NUT, FEMALE THREAD MACHINING DEVICE AND FEMALE THREAD MACHINING METHOD
    1.
    发明申请
    NUT, FEMALE THREAD MACHINING DEVICE AND FEMALE THREAD MACHINING METHOD 有权
    NUT,母螺纹加工装置和母螺纹加工方法

    公开(公告)号:US20100056284A1

    公开(公告)日:2010-03-04

    申请号:US12547001

    申请日:2009-08-25

    IPC分类号: B21K1/64 F16B39/28

    摘要: There is provided a nut having a thread portion having a female thread, a metallic plate portion having a base segment, and a hardness gradient portion provided between the thread portion and the metallic plate portion. The thread portion, metallic plate portion and the hardness gradient portion are monolithic each other, a metallographic structure of the metallic plate portion differs from a metallographic structure of the thread portion and a hardness of the hardness gradient portion is lower than a hardness of the thread portion and lowers from the thread portion toward the metallic plate portion.

    摘要翻译: 提供一种具有内螺纹的螺纹部分的螺母,具有基部段的金属板部分和设置在螺纹部分和金属板部分之间的硬度梯度部分。 螺纹部分,金属板部分和硬度梯度部分是彼此整体的,金属板部分的金相组织与螺纹部分的金相组织不同,硬度梯度部分的硬度低于螺纹的硬度 从螺纹部分向金属板部分下降。

    Nut, female thread machining device and female thread machining method
    2.
    发明授权
    Nut, female thread machining device and female thread machining method 有权
    螺母,内螺纹加工装置和内螺纹加工方法

    公开(公告)号:US08419556B2

    公开(公告)日:2013-04-16

    申请号:US12547001

    申请日:2009-08-25

    IPC分类号: B21D53/24 B21H3/08 B21K1/64

    摘要: There is provided a nut having a thread portion having a female thread, a metallic plate portion having a base segment, and a hardness gradient portion provided between the thread portion and the metallic plate portion. The thread portion, metallic plate portion and the hardness gradient portion are monolithic each other, a metallographic structure of the metallic plate portion differs from a metallographic structure of the thread portion and a hardness of the hardness gradient portion is lower than a hardness of the thread portion and lowers from the thread portion toward the metallic plate portion.

    摘要翻译: 提供一种具有内螺纹的螺纹部分的螺母,具有基部段的金属板部分和设置在螺纹部分和金属板部分之间的硬度梯度部分。 螺纹部分,金属板部分和硬度梯度部分是彼此整体的,金属板部分的金相组织与螺纹部分的金相组织不同,硬度梯度部分的硬度低于螺纹的硬度 从螺纹部分向金属板部分下降。

    Threading method and threading apparatus
    3.
    发明申请
    Threading method and threading apparatus 审中-公开
    穿线方法和穿线装置

    公开(公告)号:US20090257837A1

    公开(公告)日:2009-10-15

    申请号:US12384856

    申请日:2009-04-09

    IPC分类号: B23B35/00 B23B47/20

    摘要: A threading method for threading a work 18 includes a supporting portion moving-up step for moving a supporting portion 17 upward by a predetermined distance by using an elevational mechanism 15 without rotating a tap 20 inserted into the work 18. Thus, the bent state of the robot arm 11 can be eliminated by moving the supporting portion 17 upward. In this case, since the supporting portion 17 is moved upward artificially, the supporting portion 17 can be moved up in a short time. That is, the bent state of the robot arm 11 can be eliminated in a short time and so the processing efficiency of the threading step can be improved.

    摘要翻译: 用于穿线工件18的穿线方法包括支撑部分移动步骤,用于通过使用升降机构15将支撑部分17向上移动预定距离,而不旋转插入工件18中的龙头20。因此,弯曲状态 可以通过向上移动支撑部17来消除机器人手臂11。 在这种情况下,由于支撑部分17被人为地向上移动,支撑部分17可以在短时间内向上移动。 也就是说,可以在短时间内消除机器人手臂11的弯曲状态,从而可以提高穿线步骤的处理效率。

    THREAD FORMING METHOD, THREAD FORMING DEVICE, AND THREAD FORMING TOOL
    4.
    发明申请
    THREAD FORMING METHOD, THREAD FORMING DEVICE, AND THREAD FORMING TOOL 失效
    螺纹成型方法,螺纹成形装置和螺纹成形工具

    公开(公告)号:US20070101787A1

    公开(公告)日:2007-05-10

    申请号:US11555269

    申请日:2006-10-31

    IPC分类号: B21C37/29

    摘要: A thread forming device 10a is provided with a thread forming tool 32 for forming a thread portion 14 at a frame 12, a first motor 38 for controlling to rotate the thread forming tool 32, and a second motor 40 for controlling to extract and retract the thread forming tool 32. Further, the thread forming tool 32 is provided with a pilot hole forming portion 86 provided with a spiral groove 80b at a front end portion 80 in a taper shape, and a thread forming portion 84 constituted continuously to the pilot hole forming portion 86 and provided with a spiral groove 84b.

    摘要翻译: 螺纹形成装置10a具有用于在框架12处形成螺纹部分14的螺纹成形工具32,用于控制旋转成形工具32的第一马达38和用于控制提取和缩回的第二马达40 螺纹成形工具32。 另外,螺纹成形工具32在前端部80呈锥形的螺旋槽80b设置有导向孔形成部86,螺纹形成部84与导向孔形成部86连续地形成, 设有螺旋槽84b。

    Thread forming method, thread forming device, and thread forming tool
    5.
    发明授权
    Thread forming method, thread forming device, and thread forming tool 失效
    螺纹成型方法,螺纹成型装置和螺纹成型工具

    公开(公告)号:US07552610B2

    公开(公告)日:2009-06-30

    申请号:US11555269

    申请日:2006-10-31

    IPC分类号: B21C37/29 B21H3/02 B21J13/02

    摘要: A thread forming device 10a is provided with a thread forming tool 32 for forming a thread portion 14 at a frame 12, a first motor 38 for controlling to rotate the thread forming tool 32, and a second motor 40 for controlling to extract and retract the thread forming tool 32. Further, the thread forming tool 32 is provided with a pilot hole forming portion 86 provided with a spiral groove 80b at a front end portion 80 in a taper shape, and a thread forming portion 84 constituted continuously to the pilot hole forming portion 86 and provided with a spiral groove 84b.

    摘要翻译: 螺纹形成装置10a设置有用于在框架12处形成螺纹部分14的螺纹成形工具32,用于控制旋转成形工具32的第一马达38和用于控制以提取和缩回的第二马达40 另外,螺纹成型工具32具有在前端部80呈锥形的螺旋状槽80b的导向孔形成部86,以及与导向孔连续地构成的螺纹形成部84 形成部分86并设有螺旋槽84b。

    Semiconductor integrated circuit device
    9.
    发明授权
    Semiconductor integrated circuit device 有权
    半导体集成电路器件

    公开(公告)号:US08786092B2

    公开(公告)日:2014-07-22

    申请号:US13240054

    申请日:2011-09-22

    IPC分类号: H01L23/50

    摘要: A semiconductor integrated circuit device includes: a rectangular shaped semiconductor substrate; a metal wiring layer formed on or over the semiconductor substrate; and a passivation layer covering the metal wiring layer. A corner non-wiring region where no portion of the metal wiring layer is formed is disposed in a corner of the semiconductor substrate. A slit is formed in a portion of the metal wiring layer which is close to the corner of the semiconductor substrate. The passivation layer includes a first passivation layer which is formed on the metal wiring layer and a second passivation layer which is formed on the first passivation layer. The first passivation layer is formed of a material that is softer than a material of the second passivation layer.

    摘要翻译: 半导体集成电路器件包括:矩形半导体衬底; 形成在所述半导体衬底上或之上的金属布线层; 以及覆盖金属布线层的钝化层。 在半导体基板的角部设置没有形成金属布线层的部分的角部非布线区域。 在金属布线层的靠近半导体基板的角部的部分形成狭缝。 钝化层包括形成在金属布线层上的第一钝化层和形成在第一钝化层上的第二钝化层。 第一钝化层由比第二钝化层的材料软的材料形成。