公开(公告)号：US20140124931A1

公开(公告)日：2014-05-08

申请号：US14071999

申请日：2013-11-05

申请人： Young Ju SHIN ,  Kyu Bong KIM ,  Hyun Joo SEO ,  Kyoung Hun SHIN ,  Woo Jun LIM

发明人： Young Ju SHIN ,  Kyu Bong KIM ,  Hyun Joo SEO ,  Kyoung Hun SHIN ,  Woo Jun LIM

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  C09J9/02 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.

摘要翻译： 通过各向异性导电膜连接的半导体器件，各向异性导电膜包括聚氨酯树脂; 选自乙烯 - 乙酸乙烯酯共聚物树脂，丙烯腈树脂和苯乙烯树脂中的至少一种其它树脂; 丙烯酸异冰片酯; 和导电颗粒。

公开(公告)号：US20140159229A1

公开(公告)日：2014-06-12

申请号：US14072872

申请日：2013-11-06

申请人： Kyoung Hun SHIN ,  Kyu Bong KIM ,  Hyun Joo SEO ,  Young Ju SHIN ,  Woo Jun LIM

发明人： Kyoung Hun SHIN ,  Kyu Bong KIM ,  Hyun Joo SEO ,  Young Ju SHIN ,  Woo Jun LIM

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27502 ,  H01L2224/2784 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/07811 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/00

摘要： A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.

摘要翻译： 通过各向异性导电膜连接的半导体器件，该膜在固化后在40℃下的储能模量为100MPa〜300MPa，DSC的峰值点为80℃〜90℃ （差示扫描量热仪）轮廓。

公开(公告)号：US20140097548A1

公开(公告)日：2014-04-10

申请号：US14049243

申请日：2013-10-09

申请人： Kyoung Hun SHIN ,  Do Hyun PARK ,  Hyun Joo SEO ,  Young Ju SHIN ,  Kyu Bong KIM ,  Woo Jun LIM

发明人： Kyoung Hun SHIN ,  Do Hyun PARK ,  Hyun Joo SEO ,  Young Ju SHIN ,  Kyu Bong KIM ,  Woo Jun LIM

IPC分类号： H01L23/00

CPC分类号： H01B1/22 ,  C09J2201/602 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/32135 ,  H01L2224/32225 ,  H01L2224/81903 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

摘要： A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

摘要翻译： 使用各向异性导电粘合剂组合物连接的半导体器件，所述各向异性导电粘合剂组合物包含热固性聚合引发剂; （甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯，其中（甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯以组合物中总重量的1重量％至25重量％的量存在于组合物中 组合固体含量。

公开(公告)号：US20140138828A1

公开(公告)日：2014-05-22

申请号：US14084741

申请日：2013-11-20

申请人： Do Hyun PARK ,  Kyu Bong KIM ,  Woo Jun LIM

发明人： Do Hyun PARK ,  Kyu Bong KIM ,  Woo Jun LIM

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  C09J9/02 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83

摘要： A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members.

摘要翻译： 一种半导体器件，包括：第一连接构件，包括第一电极; 包括第二电极的第二连接构件; 以及在所述第一连接构件和所述第二连接构件之间的各向异性导电膜，所述各向异性导电膜将所述第一电极接合到所述第二电极，其中所述各向异性导电膜在所述第二连接构件的前端之间在所述第二连接构件的端子间空间中呈现线性凹陷 - 将各向异性导电膜压缩和初级压缩到第一和第二连接构件上。

公开(公告)号：US20130196129A1

公开(公告)日：2013-08-01

申请号：US13803266

申请日：2013-03-14

申请人： Woo Suk LEE ,  Bong Yong KIM ,  Dong Seon UH ,  Jin Seong PARK ,  Kyoung Soo PARK ,  Woo Jun LIM ,  Kyung Jin LEE

发明人： Woo Suk LEE ,  Bong Yong KIM ,  Dong Seon UH ,  Jin Seong PARK ,  Kyoung Soo PARK ,  Woo Jun LIM ,  Kyung Jin LEE

IPC分类号： H01R4/04

CPC分类号： H01R4/04 ,  B32B7/12 ,  C09J7/22 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/622 ,  Y10T428/24942

摘要： An anisotropic conductive film includes a first insulating adhesive layer, a conductive adhesive layer, and a second insulating adhesive layer which are sequentially stacked on a base film, wherein an adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.1 to about 20.

摘要翻译： 各向异性导电膜包括依次堆叠在基膜上的第一绝缘粘合剂层，导电粘合剂层和第二绝缘粘合剂层，其中第二绝缘粘合剂层与第一绝缘粘合剂层的粘合强度比为约 1.1〜约20。

公开(公告)号：US20130213691A1

公开(公告)日：2013-08-22

申请号：US13834349

申请日：2013-03-15

申请人： Kyoung Soo PARK ,  Woo Suk LEE ,  Woo Jun LIM ,  Kyung Jin LEE ,  Bong Yong KIM ,  Jin Seong PARK ,  Dong Seon UH ,  Youn Jo KO ,  Jang Hyun CHO ,  Sang Sik BAE ,  Jin Kyu KIM

发明人： Kyoung Soo PARK ,  Woo Suk LEE ,  Woo Jun LIM ,  Kyung Jin LEE ,  Bong Yong KIM ,  Jin Seong PARK ,  Dong Seon UH ,  Youn Jo KO ,  Jang Hyun CHO ,  Sang Sik BAE ,  Jin Kyu KIM

IPC分类号： H01B3/08 ,  H01B13/00 ,  H01B7/00

CPC分类号： H01B3/082 ,  C08K3/08 ,  C09J7/10 ,  C09J133/068 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  H01B7/00 ,  H01B13/00 ,  H01L24/26 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/2711 ,  H01L2224/27436 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.

摘要翻译： 各向异性导电膜，各向异性导电膜包括层叠在绝缘层上的绝缘层和导电层，导电层含有导电颗粒，其中玻璃基板在各向异性导电层的上表面和下表面上彼此面对 并以3MPa（基于样品面积）和160℃（基于各向异性导电膜的检测温度）5秒压制各向异性导电膜，将绝缘层的面积与 导电层的厚度为约1.3:1至约3.0:1。