公开(公告)号：US08231265B2

公开(公告)日：2012-07-31

申请号：US12507369

申请日：2009-07-22

申请人： Yutaka Ozawa ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

发明人： Yutaka Ozawa ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

IPC分类号： B01F5/06

CPC分类号： B01F3/0807 ,  B01F5/0646 ,  B01F5/0653 ,  B01F13/0062 ,  Y10T137/87652

摘要： A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path.

摘要翻译： 用于形成乳液的微芯片具有第一玻璃基板，第二玻璃基板和硅基板。 硅衬底在其中形成有第一流体流过的第一流体流动路径和不与第一流体混合的第二流体流过的第二流体流动路径。 第一流体流动路径具有连接在接合部分处的多个分支流路。 第二流体流路与接合部连通。 硅衬底中形成有乳液形成流动路径，其在接合部分处面向第二流体流路的边缘部分。 在乳液形成流动路径中形成由第一流体和第一流体包围的由第一流体包围的乳液。

公开(公告)号：US08398866B2

公开(公告)日：2013-03-19

申请号：US13525639

申请日：2012-06-18

申请人： Yutaka Ozawa ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

发明人： Yutaka Ozawa ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

IPC分类号： B01F5/08

CPC分类号： B01F3/0807 ,  B01F5/0646 ,  B01F5/0653 ,  B01F13/0062 ,  Y10T137/87652

摘要： A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path.

摘要翻译： 用于形成乳液的微芯片具有第一玻璃基板，第二玻璃基板和硅基板。 硅衬底在其中形成有第一流体流过的第一流体流动路径和不与第一流体混合的第二流体流过的第二流体流动路径。 第一流体流动路径具有连接在接合部分处的多个分支流路。 第二流体流路与接合部连通。 硅衬底中形成有乳液形成流动路径，其在接合部分处面向第二流体流路的边缘部分。 在乳液形成流动路径中形成由第一流体和第一流体包围的由第一流体包围的乳液。

公开(公告)号：US20100027372A1

公开(公告)日：2010-02-04

申请号：US12507369

申请日：2009-07-22

申请人： Yutaka OZAWA ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

发明人： Yutaka OZAWA ,  Ryoichi Ohigashi ,  Koji Fujimoto ,  Shoji Takeuchi

IPC分类号： B01F13/00 ,  B01F5/06 ,  B32B37/12

CPC分类号： B01F3/0807 ,  B01F5/0646 ,  B01F5/0653 ,  B01F13/0062 ,  Y10T137/87652

摘要： A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path.

摘要翻译： 用于形成乳液的微芯片具有第一玻璃基板，第二玻璃基板和硅基板。 硅衬底在其中形成有第一流体流过的第一流体流动路径和不与第一流体混合的第二流体流过的第二流体流动路径。 第一流体流动路径具有连接在接合部分处的多个分支流路。 第二流体流路与接合部连通。 硅衬底中形成有乳液形成流动路径，其在接合部分处面向第二流体流路的边缘部分。 在乳液形成流动路径中形成由第一流体和第一流体包围的由第一流体包围的乳液。

公开(公告)号：US08183963B2

公开(公告)日：2012-05-22

申请号：US12714319

申请日：2010-02-26

申请人： Koji Fujimoto ,  Shinichi Furusho ,  Akifumi Fujino

发明人： Koji Fujimoto ,  Shinichi Furusho ,  Akifumi Fujino

IPC分类号： H01H51/22

CPC分类号： H01H50/043 ,  H01H50/24 ,  H01H50/36 ,  Y10T29/49073

摘要： A electromagnetic relay in which bad electrical contact and failure of operation are prevented even when shavings are produced while an iron core is press-fitted into and mounted on a base. The electromagnetic relay includes an electromagnetic block supported by press-fitting both ends of an iron core of the electromagnetic block into an upper surface of a base and open or close a contact by a movable iron piece rotated by magnetization or demagnetization of the iron core with a coil, where shaving receptacles are made by forming separating ribs adjacent to at least one side of press-fit projections that are formed in press-fit concave portions provided on the upper surface of the base.

摘要翻译： 一种电磁继电器，其中即使在将铁芯压配合到基座上并安装在基座上时，也可以防止在生产刨花时产生不良的电接触和操作故障。 电磁继电器包括电磁块，其通过将电磁块的铁芯的两端压配合到基座的上表面中并通过由铁芯的磁化或退磁而旋转的可动铁片打开或闭合触点而支撑， 线圈，其中通过形成与形成在设置在基座的上表面上的压入凹部中的压配突起的至少一侧相邻的分隔肋来制造剃须容器。

公开(公告)号：US08156814B2

公开(公告)日：2012-04-17

申请号：US12505571

申请日：2009-07-20

申请人： Kenjiro Okaguchi ,  Michio Kadota ,  Koji Fujimoto

发明人： Kenjiro Okaguchi ,  Michio Kadota ,  Koji Fujimoto

IPC分类号： G01N29/036 ,  H01L41/04

CPC分类号： G01N29/022 ,  G01N5/02 ,  G01N29/036 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0423

摘要： A surface acoustic wave sensor detects a mass load on a resonator-type surface acoustic wave filter on the basis of a change in frequency and includes an IDT electrode arranged on a piezoelectric substrate to excite surface waves, an insulating film arranged so as to cover the IDT electrode, and a reaction film which is disposed on the insulating film and which reacts with a target substance to be detected or a binding substance that binds to a target substance to be detected. The reaction film is composed of a metal or a metal oxide.

摘要翻译： 表面声波传感器基于频率变化来检测谐振器型表面声波滤波器的质量负载，并且包括布置在压电基板上以激发表面波的IDT电极，布置成覆盖 IDT电极和设置在绝缘膜上并与待检测的目标物质或与要检测的目标物质结合的结合物质的反应膜。 反应膜由金属或金属氧化物构成。

公开(公告)号：US08110146B2

公开(公告)日：2012-02-07

申请号：US12275610

申请日：2008-11-21

申请人： Tetsumasa Ito ,  Yukimitsu Kijima ,  Koji Fujimoto

发明人： Tetsumasa Ito ,  Yukimitsu Kijima ,  Koji Fujimoto

IPC分类号： G01N21/00

CPC分类号： G01N1/06 ,  G01N1/36 ,  Y10T436/2575

摘要： An embedded block is capable of being humidified in a short time without influencing a surface temperature of the embedded block as much as possible. An embedded block humidifier for humidifying an embedded block having a biological specimen embedded in an embedding agent is provided which includes a vapor generating mechanism for generating vapor heated at a predetermined temperature and a guiding mechanism for guiding the vapor to the embedded block so that the generated vapor contacts with a surface of the embedded block set at a predetermined standby position.

摘要翻译： 嵌入块能够在短时间内被加湿，而不会尽可能地影响嵌入块的表面温度。 提供了一种用于加湿嵌入嵌入剂中的具有生物样本的嵌入块的嵌入式块加湿器，其包括用于产生在预定温度下被加热的蒸气的蒸汽发生机构和用于将蒸汽引导到嵌入块的引导机构， 蒸汽与嵌入块的表面设置在预定待机位置。

公开(公告)号：US07437907B2

公开(公告)日：2008-10-21

申请号：US11683021

申请日：2007-03-07

申请人： Tetsuya Kimura ,  Koji Fujimoto ,  Kenjiro Okaguchi

发明人： Tetsuya Kimura ,  Koji Fujimoto ,  Kenjiro Okaguchi

IPC分类号： G01N29/036 ,  H01L41/08

CPC分类号： G01N29/022 ,  G01N29/222 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0423

摘要： In a sensor for detecting a substance in liquid, recesses are provided in the upper surface of a base substrate. The recesses respectively accommodate SAW elements. A resin layer having openings is arranged such that the sensing portions at the upper surfaces of the SAW elements are exposed in the openings. A reaction film made of a material capable of binding to a target substance is also arranged so as to cover the sensing portion of at least one of the SAW elements. A liquid containing a target substance is fed from the openings.

摘要翻译： 在用于检测液体中的物质的传感器中，在基底基板的上表面设置有凹部。 凹槽分别容纳SAW元件。 具有开口的树脂层被布置成使得SAW元件的上表面处的感测部分露出在开口中。 由能够结合目标物质的材料制成的反应膜也被布置成覆盖至少一个SAW元件的感测部分。 从开口供给含有目标物质的液体。

公开(公告)号：US20080232075A1

公开(公告)日：2008-09-25

申请号：US12050814

申请日：2008-03-18

申请人： Seiji Karasawa ,  Koji Fujimoto

发明人： Seiji Karasawa ,  Koji Fujimoto

IPC分类号： H05K7/00 ,  H05K3/30

CPC分类号： H01C7/003 ,  H01C1/148 ,  H01C17/006 ,  H01C17/281 ,  Y10T29/49082 ,  Y10T29/49098 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/4913

摘要： The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resister element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced. The four-chips connected resister device 1 as an electronic component comprises: an insulating substrate 2 including a front-surface 2a, a back surface 2b and a side surface 2c connecting the front-surface 2a with the back surface 2b; a pair of terminal electrodes placed on the front and back surfaces 2a and 2b and the side surface 2c; a resister element 5 including a resister member 4 connected to the pair of terminal electrodes, and a protective layer (a glass film 6 and an overcoating film 7) for protecting the resister member 4: the auxiliary electrode 9 placed with covering the interface 8 between the overcoating film 7 and the terminal electrode 3; and a nickel-plated layer 10 and a solder-plated layer 11 placed on the surfaces of the terminal electrode 3 and the auxiliary electrode 9. The interface 8 is placed at the end portion 2c of the insulating substrate 2.

摘要翻译： 本发明是为了提供一种电子部件，其中减轻了构成诸如电阻元件等的电路元件的构件的位置精度，减小了由大气中的硫引起的端子电极的腐蚀。 作为电子部件的四芯片连接电阻器1包括：绝缘基板2，其包括前表面2a，后表面2b和连接前表面2a与背表面2b的侧表面2c ; 放置在前后表面2a和2b以及侧面2c上的一对端子电极; 电阻元件5，包括连接到一对端子电极的电阻器件4，以及用于保护电阻器件4的保护层（玻璃膜6和外涂膜7）：被覆盖有界面8的辅助电极9 外涂膜7和端电极3; 以及放置在端子电极3和辅助电极9的表面上的镀镍层10和焊料镀层11。 界面8位于绝缘基板2的端部2c处。

公开(公告)号：US20080216306A1

公开(公告)日：2008-09-11

申请号：US12044829

申请日：2008-03-07

申请人： Koji Fujimoto

发明人： Koji Fujimoto

IPC分类号： H01C17/28 ,  G01R31/28 ,  B23K26/00

CPC分类号： H01C17/242 ,  B23K26/361 ,  B23K2101/38 ,  H01C17/22 ,  Y10T29/49004 ,  Y10T29/49098

摘要： The present invention is to provide a method of trimming during short time without any difficulty of controlling a device for trimming and a trimming device having a simple structure. The method of manufacturing a resister device comprises: trimming a resister element 5 including a resister film 4 in order to adjust a resister value of the resister element 5, the resister film 4 contacting a pair of electrodes 3 for a resister formed on a substrate 2. A region of the substrate located in a position of a side portion 6 and along with the resister film 4 is heated in the trimming, the position being on a surface where the electrodes 3 for a resister and the resister film 4 are formed. The heating is performed by laser beam irradiation. The side portion 6 is irradiated by a laser beam to form a concave portion 7.

摘要翻译： 本发明是提供一种在短时间内修剪的方法，而不用控制用于修剪的装置和具有简单结构的修剪装置。 制造电阻器件的方法包括：修整包括电阻膜4的电阻元件5，以便调节电阻元件5的电阻值，电阻膜4与形成在衬底2上的电阻器的一对电极3接触 。 位于侧部6的位置并与电阻膜4一起的基板的区域在修整中被加热，该位置在形成电阻器和电阻膜4的电极3的表面上。 通过激光束照射进行加热。 侧部6被激光束照射以形成凹部7。

公开(公告)号：US20080202308A1

公开(公告)日：2008-08-28

申请号：US12033474

申请日：2008-02-19

申请人： Hirohito Fujiwara ,  Tetsumasa Ito ,  Koji Fujimoto ,  Tatsuya Miyatani

发明人： Hirohito Fujiwara ,  Tetsumasa Ito ,  Koji Fujimoto ,  Tatsuya Miyatani

IPC分类号： B26D7/06

CPC分类号： G01N1/06 ,  Y10T83/6492 ,  Y10T83/9459

摘要： An automatic thin-section manufacturing system for manufacturing thin sections by thinly cutting out an embedded block having embedded therein a biological sample while setting said embedded block at a predetermined rake angle, and said system comprising: a long cutting blade having a cutting edge on one end; a holder disposed in such a manner that it makes the rake angle with respect to the surface of the embedded block; a mounting plane which is provided to the front end of the holder, on which plural cutting blades are mounted and aligned with their cutting edges exposed to the outer side; an adsorptive member provided along the mounting plane, which maintains the posture of the cutting blades by adsorbing the base end side of the cutting blades mounted on the mounting plane; a first pressing member provided to the holder, which presses, among the plural cutting blades that are mounted and aligned on the mounting plane, the cutting blade allocated to the predetermined position against the mounting plane; a conveyor unit which slides out the cutting blades that are linearly aligned on the mounting plane, by sequentially conveying the plural cutting blades to feed them one by one on the mounting plane; a transportation unit which moves the embedded block relative to the holder, such that the cutting blade pressed by the first pressing member cuts out the thin section from the embedded block; and a control unit which, after performing thin sectioning for a predetermined time, exchanging the cutting blade used for the thin sectioning by operating the conveyor unit to slide out the cutting blades.

摘要翻译： 一种自动薄片制造系统，用于通过在将所述嵌入块设置在预定前角处的同时，将嵌入其中的嵌入块嵌入生物样品中而将其切割出来，制造薄片，并且所述系统包括：长切割刀片， 结束; 保持器，其以相对于嵌入块的表面形成前角的方式设置; 安装平面，其设置在所述保持器的前端，多个切割刀片安装在所述保持器的前端上并与其暴露于所述外侧的切割刃对齐; 沿着安装平面设置的吸附构件，其通过吸附安装在安装平面上的切割刀片的基端侧而保持切割刀片的姿势; 设置在所述保持器上的第一按压构件，其在安装和对准所述安装面上的所述多个切割刀片之间按照相对于所述安装平面分配到所述预定位置的所述切割刀片; 输送单元，其通过依次输送多个切割刀片，在安装平面上一个接一个地滑出沿着安装平面线性对准的切割刀片; 运送单元，其使所述嵌入块相对于所述保持架移动，使得由所述第一按压构件按压的所述切割刀片从所述嵌入块切出所述薄部; 以及控制单元，在经过预定时间的薄切片之后，通过操作所述输送单元来更换用于薄切割的切割刀片以滑出切割刀片。