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    Powdery flame retardant
    4.
    发明授权
    Powdery flame retardant 失效
    粉状阻燃剂

    公开(公告)号：US06627122B1

    公开(公告)日：2003-09-30

    申请号：US09762988

    申请日：2001-02-14

    申请人： Yuji Tada ,  Tadao Yabuhara ,  Shinji Nakano ,  Takashi Kameshima ,  Yoichi Nishioka ,  Hiroyuki Takase

    发明人： Yuji Tada ,  Tadao Yabuhara ,  Shinji Nakano ,  Takashi Kameshima ,  Yoichi Nishioka ,  Hiroyuki Takase

    IPC分类号： C08K500

    CPC分类号： C08K7/04 ,  C08K9/12

    摘要： A powdery flame retardant which is obtained by mixing a flame retardant which is liquid or a viscous solid at ordinary temperature with an inorganic fibrous substance to adhere or adsorb the retardant to the fibrous substance, and which comprises 5 to 70 wt. % the flame retardant and 95 to 30 wt. % the fibrous substance. The powdery flame retardant can be easily handled because it is a powder, and is obtained by a simple and industrially advantageous method. It produces a remarkable effect that the performance of the liquid or viscous flame retardant is not impaired.

    摘要翻译： 一种粉末状阻燃剂，其通过将常温下为液体或粘性固体的阻燃剂与无机纤维物质混合以将阻燃剂粘附或吸附到纤维状物质上，并且其包含5至70重量％ ％阻燃剂和95〜30wt。 ％的纤维物质。 粉状阻燃剂由于粉末而易于处理，并且通过简单且工业上有利的方法获得。 它产生显着的效果，即液体或粘性阻燃剂的性能不受损害。

    Epoxy resin composition and electronic part
    5.
    发明授权
    Epoxy resin composition and electronic part 失效
    环氧树脂组合物和电子部件

    公开(公告)号：US06905768B2

    公开(公告)日：2005-06-14

    申请号：US10169104

    申请日：2001-01-11

    申请人： Yuji Tada ,  Shinji Nakano

    发明人： Yuji Tada ,  Shinji Nakano

    IPC分类号： C09K3/10 ,  C08G59/62 ,  C08K3/00 ,  C08K5/5399 ,  C08L61/06 ,  C08L61/24 ,  C08L61/28 ,  C08L63/00 ,  C08L85/02 ,  C09K21/12 ,  C09K21/14 ,  H01L23/29 ,  H01L23/31 ,  B32B27/38 ,  H01L21/56

    CPC分类号： H01L23/293 ,  C08G59/621 ,  C08K5/5399 ,  C08L61/06 ,  C08L61/24 ,  C08L61/28 ,  C08L63/00 ,  C08L85/02 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/14 ,  H01L2924/00

    摘要： The epoxy resin of the invention comprises (A) an epoxy resin, (B) at least one member selected from the group consisting of a phenolic hydroxyl group-containing compound, a urea resin and a melamine resin, (C) a crosslinked phenoxyphosphazene compound, and (D) an inorganic filler powder, the amount of component (C) being in the range of 0.01 to 30 wt. % based on the total amount of components (A), (B) and (C), and the amount of component (D) being in the range of 60 to 98 wt. % based on the total amount of components (A), (B), (C) and (D). The epoxy resin composition of the invention and a molded product are halogen-free and antimony-free and are excellent in flame retardancy. When an element for an electronic part such as LSI and VLSI is encapsulated by the epoxy resin composition of the invention, the obtained electronic part is outstanding in heat resistance, moisture resistance, thermal impact resistance and like properties.

    摘要翻译： 本发明的环氧树脂包含（A）环氧树脂，（B）选自含酚羟基的化合物，脲醛树脂和三聚氰胺树脂中的至少一种，（C）交联的苯氧基磷腈化合物 ，（D）无机填料粉末，成分（C）的含量在0.01〜30重量％的范围内。 基于组分（A），（B）和（C）的总量的％，组分（D）的量在60至98重量％的范围内。 基于组分（A），（B），（C）和（D）的总量的％。 本发明的环氧树脂组合物和成型体为无卤素且不含锑，阻燃性优异。 当通过本发明的环氧树脂组合物封装诸如LSI和VLSI的电子部件的元件时，所获得的电子部件在耐热性，耐湿性，耐热冲击性等方面优异。

    Flame-retardant aromatic polyamide resin composition and molded object
    6.
    发明授权
    Flame-retardant aromatic polyamide resin composition and molded object 有权
    阻燃芳香族聚酰胺树脂组合物和成型体

    公开(公告)号：US06521689B1

    公开(公告)日：2003-02-18

    申请号：US09889011

    申请日：2001-07-06

    申请人： Tadao Yabuhara ,  Yuji Tada ,  Shinji Nakano ,  Takashi Kameshima ,  Yoichi Nishioka ,  Hiroyuki Takase

    发明人： Tadao Yabuhara ,  Yuji Tada ,  Shinji Nakano ,  Takashi Kameshima ,  Yoichi Nishioka ,  Hiroyuki Takase

    IPC分类号： C08K535

    CPC分类号： C08K7/04 ,  C08K3/22 ,  C08K5/5399 ,  C08K7/02 ,  C08K2003/2217 ,  C08L77/10 ,  C08L85/02 ,  C08L77/00 ,  C08L85/00 ,  C08L2666/84

    摘要： An object of this invention is to impart excellent flame retardancy to an aromatic polyamide resin without use of a halogen compound which is responsible for generation of gases harmful to the human body and without decreasing preferred properties (e.g. mechanical properties, and molding processability) inherently possessed by aromatic polyamide resins, the flame-retardant aromatic polyamide resin composition of this invention comprising (a) 100 parts by weight of an aromatic polyamide resin, (b) 0.1 to 100 parts by weight of a crosslinked phosphazene compound which is a compound crosslinked with a crosslinking group, such as phenylene groups, the crosslinking group being interposed between the two oxygen atoms left after the elimination of phenyl groups from the phosphazene compound, no free hydroxyl group being present in the molecule, the amount of all phenyl groups in the crosslinked compound being 50 to 99.9% based on the total amount of the phenyl groups in the phosphazene compounds, (c) 1 to 60 parts by weight of an inorganic fibrous substance and (d) 1 to 60 parts by weight of magnesium hydroxide.

    摘要翻译： 本发明的目的是赋予芳族聚酰胺树脂优异的阻燃性，而不使用负责产生对人体有害的气体的卤素化合物，而不降低固有地具有的优选性能（例如机械性能和成型加工性） 通过芳族聚酰胺树脂，本发明的阻燃芳族聚酰胺树脂组合物包含（a）100重量份的芳族聚酰胺树脂，（b）0.1至100重量份的交联的磷腈化合物，其是与 交联基团，例如亚苯基，交联基团置于从磷腈化合物除去苯基后留下的两个氧原子之间，分子中不存在游离羟基，交联的所有苯基的量 化合物的含量为磷腈中苯基的总量的50-99.9％ （c）1〜60重量份的无机纤维状物质和（d）1〜60重量份的氢氧化镁。

    Semiconductor integrated circuit device which has first chip and second chip accessed via the first chip and test method thereof
    8.
    发明申请
    Semiconductor integrated circuit device which has first chip and second chip accessed via the first chip and test method thereof 失效
    具有通过第一芯片访问的第一芯片和第二芯片的半导体集成电路器件及其测试方法

    公开(公告)号：US20090167337A1

    公开(公告)日：2009-07-02

    申请号：US12314689

    申请日：2008-12-15

    申请人： Kazunori Yamane ,  Takayuki Kurokawa ,  Yuji Tada ,  Hironori Nakamura ,  Manabu Kitabatake

    发明人： Kazunori Yamane ,  Takayuki Kurokawa ,  Yuji Tada ,  Hironori Nakamura ,  Manabu Kitabatake

    IPC分类号： G01R31/303

    CPC分类号： G11C29/48 ,  G11C29/1201 ,  G11C2029/0401 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor integrated circuit device includes a first chip including an internal circuit, and a second chip capable of being accessed only via the first chip, and a test processor circuit electrically connected internally via the first chip, for accessing the second chip from an external terminal and testing the second chip, and a test circuit where an input/output buffer is installed for signals for accessing the second chip within the test processor circuit, and a bypass line installed for transferring signals from the first chip to the second chip and avoiding the input/output buffer within the test processor circuit, and a switch which switches between signal transfer path via the input/output buffer, and a signal transfer path via the bypass line.

    摘要翻译： 半导体集成电路器件包括：第一芯片，其包括内部电路;以及第二芯片，其仅能够经由第一芯片访问;以及测试处理器电路，其经由第一芯片内部电连接，用于从外部端子访问第二芯片 并且测试第二芯片，以及测试电路，其中安装了用于访问测试处理器电路内的第二芯片的信号的输入/输出缓冲器，以及安装用于将信号从第一芯片传送到第二芯片并且避免 测试处理器电路内的输入/输出缓冲器，以及通过输入/输出缓冲器在信号传送路径和通过旁路线路的信号传送路径之间切换的开关。

    Heat-resistant composition
    9.
    发明授权
    Heat-resistant composition 有权
    耐热组合物

    公开(公告)号：US06743841B2

    公开(公告)日：2004-06-01

    申请号：US10071624

    申请日：2002-02-08

    申请人： Toshiyuki Shimizu ,  Yuji Tada

    发明人： Toshiyuki Shimizu ,  Yuji Tada

    IPC分类号： C08K551

    CPC分类号： C08K5/5399 ,  C08G79/025 ,  C08L85/02 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/095 ,  H05K3/386 ,  H05K3/4626 ,  Y10T428/31522 ,  Y10T428/31678 ,  C08L79/08

    摘要： A heat-resistant composition contains solvent-soluble polyimide resin (A) and a phosphazene compound (B) in relation to a polyimide resin composition having solubility in a low-boiling solvent, heat resistance, flame resistance, adhesiveness and mechanical properties. The said phosphazene compound (B) is a cyclic phenoxyphosphazene compound (B1) expressed in the following chemical formula (1): where m represents an integer of 3 to 25 and Ph represents a phenyl group.

    摘要翻译： 相对于在低沸点溶剂中具有溶解性，耐热性，阻燃性，粘合性和机械性能的聚酰亚胺树脂组合物，耐热组合物含有溶剂可溶性聚酰亚胺树脂（A）和磷腈化合物（B）。 所述磷腈化合物（B）是以下述化学式（1）表示的环状苯氧基磷腈化合物（B1）：其中，m表示3〜25的整数，Ph表示苯基。

    Cyanato group-containing cyclic phosphazene compound and method for producing the same
    10.
    发明授权
    Cyanato group-containing cyclic phosphazene compound and method for producing the same 有权
    含氰基的环状磷腈化合物及其制造方法

    公开(公告)号：US07767739B2

    公开(公告)日：2010-08-03

    申请号：US12087585

    申请日：2007-01-09

    申请人： Yuji Tada ,  Takashi Inoue

    发明人： Yuji Tada ,  Takashi Inoue

    IPC分类号： C08K5/5399 ,  C07F9/547

    CPC分类号： C09K21/12 ,  C07F9/65815 ,  C07F9/65817 ,  C07F9/65818 ,  C08G79/025 ,  C08K5/5399 ,  C08L71/126 ,  C09K21/14

    摘要： A phosphazene compound, which can effectively enhance flame retardancy without deteriorating mechanical properties of a resin molded product, and is also less likely to deteriorate thermal reliability and dielectric properties, is represented by the formula (1) shown below. n represents an integer of 3 to 15. wherein A represents a group selected from the group consisting of an alkoxy group, an aryloxy group and a group having a cyanato group, and at least one is a group having a cyanato group, and an example of A is a cyanatophenyl-substituted phenyloxy group represented by the formula (4) shown below, and Y in the formula (4) represents O, S, SO2, CH2, CHCH3, C(CH3)2, C(CF3)2, C(CH3)CH2CH3 or CO.

    摘要翻译： 可以有效地提高阻燃性，而不会降低树脂成型体的机械性能，也不太可能劣化热可靠性和介电性能的磷腈化合物由下式（1）表示。 n表示3〜15的整数。其中A表示选自由烷氧基，芳氧基和具有氰基的基团组成的组中的基团，并且至少一个为具有氰基的基团， 的A是由下式（4）表示的氰基苯基取代的苯氧基，式（4）中的Y表示O，S，SO 2，CH 2，CHCH 3，C（CH 3）2，C（CF 3） C（CH 3）CH 2 CH 3或CO。