公开(公告)号：US20070102191A1

公开(公告)日：2007-05-10

申请号：US11644143

申请日：2006-12-22

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H05K1/11

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且 多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US06919226B2

公开(公告)日：2005-07-19

申请号：US10466748

申请日：2002-11-15

申请人： Tsuyoshi Ogawa ,  Yuji Nishitani

发明人： Tsuyoshi Ogawa ,  Yuji Nishitani

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L21/98 ,  H01L23/31 ,  H01L23/538 ,  H01L25/04 ,  H01L25/065 ,  H01L25/10 ,  H01L25/18 ,  H01L29/00 ,  H05K3/00 ,  H05K3/46 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/5385 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/81005 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/007 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2203/016 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.

摘要翻译： 一种多芯片电路模块，其上装有半导体芯片，并且设置有用于互连半导体芯片的电路图案，输入/输出端子等。 多层布线部分（2）由各单元布线层（8）至（12）形成，使得上单元布线层层叠在表面平面化的相邻单元布线层上，并通过 通过通孔结构的层间连接。 安装在该多层布线部分（2）上的半导体芯片（6）与用于减小厚度的密封树脂层（7）一起被抛光。

公开(公告)号：US20110109991A1

公开(公告)日：2011-05-12

申请号：US12889253

申请日：2010-09-23

申请人： Yuji NISHITANI

发明人： Yuji NISHITANI

IPC分类号： G11B17/02 ,  H05K13/00

CPC分类号： G11B33/08 ,  G11B25/043 ,  Y10T29/49002

摘要： A disk drive device includes: a hub on which a recording disk is to be mounted; a base member; a bearing unit configured to support the hub in a manner in which the hub can be relatively rotated with respect to the base member; an extended annular groove portion provided in part of the hub around the rotational axis of the hub; and a weight member that is installed in the extended annular groove portion to adjust a rotational balance when the recording disk is being rotated with the hub. The weight member has a fixing mechanism that is slidable, when installed, in the direction of the extended annular groove portion and that can substantially maintain a stopped state at a fixing position.

摘要翻译： 磁盘驱动器装置包括：记录盘安装在其上的集线器; 基地会员 轴承单元，其构造成以轮毂相对于基座相对旋转的方式支撑轮毂; 围绕轮毂的旋转轴线设置在毂的一部分的延伸的环形槽部分; 以及配重构件，其安装在延伸的环形槽部分中，以当记录盘与轮毂一起旋转时调节旋转平衡。 配重构件具有固定机构，当安装时，该固定机构能够沿着延伸的环形槽部的方向滑动，并且能够在固定位置上基本保持停止状态。

公开(公告)号：US07193311B2

公开(公告)日：2007-03-20

申请号：US10834542

申请日：2004-04-29

申请人： Tsuyoshi Ogawa ,  Yuji Nishitani

发明人： Tsuyoshi Ogawa ,  Yuji Nishitani

IPC分类号： H01L23/24 ,  H01L23/22

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/5385 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/81005 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/007 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2203/016 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.

摘要翻译： 一种多芯片电路模块，其上装有半导体芯片，并且设置有用于互连半导体芯片的电路图案，输入/输出端子等。 多层布线部分（2）由各单元布线层（8）至（12）形成，使得上单元布线层层叠在表面平面化的相邻单元布线层上，并通过 通过通孔结构的层间连接。 安装在该多层布线部分（2）上的半导体芯片（6）与用于减小厚度的密封树脂层（7）一起被抛光。

公开(公告)号：US07880317B2

公开(公告)日：2011-02-01

申请号：US12094314

申请日：2006-10-30

申请人： Tomoshi Ohde ,  Fujio Kanayama ,  Mitsuru Adachi ,  Tetsunori Niimi ,  Hidetoshi Kusano ,  Yuji Nishitani

发明人： Tomoshi Ohde ,  Fujio Kanayama ,  Mitsuru Adachi ,  Tetsunori Niimi ,  Hidetoshi Kusano ,  Yuji Nishitani

IPC分类号： H01L23/28 ,  H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

摘要翻译： 提供一种半导体器件，其中提供了安装倒装芯片的半导体芯片的散热特性。 半导体器件设置有衬底，安装在衬底上的半导体倒装芯片，用于密封半导体倒装芯片周围的密封树脂层。 在半导体芯片周围形成用于密封半导体芯片的密封树脂层。 在该半导体装置中，半导体芯片的背面露出，相对于密封树脂层的上表面凸出。

公开(公告)号：US20100302673A1

公开(公告)日：2010-12-02

申请号：US12769559

申请日：2010-04-28

申请人： Yuji NISHITANI

发明人： Yuji NISHITANI

IPC分类号： G11B17/00

CPC分类号： G11B19/2036

摘要： A disk drive device includes a bearing unit and a drive unit. The bearing unit includes: a shaft; a sleeve configured to allow relative rotation, with the shaft as the axis; a flange projected in the radial direction of the shaft and configured to rotate integrally with the shaft; a flange housing space portion provided continuously from the sleeve and configured to rotatably house the flange; a counter plate structured with both a first surface, which faces the end surface in the axial direction of the flange and seals the flange housing space portion, and a second surface that is opposite to the first surface. The projected dimension of the flange is designed to be larger than the wall thickness of the flange surrounding wall portion in the radial direction of the flange, the flange surrounding wall portion defining the flange housing space portion.

摘要翻译： 磁盘驱动装置包括轴承单元和驱动单元。 轴承单元包括：轴; 套筒，其构造成允许相对旋转，以轴为轴; 沿所述轴的径向方向突出并且构造成与所述轴一体地旋转的凸缘; 凸缘容纳空间部分，其从所述套筒连续地设置并且构造成可旋转地容纳所述凸缘; 对置板，其构造为具有面向凸缘的轴向端面的第一表面并密封凸缘容纳空间部分的第二表面和与第一表面相对的第二表面。 凸缘的突出尺寸被设计成大于凸缘的径向方向上围绕壁部的凸缘的壁厚，凸缘围壁部分限定凸缘容纳空间部分。

公开(公告)号：US07288724B2

公开(公告)日：2007-10-30

申请号：US10403550

申请日：2003-03-31

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiling substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 制造可以以细间距保持导体图案的尺寸稳定性的多层布线基板的方法从材料选择的角度解决了对工艺的限制，并且进一步降低了制造成本，以及多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二卷绕基板仅叠层在第一布线基板上的多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US07053315B2

公开(公告)日：2006-05-30

申请号：US10802188

申请日：2004-03-17

申请人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

发明人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/3452 ,  H01L2224/10126 ,  H05K3/3478 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0594 ,  Y10T29/49147

摘要： To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.

摘要翻译： 提供一种用于导电突起的接合结构和接合方法，其优点在于可以获得所需的增强强度，同时抑制供应的增强树脂材料的量以防止由于固化收缩引起的翘曲。 导电突起与形成在与绝缘层的表面相同水平面的导体部分的表面接合，使得突起的根部被圆角状的树脂材料包围。 树脂材料含有活化剂，当树脂材料处于未固化状态时，其有助于导电突起与导体部分之间的接合，并通过加热熔化并使导电突起的根部上升，使其处于 一个圆角形状。 树脂材料通过紫外线固化，同时排除导体部分上的树脂材料。

公开(公告)号：US08315011B2

公开(公告)日：2012-11-20

申请号：US12769559

申请日：2010-04-28

申请人： Yuji Nishitani

发明人： Yuji Nishitani

IPC分类号： G11B17/02 ,  H02K5/16

CPC分类号： G11B19/2036

摘要： A disk drive device includes a bearing unit and a drive unit. The bearing unit includes: a shaft; a sleeve configured to allow relative rotation, with the shaft as the axis; a flange projected in the radial direction of the shaft and configured to rotate integrally with the shaft; a flange housing space portion provided continuously from the sleeve and configured to rotatably house the flange; a counter plate structured with both a first surface, which faces the end surface in the axial direction of the flange and seals the flange housing space portion, and a second surface that is opposite to the first surface. The projected dimension of the flange is designed to be larger than the wall thickness of the flange surrounding wall portion in the radial direction of the flange, the flange surrounding wall portion defining the flange housing space portion.

摘要翻译： 磁盘驱动装置包括轴承单元和驱动单元。 轴承单元包括：轴; 套筒构造成允许相对旋转，以轴为轴; 沿所述轴的径向方向突出并且构造成与所述轴一体地旋转的凸缘; 凸缘容纳空间部分，其从所述套筒连续地设置并且构造成可旋转地容纳所述凸缘; 对置板，其构造为具有面向凸缘的轴向端面的第一表面并密封凸缘容纳空间部分的第二表面和与第一表面相对的第二表面。 凸缘的突出尺寸被设计成大于凸缘的径向方向上围绕壁部的凸缘的壁厚，凸缘围壁部分限定凸缘容纳空间部分。

公开(公告)号：US07436682B2

公开(公告)日：2008-10-14

申请号：US11600928

申请日：2006-11-16

申请人： Yuji Nishitani ,  Tomoshi Ohde

发明人： Yuji Nishitani ,  Tomoshi Ohde

IPC分类号： H05K7/12

CPC分类号： H05K3/3436 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2224/05599

摘要： A flip chip mounting method for improving the accuracy of positioning of a semiconductor chip and avoiding a short circuit between protruding electrodes even when the protruding electrodes are formed at smaller spacings. The method comprises: placing a semiconductor chip on a wiring board, the semiconductor chip having protruding electrodes formed at a relatively small spacing and at a relatively large spacing, the wiring board having electrode pads corresponding to the respective protruding electrodes and solder pieces formed on the respective pads; heating the semiconductor chip and the wiring board to a temperature at which only the solder pieces on the electrode pads of greater spacing melt; performing self alignment of the semiconductor chip by the melted solder pieces; and heating the semiconductor chip and the wiring board further to a temperature at which the protruding electrodes and the solder pieces on the electrode pads of smaller spacing melt.

摘要翻译： 一种用于提高半导体芯片的定位精度并避免突出电极之间的短路的倒装芯片安装方法，即使当突出电极以较小的间隔形成时。 所述方法包括：将半导体芯片放置在布线板上，所述半导体芯片具有形成在相对较小间隔和相对较大间隔的突出电极，所述布线板具有对应于各个突出电极的电极焊盘和形成在 各自的垫片 将半导体芯片和布线板加热至只有较大间隔的电极焊盘上的焊料块熔化的温度; 通过熔融的焊料进行半导体芯片的自对准; 并且将半导体芯片和布线板进一步加热到间隔较小的电极焊盘上的突出电极和焊料片熔化的温度。