公告)号：US5516858A
公开(公告)日：1996-05-14
申请号：US419685
申请日：1995-04-10
IPC分类号： C08G59/32 , C08G77/14 , C08L61/06 , C08L63/00 , C08L79/08 , C08L83/06 , C08L101/00 , C08F283/00 , C08G77/00
CPC分类号： C08L61/06 , C08G59/3254 , C08G77/14 , C08L101/00 , C08L79/08 , C08L83/06 , C08L63/00
摘要： There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90.degree. C. to 150.degree. C.
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公开(公告)号：US5300607A
公开(公告)日：1994-04-05
申请号：US944141
申请日：1992-09-11
摘要： Silicone resins containing monorganosiloxane and diorganosiloxane units and exhibiting reproducible values of molecular weight and dispersity are prepared by condensing a mixture of hydrolyzed silanes, adjusting the solids content of the condensed resin and then subjecting the resultant product to a re-equilibration reaction in the presence of an alkali metal compound.
摘要翻译： 含有单有机硅氧烷和二有机硅氧烷单元的硅氧烷树脂并显示出可重现的分子量和分散性值，通过将水解硅烷的混合物冷凝，调节冷凝树脂的固体含量，然后在所存在的条件下进行再平衡反应 碱金属化合物。
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4.发明授权Microparticle catalysts for hydrosilylation reactions and thermosetting silicone compositions containing said catalyst 失效用于氢化硅烷化反应的微粒催化剂和含有所述催化剂的热固性硅氧烷组合物
公开(公告)号：US5789334A
公开(公告)日：1998-08-04
申请号：US706031
申请日：1996-08-30
摘要： A microparticle catalyst for hydrosilylation reactions which contains microparticles of an average particle diameter of 0.1 to 20 .mu.m made of a metallic catalyst for hydrosilylation reactions; a disiloxane having the general formula (R.sup.1 R.sup.2 ArSi).sub.2 O, wherein, R.sup.1 is an alkenyl group, R.sup.2 is a monovalent hydrocarbon group and Ar is an aryl group; and a resin having a glass transition temperature of 40.degree. to 200.degree. C. and thermosetting silicone composition containing the microparticle catalyst.
摘要翻译： 一种用于氢化硅烷化反应的微粒催化剂，其含有由用于氢化硅烷化反应的金属催化剂制成的平均粒径为0.1至20μm的微粒; 具有通式（R1R2ArSi）2O的二硅氧烷，其中R1为烯基，R2为一价烃基，Ar为芳基; 和玻璃化转变温度为40〜200℃的树脂和含有微粒催化剂的热固性硅氧烷组合物。
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公开(公告)号：US5877237A
公开(公告)日：1999-03-02
申请号：US357634
申请日：1994-12-16
摘要： The thermosetting silicone composition of the instant invention is comprised of (a) a diorganopolysiloxane containing alkenyl groups, (b) an organohydrogenpolysiloxane, (c) a platinum catalyst-containing silicone resin fine particle catalyst comprised of (i) a thermoplastic silicone resin containing 5 to 90 mole % PhSiO.sub.3/2 siloxane units and 5 to 20 mole % MeViSiO.sub.2/2 siloxane units, wherein Ph denotes phenyl, Me denotes methyl and Vi denotes vinyl; said resin having a glass transition point of 40.degree. to 70.degree. C. and (ii) 0.05 to 2 wt % as platinum atoms of a platinum catalyst; and (d) a hydrosilation reaction inhibiting compound. The thermosetting silicone compositions have excellent storage stability at about room temperature, and cure at a fast rate when heated.
摘要翻译： 本发明的热固性硅氧烷组合物包含（a）含有烯基的二有机聚硅氧烷，（b）有机氢聚硅氧烷，（c）含铂催化剂的有机硅树脂微粒催化剂，其由（i）含有5 至90摩尔％的PhSiO 3/2硅氧烷单元和5至20摩尔％MeViSiO 2/2硅氧烷单元，其中Ph表示苯基，Me表示甲基，Vi表示乙烯基; 所述树脂的玻璃化转变温度为40〜70℃，（ii）为铂催化剂的铂原子为0.05〜2重量％ 和（d）氢化硅烷化反应抑制化合物。 热固性硅酮组合物在约室温下具有优异的储存稳定性，并且在加热时以快速固化。
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公开(公告)号：US5300610A
公开(公告)日：1994-04-05
申请号：US13901
申请日：1993-02-05
申请人： Junji Nakanishi , Toshio Saruyama
发明人： Junji Nakanishi , Toshio Saruyama
IPC分类号： C08G77/06 , C08G77/10 , C08G77/18 , C08K5/5419 , C08L83/04
摘要： The invention provides a method for manufacturing an alkoxy radical-containing silicone resin wherein the molecular weight, viscosity, thermal transition point, and alkoxy radical content can be easily controlled. The method of the instant invention comprises combining under anhydrous conditions, (A) an alkoxysilane represented by the formula R.sup.4.sub.a Si(OR.sup.5).sub.4-a or its partial hydrolysis product wherein R.sup.4 is selected consisting of a monovalent hydrocarbon radical and a monovalent halogenated hydrocarbon radical, R.sup.5 is selected from the group consisting of an alkyl radical containing 1 to 6 carbon atoms, and a has a value of 0 to 3; and (B) an organopolysiloxane or a mixture of organopolysiloxanes selected from the group consisting of organopolysiloxanes that are made of siloxane units selected from the group consisting of R.sup.1 SiO3.sub./2 and R.sup.2 R.sup.3 SiO and mixtures thereof wherein R.sup.1, R.sup.2 and R.sup.3 are independently selected from the group consisting of monovalent hydrocarbon radicals and monovalent halogenated hydrocarbon radicals; followed by heating the mixture of (A) and (B) in the presence of a basic catalyst to perform a reequilibration reaction for said components (A) and (B).
摘要翻译： 本发明提供一种制备含烷氧基自由基的有机硅树脂的方法，其中可以容易地控制分子量，粘度，热转变点和烷氧基含量。 本发明的方法包括在无水条件下组合（A）由式R4aSi（OR5）4-a表示的烷氧基硅烷或其部分水解产物，其中R4选自一价烃基和一价卤代烃基， R5选自含有1至6个碳原子的烷基，a值为0至3; 和（B）选自有机聚硅氧烷的有机聚硅氧烷或有机聚硅氧烷的混合物，所述有机聚硅氧烷由选自由R 1 SiO 3/2和R 2 R 3 SiO组成的组的硅氧烷单元制成的有机聚硅氧烷及其混合物，其中R 1，R 2和R 3独立地选自 由一价烃基和一价卤代烃基组成; 然后在碱性催化剂的存在下加热（A）和（B）的混合物，以对所述组分（A）和（B）进行重新平衡反应。
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公开(公告)号：US08262970B2
公开(公告)日：2012-09-11
申请号：US10599041
申请日：2005-03-08
CPC分类号： H01L21/566 , H01L23/296 , H01L23/3121 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein said curable liquid silicone composition has viscosity of 90 Pa·s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf·cm is not less than 1 min., while the time interval during which the torque grows from 1 kgf·cm to 5 kgf·cm is not more than 1 min.
摘要翻译： 一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将填充模具和非密封半导体器件之间的空间的可固化液体硅氧烷组合物在预定的成型温度下进行压缩成型而密封在固化的硅氧烷体中， 其中所述可固化液体硅氧烷组合物在室温下的粘度为90Pa·s以下，从成型温度下的立方微米的扭矩测定之后的时刻到扭矩达到1kgf·cm时的时间间隔为 不小于1分钟，扭矩从1 kgf·cm增加到5 kgf·cm的时间间隔不超过1分钟。
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公开(公告)号：US20070273050A1
公开(公告)日：2007-11-29
申请号：US10599041
申请日：2005-03-08
CPC分类号： H01L21/566 , H01L23/296 , H01L23/3121 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein the curable liquid silicone composition has viscosity of 90 Pa·s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf·cm being not less than 1 min., while the time
摘要翻译： 一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将填充模具和非密封半导体器件之间的空间的可固化液体硅氧烷组合物在预定的成型温度下进行压缩成型而密封在固化的硅氧烷体中， 其中所述可固化液体硅氧烷组合物在室温下的粘度为90Pa·s或更低，从在成型温度下用微量计的扭矩测量之后的时刻到扭矩达到1kgf.cm时的时间间隔为 不小于1分钟，而时间
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公开(公告)号：US20070216021A1
公开(公告)日：2007-09-20
申请号：US10584032
申请日：2004-12-07
IPC分类号： H01L21/56 , H01L23/053
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , H01L21/566 , H01L23/3128 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/97 , H01L2924/01029 , H01L2924/12042 , H01L2924/181 , C08L83/00 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/85
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.
摘要翻译： 一种制造半导体器件的方法，其通过将半导体器件放置在模具中并对填充所述模具和所述半导体器件之间的空间的可固化硅氧烷组合物进行压塑而密封在固化的硅氧烷体中，其中所述可固化有机硅组合物包含以下 组分：（A）每分子具有至少两个烯基的有机聚硅氧烷; （B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）铂型催化剂; 和（D）填料，其中组分（A）和（B）中的至少一种含有T单元硅氧烷和/或Q-单元硅氧烷。 通过利用该方法，密封半导体器件在密封材料中没有空隙，并且可以控制固化的硅氧烷体的厚度。
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公开(公告)号：US08877406B2
公开(公告)日：2014-11-04
申请号：US13703578
申请日：2010-06-15
申请人： Hiroo Yoshikawa , Junji Nakanishi , Akito Kawasumi , Tsunemasa Nishida , Kenji Tsubosaka , Takeaki Saito
发明人： Hiroo Yoshikawa , Junji Nakanishi , Akito Kawasumi , Tsunemasa Nishida , Kenji Tsubosaka , Takeaki Saito
CPC分类号： H01M8/0271 , H01M8/0247 , H01M8/0276 , H01M8/028 , H01M8/0284 , H01M8/0286 , H01M8/1065 , H01M2008/1095 , Y02E60/521 , Y02P70/56
摘要： A fuel cell includes a separator and a power generating body. The separator and power generating body are laminated each other. The power generating body is equipped at least with an electrolyte membrane. The fuel cell comprises: a sealing part that seals reaction gas supplied for electrochemical reactions at the fuel cell between the power generating body and the separator at an outer circumference part of the fuel cell, wherein a convex part and a recess are fit together in the sealing part. The convex part is formed projecting in the lamination direction on one of the power generating body and the separator, and the recess is formed recessed in the lamination direction on the other of the power generating body and the separator. At least one of the convex part and the recess is formed with a polymer material that expands with moisture absorption.
摘要翻译： 燃料电池包括分离器和发电体。 分离器和发电体彼此层叠。 发电体至少装有电解质膜。 燃料电池包括：密封部分，其密封在燃料电池的外周部分处的发电体和分离器之间的燃料电池处供应用于电化学反应的反应气体，其中凸部和凹部配合在一起 密封件。 所述凸部在所述发电体和所述隔板中的一个上沿所述层叠方向突出地形成，并且所述凹部在所述发电体和所述隔板的另一个上沿层叠方向形成为凹陷。 凸部和凹部中的至少一个形成有以吸湿方式膨胀的聚合物材料。
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