公开(公告)号：US06831357B2

公开(公告)日：2004-12-14

申请号：US10397608

申请日：2003-03-26

申请人： Yuji Nishitani ,  Tsuyoshi Ogawa ,  Hiroshi Asami ,  Akihiko Okubora

发明人： Yuji Nishitani ,  Tsuyoshi Ogawa ,  Hiroshi Asami ,  Akihiko Okubora

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/467 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/0352 ,  H05K2201/09536 ,  H05K2203/061

摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

公开(公告)号：US07138294B2

公开(公告)日：2006-11-21

申请号：US10792447

申请日：2004-03-03

申请人： Yuji Nishitani ,  Tsuyoshi Ogawa ,  Hiroshi Asami ,  Akihiko Okubora

发明人： Yuji Nishitani ,  Tsuyoshi Ogawa ,  Hiroshi Asami ,  Akihiko Okubora

IPC分类号： H01L21/44

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/467 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/0352 ,  H05K2201/09536 ,  H05K2203/061

摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

摘要翻译： 由电路单元2和多层布线基板3构成的电路基板装置，其中可以防止电路单元2的图形导体翘曲或被淹没。 电路基板装置包括具有通过薄膜技术形成的图案导体的电路单元2和绝缘层，以及具有从其主表面露出的连接端子部分14的多层布线基板3。 电路单元形成在虚设基板上。 电路单元连接到多层布线基板3，使得图案导体连接到连接端子部分14。 然后去除虚设基板，得到由多层布线基板3上形成的电路单元2构成的结构。 电路单元2的图形导体沿着电路单元2的厚度方向不会发生翘曲或淹没。

公开(公告)号：US07288724B2

公开(公告)日：2007-10-30

申请号：US10403550

申请日：2003-03-31

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiling substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 制造可以以细间距保持导体图案的尺寸稳定性的多层布线基板的方法从材料选择的角度解决了对工艺的限制，并且进一步降低了制造成本，以及多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二卷绕基板仅叠层在第一布线基板上的多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US07053315B2

公开(公告)日：2006-05-30

申请号：US10802188

申请日：2004-03-17

申请人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

发明人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/3452 ,  H01L2224/10126 ,  H05K3/3478 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0594 ,  Y10T29/49147

摘要： To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.

摘要翻译： 提供一种用于导电突起的接合结构和接合方法，其优点在于可以获得所需的增强强度，同时抑制供应的增强树脂材料的量以防止由于固化收缩引起的翘曲。 导电突起与形成在与绝缘层的表面相同水平面的导体部分的表面接合，使得突起的根部被圆角状的树脂材料包围。 树脂材料含有活化剂，当树脂材料处于未固化状态时，其有助于导电突起与导体部分之间的接合，并通过加热熔化并使导电突起的根部上升，使其处于 一个圆角形状。 树脂材料通过紫外线固化，同时排除导体部分上的树脂材料。

公开(公告)号：US07420127B2

公开(公告)日：2008-09-02

申请号：US11644143

申请日：2006-12-22

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H05K1/02

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且 多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US20050142852A1

公开(公告)日：2005-06-30

申请号：US11063131

申请日：2005-02-22

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H05K3/22 ,  H01L23/12 ,  H05K3/00 ,  H05K3/20 ,  H05K3/46 ,  H01L21/4763 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且 多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US20050056445A1

公开(公告)日：2005-03-17

申请号：US10802188

申请日：2004-03-17

申请人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

发明人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/32 ,  H02G3/08 ,  H05K3/34

CPC分类号： H05K3/3452 ,  H01L2224/10126 ,  H05K3/3478 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0594 ,  Y10T29/49147

摘要： To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.

摘要翻译： 提供一种用于导电突起的接合结构和接合方法，其优点在于可以获得所需的增强强度，同时抑制供应的增强树脂材料的量以防止由于固化收缩引起的翘曲。 导电突起与形成在与绝缘层的表面相同水平面的导体部分的表面接合，使得突起的根部被圆角状的树脂材料包围。 树脂材料含有活化剂，当树脂材料处于未固化状态时，其有助于导电突起与导体部分之间的接合，并通过加热熔化并使导电突起的根部上升，使其处于 一个圆角形状。 树脂材料通过紫外线固化，同时排除导体部分上的树脂材料。

公开(公告)号：US20070102191A1

公开(公告)日：2007-05-10

申请号：US11644143

申请日：2006-12-22

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H05K1/11

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且 多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US20070293038A1

公开(公告)日：2007-12-20

申请号：US11890892

申请日：2007-08-08

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H01L21/4763

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

公开(公告)号：US11598977B2

公开(公告)日：2023-03-07

申请号：US16648766

申请日：2018-09-19

申请人： Hiroshi Asami ,  Yasunori Izawa

发明人： Hiroshi Asami ,  Yasunori Izawa

IPC分类号： G02C7/02 ,  G02C7/06

摘要： A lens, system for designing, computer program for designing and a method for designing, with a computer, a progressive addition lens including a distance vision region, a near vision region, and an intermediate vision region, wherein a power gradually changes between the distance vision region and the near vision region, and wherein the progressive addition lens is based on prescription data, the method including: determining a transmission astigmatic performance parameter corresponding to a sum of a prescribed astigmatism included in the prescription data and of a predetermined amount of extra astigmatism; determining lens surface data corresponding to the determined transmission performance parameter.