Method of manufacturing semiconductor devices
    6.
    发明授权
    Method of manufacturing semiconductor devices 失效
    制造半导体器件的方法

    公开(公告)号:US5561317A

    公开(公告)日:1996-10-01

    申请号:US478447

    申请日:1995-06-07

    摘要: Disclosed is a method of manufacturing semiconductor devices in which a desired pattern having an area size larger than the field size that can be obtained in one exposure process step of an exposure device is formed. The manufacturing method includes the steps of dividing the desired pattern into a plurality of portions, and conducting exposure on the dividing patterns in a joined fashion.

    摘要翻译: 公开了一种制造半导体器件的方法,其中形成了具有比在曝光装置的一个曝光处理步骤中可获得的场尺寸大的面积尺寸的期望图案。 该制造方法包括以下步骤:将期望的图案分成多个部分,并以连接的方式在分割图案上进行曝光。

    Method for producing semiconductor device
    7.
    发明授权
    Method for producing semiconductor device 失效
    半导体器件的制造方法

    公开(公告)号:US5192680A

    公开(公告)日:1993-03-09

    申请号:US360341

    申请日:1989-06-02

    摘要: A method for producing a semiconductor device containing steps of forming a stepped pattern on the surface of a semiconductor substrate and forming a gaseous grown crystal layer thereon, which comprises positioning an alignment pattern (for example 6c) included in the first-mentioned pattern diagonally with respect to an in-plane direction of faster pattern growth in said gaseous crystal growth.

    摘要翻译: 一种用于制造半导体器件的方法,包括在半导体衬底的表面上形成阶梯状图案并在其上形成气态生长晶体层的步骤,其包括将包括在第一提到的图案中的对准图案(例如6c)与对角线对准地定位 相对于所述气态晶体生长中更快图案生长的面内方向。