Chemically amplified positive resist composition and patterning process
    2.
    发明授权
    Chemically amplified positive resist composition and patterning process 有权
    化学扩增正性抗蚀剂组成和图案化工艺

    公开(公告)号:US07335458B2

    公开(公告)日:2008-02-26

    申请号:US11354204

    申请日:2006-02-15

    IPC分类号: G03F7/004 G03F7/30

    摘要: A chemically amplified positive resist composition is provided comprising (A) a resin containing acid labile groups other than acetal type which changes its solubility in an alkaline developer as a result of the acid labile groups being eliminated under the action of acid and (B) specific sulfonium salts as a photoacid generator.The composition is improved in resolution and focus latitude, minimized in line width variation and profile degradation even on prolonged PED, improved in pattern profile after development, minimized in pattern feature size variation within the wafer plane by uneven development and thus best suited in the deep-UV lithography.

    摘要翻译: 提供一种化学放大正性抗蚀剂组合物,其包含(A)除了缩醛型以外的酸不稳定基团的树脂,其在酸性作用下由于酸不稳定基团被消除而改变其在碱性显影剂中的溶解度,(B)具体 锍盐作为光致酸发生剂。 组合物在分辨率和对焦纬度方面得到改善,即使在长时间的PED下也减少了线宽变化和轮廓退化,改善了显影后的图案轮廓,通过不平坦的发展使晶片平面内的图案特征尺寸变化最小化,因此最适合于深度 -UV光刻。

    Chemically amplified positive resist composition and patterning process
    3.
    发明申请
    Chemically amplified positive resist composition and patterning process 有权
    化学扩增正性抗蚀剂组成和图案化工艺

    公开(公告)号:US20060188810A1

    公开(公告)日:2006-08-24

    申请号:US11354204

    申请日:2006-02-15

    IPC分类号: G03C1/76

    摘要: A chemically amplified positive resist composition is provided comprising (A) a resin containing acid labile groups other than acetal type which changes its solubility in an alkaline developer as a result of the acid labile groups being eliminated under the action of acid and (B) specific sulfonium salts as a photoacid generator. The composition is improved in resolution and focus latitude, minimized in line width variation and profile degradation even on prolonged PED, improved in pattern profile after development, minimized in pattern feature size variation within the wafer plane by uneven development and thus best suited in the deep-UV lithography.

    摘要翻译: 提供一种化学放大正性抗蚀剂组合物,其包含(A)除了缩醛型以外的酸不稳定基团的树脂,其在酸性作用下由于酸不稳定基团被消除而改变其在碱性显影剂中的溶解度,(B)具体 锍盐作为光致酸发生剂。 组合物在分辨率和对焦纬度方面得到改善,即使在长时间的PED下也减少了线宽变化和轮廓退化,改善了显影后的图案轮廓,通过不平坦的发展使晶片平面内的图案特征尺寸变化最小化,因此最适合于深度 -UV光刻。

    Resist compositions and patterning process
    6.
    发明授权
    Resist compositions and patterning process 有权
    抗蚀剂组合物和图案化工艺

    公开(公告)号:US06338931B1

    公开(公告)日:2002-01-15

    申请号:US09637595

    申请日:2000-08-15

    IPC分类号: G03F7039

    摘要: A chemical amplification type resist composition contains as a photoacid generator a sulfonyldiazomethane compound of the formula (1): wherein R1 is C1-10 alkyl or C6-14 aryl, R2 is C1-6 alkyl, G is SO2 or CO, R3 is C1-10 alkyl or C6-14 aryl, p is an integer of 0 to 4, q is an integer of 1 to 5, 1≦p+q≦5, n is 1 or 2, m is 0 or 1, and n+m=2. The composition is suited for microfabrication, especially by deep UV lithography because of many advantages including improved resolution, minimized line width variation or shape degradation even on long-term PED, minimized debris after coating, development and peeling, and improved pattern profile after development.

    摘要翻译: 化学放大型抗蚀剂组合物含有式(1)的磺酰基二氮甲烷化合物作为光酸产生剂:其中R1是C1-10烷基或C6-14芳基,R2是C1-6烷基,G是SO2或CO,R3是C1 -10烷基或C6-14芳基,p为0〜4的整数,q为1〜5的整数,1 <= p + q <= 5,n为1或2,m为0或1, n + m = 2。 该组合物特别适用于微细加工,因为包括改进的分辨率,最小化的线宽变化或形状退化的许多优点,即使在长期PED,涂布后的最小化碎片,显影和剥离以及显影后的改进的图案轮廓方面也是如此。

    Photo acid generator, chemical amplification resist material
    8.
    发明授权
    Photo acid generator, chemical amplification resist material 有权
    照片酸发生器,化学放大抗蚀材料

    公开(公告)号:US07211367B2

    公开(公告)日:2007-05-01

    申请号:US11373925

    申请日:2006-03-13

    IPC分类号: G03F7/031

    摘要: A high resolution resist material comprising an acid generator is provided so that high sensitivity and high resolution for high energy rays of 300 nm or less, small line-edge roughness, and excellence in heat stability and storage stability are obtained. Moreover, a pattern formation method using this resist material are provided. Specifically, a novel compound of the following general formula (1); and a positive resist material comprising this compound preferably as a photo acid generator, and a base resin; are provided. This positive resist material may contain a basic compound or a dissolution inhibitor. Further, the present invention provides a pattern formation method comprising the steps of applying this positive resist material on a substrate, then heat-treating the material, exposing the treated material to a high energy ray having a wavelength of 300 nm or less via a photo mask, optionally heat-treating the exposed material, and developing the material using a developer

    摘要翻译: 提供了包含酸产生器的高分辨率抗蚀剂材料,从而获得了300nm以下的高能量射线的高灵敏度和高分辨率,小的线边缘粗糙度,以及热稳定性和储存稳定性方面的优异性。 此外,提供了使用该抗蚀剂材料的图案形成方法。 具体地,下述通式(1)的新化合物; 以及优选含有该化合物作为光酸发生剂的正性抗蚀剂材料和基础树脂; 被提供。 该正性抗蚀剂材料可含有碱性化合物或溶解抑制剂。 此外,本发明提供了一种图案形成方法,包括以下步骤:将该正性抗蚀剂材料涂布在基板上,然后对该材料进行热处理,通过照片将经处理的材料暴露于波长为300nm以下的高能量射线 掩模,任选地热处理暴露的材料,以及使用显影剂显影材料