摘要:
A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.
摘要:
A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.
摘要:
A transistor and a method of fabricating the same: The transistor includes an isolation layer disposed in a semiconductor substrate to define an active region. A pair of source/drain regions is disposed in the active region, spaced apart from each other. A channel region is interposed between the pair of the source/drain regions. The active region has a mesa disposed across the channel region. The mesa extends to the source/drain regions. A gate electrode is disposed to cross the active region along the direction across the mesa.
摘要:
A transistor and a method of fabricating the same: The transistor includes an isolation layer disposed in a semiconductor substrate to define an active region. A pair of source/drain regions is disposed in the active region, spaced apart from each other. A channel region is interposed between the pair of the source/drain regions. The active region has a mesa disposed across the channel region. The mesa extends to the source/drain regions. A gate electrode is disposed to cross the active region along the direction across the mesa.
摘要:
A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.
摘要:
A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.
摘要:
Disclosed is a method for fabricating a gate of a field effect transistor. The method comprises a) forming a field oxide layer on a silicon substrate and then applying a photoresist layer in order to define a gate, b) etching the silicon substrate using the photoresist layer as a mask, c) sequentially depositing a gate oxide layer and a gate polysilicon layer on an entire surface of the silicon substrate and defining the gate using the photoresist layer, d) etching the resulting silicon substrate using the photoresist layer as a mask to form the gate and forming an N− ion region by means of ion implantation, and e) depositing and etching back an oxide layer to form a sidewall oxide layer and forming an N+ ion region by means of ion implantation. Consequently, the gate is made by etching the silicon substrate. Thus, a length of the gate is reduced, so that it is possible not only to make a cell area smaller but also to prevent a short-channel effect.
摘要:
Disclosed is a method for fabricating a gate of a field effect transistor. The method comprises a) forming a field oxide layer on a silicon substrate and then applying a photoresist layer in order to define a gate, b) etching the silicon substrate using the photoresist layer as a mask, c) sequentially depositing a gate oxide layer and a gate polysilicon layer on an entire surface of the silicon substrate and defining the gate using the photoresist layer, d) etching the resulting silicon substrate using the photoresist layer as a mask to form the gate and forming an N− ion region by means of ion implantation, and e) depositing and etching back an oxide layer to form a sidewall oxide layer and forming an N+ ion region by means of ion implantation. Consequently, the gate is made by etching the silicon substrate. Thus, a length of the gate is reduced, so that it is possible not only to make a cell area smaller but also to prevent a short-channel effect.
摘要:
On embodiment of a contact structure may include a lower insulation layer on a lower substrate, an upper substrate on the lower insulation layer, a groove penetrating the upper substrate to extend into the lower insulation layer, the groove below an interface between the upper substrate and the lower insulation layer, an upper insulation layer in the groove, and a contact plug penetrating the upper insulation layer in the groove to extend into the lower insulation layer.
摘要:
A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.