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    IMAGE SENSOR CHIP PACKAGE AND METHOD FOR FORMING THE SAME
    1.
    发明申请
    IMAGE SENSOR CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
    图像传感器芯片封装及其形成方法

    公开(公告)号：US20120049307A1

    公开(公告)日：2012-03-01

    申请号：US13217999

    申请日：2011-08-25

    申请人： Yu-Lung HUANG ,  Tzu-Hsiang HUNG ,  Yen-Shih HO

    发明人： Yu-Lung HUANG ,  Tzu-Hsiang HUNG ,  Yen-Shih HO

    IPC分类号： H01L31/0232 ,  H01L31/18

    CPC分类号： H01L31/1876 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2224/94

    摘要： A method for forming an image sensor chip package includes: providing a substrate having predetermined scribe lines defined thereon, wherein the predetermined scribe lines define device regions and each of the device regions has at least a device formed therein; disposing a support substrate on a first surface of the substrate; forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines; forming a package layer on a second surface of the substrate; forming conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and dicing along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.

    摘要翻译： 一种用于形成图像传感器芯片封装的方法，包括：提供具有限定在其上的预定划线的基板，其中，所述预定划线限定器件区域，并且每个器件区域至少具有形成在其中的器件; 将支撑基板设置在所述基板的第一表面上; 在所述支撑基板和所述基板之间形成至少间隔层，其中所述间隔层覆盖所述预定划线; 在所述基板的第二表面上形成封装层; 在所述衬底的第二表面上形成导电结构，其中所述导电结构分别在相应的一个所述器件区域中电连接到相应的器件; 并且沿着预定的划线切割，使得支撑基板从基板移除，并且基板被分离成多个单独的图像传感器芯片封装。

    CHIP PACKAGE
    2.
    发明申请
    CHIP PACKAGE 有权
    芯片包装

    公开(公告)号：US20120056226A1

    公开(公告)日：2012-03-08

    申请号：US13224267

    申请日：2011-09-01

    申请人： Tzu-Hsiang HUNG ,  Hsin-Chih CHIU ,  Chuan-Jin SHIU ,  Chia-Sheng LIN ,  Yen-Shih HO ,  Yu-Min LIANG

    发明人： Tzu-Hsiang HUNG ,  Hsin-Chih CHIU ,  Chuan-Jin SHIU ,  Chia-Sheng LIN ,  Yen-Shih HO ,  Yu-Min LIANG

    IPC分类号： H01L33/58 ,  H01L31/0232

    CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00

    摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer disposed on the second surface of the substrate, wherein the protection layer has an opening; a conducting bump disposed on the second surface of the substrate and filled in the opening; a conducting layer disposed between the protection layer and the substrate, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump; and a light shielding layer disposed on the protection layer, wherein the light shielding layer does not contact with the conducting bump.

    摘要翻译： 本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 设置在第一表面处的光电子器件; 保护层，设置在所述基板的第二表面上，其中所述保护层具有开口; 设置在所述基板的第二表面上并填充在所述开口中的导电凸块; 设置在所述保护层和所述基板之间的导电层，其中所述导电层将所述光电子器件电连接到所述导电凸块; 以及设置在保护层上的遮光层，其中遮光层不与导电凸块接触。

    CHIP PACKAGE AND METHOD FOR FORMING THE SAME
    4.
    发明申请
    CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
    芯片包装及其形成方法

    公开(公告)号：US20120193786A1

    公开(公告)日：2012-08-02

    申请号：US13359452

    申请日：2012-01-26

    申请人： Chia-Sheng LIN ,  Tzu-Hsiang HUNG

    发明人： Chia-Sheng LIN ,  Tzu-Hsiang HUNG

    IPC分类号： H01L23/498 ,  H01L21/50

    CPC分类号： H01L21/76898 ,  H01L23/3157 ,  H01L23/481 ,  H01L23/522 ,  H01L23/60 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02372 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/05552

    摘要： An embodiment of the invention provides a chip package which includes: a substrate; a device region disposed in or on the substrate; a signal pad disposed in or on the substrate and electrically connected to the device region; a ground pad disposed in or on the substrate; a signal bump disposed on a surface of the substrate, wherein the signal bump is electrically connected to the signal pad through a signal conducting layer; a ground conducting layer disposed on the surface of the substrate and electrically connected to the ground pad; and a protection layer disposed on the surface of the substrate, wherein the protection layer completely covers the entire side terminals of the signal conducting layer and partially covers the ground conducting layer such that a side terminal of the ground conducting layer is exposed on a side of the substrate.

    摘要翻译： 本发明的实施例提供了一种芯片封装，其包括：衬底; 设置在所述基板中或所述基板上的器件区域; 信号焊盘，设置在所述衬底中或所述衬底上并电连接到所述器件区域; 设置在基板中或基板上的接地焊盘; 设置在所述基板的表面上的信号凸起，其中所述信号凸起通过信号传导层电连接到所述信号焊盘; 接地导电层，设置在所述基板的表面上并电连接到所述接地垫; 以及设置在基板的表面上的保护层，其中保护层完全覆盖信号传导层的整个侧面端子并且部分地覆盖接地导电层，使得接地导电层的侧端子暴露在 底物。