METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING METALLIZATION COMPRISING SELECT LINES, BIT LINES AND WORD LINES
    1.
    发明申请
    METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING METALLIZATION COMPRISING SELECT LINES, BIT LINES AND WORD LINES 有权
    形成包含选择线,位线和字线的金属化的半导体器件的方法

    公开(公告)号:US20120009767A1

    公开(公告)日:2012-01-12

    申请号:US13236000

    申请日:2011-09-19

    IPC分类号: H01L21/20

    摘要: A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.

    摘要翻译: 半导体器件包括:半导体衬底,包括具有单元区域的第一区域和具有外围电路区域的第二区域;半导体衬底上的第一晶体管;覆盖第一晶体管的第一保护层;第一保护层上的第一绝缘层; ,第一区域中的第一绝缘层上的半导体图案,半导体图案上的第二晶体管,覆盖第二晶体管的第二保护层,第二保护层的厚度大于第一保护层的厚度,第二绝缘层 在第二保护层和第二区域的第一绝缘层上。

    Semiconductor device and method for forming the same
    2.
    发明申请
    Semiconductor device and method for forming the same 有权
    半导体装置及其形成方法

    公开(公告)号:US20080067517A1

    公开(公告)日:2008-03-20

    申请号:US11655115

    申请日:2007-01-19

    IPC分类号: H01L29/772 H01L21/8234

    摘要: A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.

    摘要翻译: 半导体器件包括:半导体衬底,包括具有单元区域的第一区域和具有外围电路区域的第二区域;半导体衬底上的第一晶体管;覆盖第一晶体管的第一保护层;第一保护层上的第一绝缘层; ,第一区域中的第一绝缘层上的半导体图案,半导体图案上的第二晶体管,覆盖第二晶体管的第二保护层,第二保护层的厚度大于第一保护层的厚度,第二绝缘层 在第二保护层和第二区域的第一绝缘层上。

    Transistor and method of fabricating the same
    3.
    发明授权
    Transistor and method of fabricating the same 有权
    晶体管及其制造方法

    公开(公告)号:US07170133B2

    公开(公告)日:2007-01-30

    申请号:US10977036

    申请日:2004-10-28

    摘要: A transistor and a method of fabricating the same: The transistor includes an isolation layer disposed in a semiconductor substrate to define an active region. A pair of source/drain regions is disposed in the active region, spaced apart from each other. A channel region is interposed between the pair of the source/drain regions. The active region has a mesa disposed across the channel region. The mesa extends to the source/drain regions. A gate electrode is disposed to cross the active region along the direction across the mesa.

    摘要翻译: 晶体管及其制造方法:晶体管包括设置在半导体衬底中以限定有源区的隔离层。 一对源极/漏极区域设置在有源区域中,彼此间隔开。 沟道区域插入在一对源极/漏极区域之间。 有源区域具有穿过沟道区域设置的台面。 台面延伸到源极/漏极区域。 栅电极设置成跨过台面的方向跨越有源区。

    Transistor and method of fabricating the same
    4.
    发明申请
    Transistor and method of fabricating the same 有权
    晶体管及其制造方法

    公开(公告)号:US20050110074A1

    公开(公告)日:2005-05-26

    申请号:US10977036

    申请日:2004-10-28

    摘要: A transistor and a method of fabricating the same: The transistor includes an isolation layer disposed in a semiconductor substrate to define an active region. A pair of source/drain regions is disposed in the active region, spaced apart from each other. A channel region is interposed between the pair of the source/drain regions. The active region has a mesa disposed across the channel region. The mesa extends to the source/drain regions. A gate electrode is disposed to cross the active region along the direction across the mesa.

    摘要翻译: 晶体管及其制造方法:晶体管包括设置在半导体衬底中以限定有源区的隔离层。 一对源极/漏极区域设置在有源区域中,彼此间隔开。 沟道区域插入在一对源极/漏极区域之间。 有源区域具有穿过沟道区域设置的台面。 台面延伸到源极/漏极区域。 栅电极设置成跨过台面的方向跨越有源区。

    Method for forming semiconductor device having metallization comprising select lines, bit lines and word lines
    5.
    发明授权
    Method for forming semiconductor device having metallization comprising select lines, bit lines and word lines 有权
    用于形成具有包括选择线,位线和字线的金属化的半导体器件的方法

    公开(公告)号:US08399308B2

    公开(公告)日:2013-03-19

    申请号:US13236000

    申请日:2011-09-19

    IPC分类号: H01L21/82

    摘要: A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.

    摘要翻译: 半导体器件包括:半导体衬底,包括具有单元区域的第一区域和具有外围电路区域的第二区域;半导体衬底上的第一晶体管;覆盖第一晶体管的第一保护层;第一保护层上的第一绝缘层; ,第一区域中的第一绝缘层上的半导体图案,半导体图案上的第二晶体管,覆盖第二晶体管的第二保护层,第二保护层的厚度大于第一保护层的厚度,第二绝缘层 在第二保护层和第二区域的第一绝缘层上。

    Method for forming semiconductor device having metallization comprising select lines, bit lines and word lines
    6.
    发明申请
    Method for forming semiconductor device having metallization comprising select lines, bit lines and word lines 失效
    用于形成具有包括选择线,位线和字线的金属化的半导体器件的方法

    公开(公告)号:US20100035386A1

    公开(公告)日:2010-02-11

    申请号:US12588240

    申请日:2009-10-08

    IPC分类号: H01L21/768

    摘要: A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.

    摘要翻译: 半导体器件包括:半导体衬底,包括具有单元区域的第一区域和具有外围电路区域的第二区域;半导体衬底上的第一晶体管;覆盖第一晶体管的第一保护层;第一保护层上的第一绝缘层; ,第一区域中的第一绝缘层上的半导体图案,半导体图案上的第二晶体管,覆盖第二晶体管的第二保护层,第二保护层的厚度大于第一保护层的厚度,第二绝缘层 在第二保护层和第二区域的第一绝缘层上。

    Transistor and method of fabricating the same
    7.
    发明授权
    Transistor and method of fabricating the same 有权
    晶体管及其制造方法

    公开(公告)号:US07563683B2

    公开(公告)日:2009-07-21

    申请号:US11611719

    申请日:2006-12-15

    IPC分类号: H01L21/336

    摘要: Disclosed is a method for fabricating a gate of a field effect transistor. The method comprises a) forming a field oxide layer on a silicon substrate and then applying a photoresist layer in order to define a gate, b) etching the silicon substrate using the photoresist layer as a mask, c) sequentially depositing a gate oxide layer and a gate polysilicon layer on an entire surface of the silicon substrate and defining the gate using the photoresist layer, d) etching the resulting silicon substrate using the photoresist layer as a mask to form the gate and forming an N− ion region by means of ion implantation, and e) depositing and etching back an oxide layer to form a sidewall oxide layer and forming an N+ ion region by means of ion implantation. Consequently, the gate is made by etching the silicon substrate. Thus, a length of the gate is reduced, so that it is possible not only to make a cell area smaller but also to prevent a short-channel effect.

    摘要翻译: 公开了一种用于制造场效应晶体管的栅极的方法。 该方法包括:a)在硅衬底上形成场氧化物层,然后施加光致抗蚀剂层以限定栅极,b)使用光致抗蚀剂层作为掩模蚀刻硅衬底,c)依次沉积栅极氧化物层和 在硅衬底的整个表面上的栅极多晶硅层,并使用光致抗蚀剂层限定栅极; d)使用光致抗蚀剂层作为掩模蚀刻所得到的硅衬底,以形成栅极并通过离子形成N-离子区域 注入,以及e)沉积和蚀刻回氧化物层以形成侧壁氧化物层,并通过离子注入形成N +离子区域。 因此,通过蚀刻硅衬底来制造栅极。 因此,栅极的长度减小,使得不仅可以使单元区域更小,而且可以防止短沟道效应。

    TRANSISTOR AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    TRANSISTOR AND METHOD OF FABRICATING THE SAME 有权
    晶体管及其制造方法

    公开(公告)号:US20070087491A1

    公开(公告)日:2007-04-19

    申请号:US11611719

    申请日:2006-12-15

    IPC分类号: H01L21/84 H01L21/00

    摘要: Disclosed is a method for fabricating a gate of a field effect transistor. The method comprises a) forming a field oxide layer on a silicon substrate and then applying a photoresist layer in order to define a gate, b) etching the silicon substrate using the photoresist layer as a mask, c) sequentially depositing a gate oxide layer and a gate polysilicon layer on an entire surface of the silicon substrate and defining the gate using the photoresist layer, d) etching the resulting silicon substrate using the photoresist layer as a mask to form the gate and forming an N− ion region by means of ion implantation, and e) depositing and etching back an oxide layer to form a sidewall oxide layer and forming an N+ ion region by means of ion implantation. Consequently, the gate is made by etching the silicon substrate. Thus, a length of the gate is reduced, so that it is possible not only to make a cell area smaller but also to prevent a short-channel effect.

    摘要翻译: 公开了一种用于制造场效应晶体管的栅极的方法。 该方法包括:a)在硅衬底上形成场氧化物层,然后施加光致抗蚀剂层以限定栅极,b)使用光致抗蚀剂层作为掩模蚀刻硅衬底,c)依次沉积栅极氧化物层和 在硅衬底的整个表面上的栅极多晶硅层,并使用光致抗蚀剂层限定栅极; d)使用光致抗蚀剂层作为掩模蚀刻所得的硅衬底,以形成栅极并形成N + >离子区域,以及e)通过离子注入沉积和蚀刻回氧化物层以形成侧壁氧化物层并形成N + +离子区域。 因此,通过蚀刻硅衬底来制造栅极。 因此,栅极的长度减小,使得不仅可以使单元区域更小,而且可以防止短沟道效应。

    Semiconductor memory device having metallization comprising select lines, bit lines and word lines
    10.
    发明授权
    Semiconductor memory device having metallization comprising select lines, bit lines and word lines 有权
    具有包括选择线,位线和字线的金属化的半导体存储器件

    公开(公告)号:US07601998B2

    公开(公告)日:2009-10-13

    申请号:US11655115

    申请日:2007-01-19

    IPC分类号: H01L29/80

    摘要: A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.

    摘要翻译: 半导体器件包括:半导体衬底,包括具有单元区域的第一区域和具有外围电路区域的第二区域;半导体衬底上的第一晶体管;覆盖第一晶体管的第一保护层;第一保护层上的第一绝缘层; ,第一区域中的第一绝缘层上的半导体图案,半导体图案上的第二晶体管,覆盖第二晶体管的第二保护层,第二保护层的厚度大于第一保护层的厚度,第二绝缘层 在第二保护层和第二区域的第一绝缘层上。