摘要:
Technology for constructing a single layer polarization insensitive electrically switchable liquid crystal mirror is disclosed which serves as the basic element for constructing an optical router switch array in free space as well as waveguide format. The optical router switch array includes a plurality of switchable liquid crystal mirror elements having liquid crystal arranged in stack cells and/or in a waveguide configuration. The resulted optical router switches are motionless, polarization insensitive, stable within the operational spectral region, and stable versus temperature. The invention also includes methods for manufacturing a single switchable liquid crystal mirror element and the optical switch arrays. The same technology is further extended to constructing an electrically tunable optical filter that is motionless and polarization insensitive.
摘要:
Electro-optically operated transmitters containing a wave guide liquid crystal beam steering device in series of fine beam steering devices as well as electrically switchable mirror are disclosed. The wave guide beam steering device is constructed on a planar lightwave circuit that contains a plurality of liquid crystal switching elements intersecting a plurality of optical wave guides and one main wave guide that has a curvature for light propagation. The transceiver is capable of continuously steering multiple beams of light into separate independent directions with a field-of-regard close to 4π. The resulted optical transmitter device is motionless, polarization sensitive or insensitive, stable within the operational spectral region, and stable versus temperature. When an optical receiver is integrated, the transmitters become transceivers. The invention also includes the methods for manufacturing the wave guide beam steering device.
摘要:
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing semiconductor materials. The composition has a pH of about 5 or less and comprises colloidal silica, at least one onium compound selected from the group consisting of a phosphonium salt, a sulfonium salt, and a combination thereof, and an aqueous carrier therefor; A CMP method for polishing a surface of a semiconductor material utilizing the composition is also disclosed.
摘要:
The present invention provides a method for polishing silicon nitride-containing substrates. The method comprises abrading a surface of a silicon nitride substrate with a polishing composition, which comprises colloidal silica, at least one acidic component, and an aqueous carrier. The at least one acidic component has a pKa in the range of about 1 to 4.5. The composition has a pH in the range of about 0.5 pH units less than the pKa of the at least one acidic component to about 1.5 pH units greater than the pKa.
摘要:
The invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing a silicon-containing substrate. A method of the invention comprises the steps of contacting a silicon-containing substrate with a polishing pad and an aqueous CMP composition, and causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition in contact with the surface of the substrate to abrade at least a portion of the substrate. The CMP composition comprises a ceria abrasive, a polishing additive bearing a functional group with a pKa of about 4 to about 9, a nonionic surfactant with an hydrophilic portion and a lipophilic portion wherein the hydrophilic portion has a number average molecular weight of about 500 g/mol or higher, and an aqueous carrier, wherein the pH of the composition is 7 or less. The method reduces defects on the wafers, particularly local areas of high removal. The method is also useful for polishing dielectric silicon-containing substrates at a high rate relative to semiconductor silicon-containing substrates.
摘要:
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing semiconductor materials. The composition has a pH of about 5 or less and comprises colloidal silica, at least one onium compound selected from the group consisting of a phosphonium salt, a sulfonium salt, and a combination thereof, and an aqueous carrier therefor; A CMP method for polishing a surface of a semiconductor material utilizing the composition is also disclosed.
摘要:
The present invention relates to a synthesis method of ultra low molecular weight homopolymerized N-vinyl butyrolactam with ultra low residual monomer content, which comprises: using N-vinyl butyrolactam monomers and water with the mass ratio of 3:17˜8:12, then based on the N-vinyl butyrolactam monomers, using 0.5%˜5.0% by weight of initiators, 0.1%˜5.0% by weight of a catalyst, and 0.1%˜10% by weight of a molecular weight regulator; in the presence of an inert gas, adding the above mentioned raw materials in batches, adjusting the pH of the reaction system to 7.0-8.0 with an activator, reacting at the polymerization temperature of 60-85° C.; finally adding a peroxide and keeping the temperature for 2 hours, to obtain an aqueous solution of ultra low molecular weight homopolymerized N-vinyl butyrolactam, drying the aqueous solution to obtain a powdery ultra low molecular weight homopolymerized N-vinyl butyrolactam with ultra low residual monomer content, whose K value is 12-17, whose molecular weight is 2000-15000, and whose residual monomer content is less than 10 ppm, so the present invention is designed skillfully and simple in preparation, the residual monomer content of the ultra low molecular weight homopolymerized N-vinyl butyrolactam with ultra low residual monomer content prepared is less than 10 ppm, and the K value is 12-17, therefore the present invention is suitable for large-scale popularization.
摘要:
The invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing a silicon-containing substrate. A method of the invention comprises the steps of contacting a silicon-containing substrate with a polishing pad and an aqueous CMP composition, and causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition in contact with the surface of the substrate to abrade at least a portion of the substrate. The CMP composition comprises a ceria abrasive, a polishing additive bearing a functional group with a pKa of about 4 to about 9, a nonionic surfactant with an hydrophilic portion and a lipophilic portion wherein the hydrophilic portion has a number average molecular weight of about 500 g/mol or higher, and an aqueous carrier, wherein the pH of the composition is 7 or less. The method reduces defects on the wafers, particularly local areas of high removal. The method is also useful for polishing dielectric silicon-containing substrates at a high rate relative to semiconductor silicon-containing substrates.
摘要:
A human voice distinguishing method and device are provided. The method involves: taking every n sampling points of the current frame of audio signals as one subsection, wherein n is a positive integer, judging whether two adjacent subsections have transition relative to a distinguishing threshold, wherein the sliding maximum absolute value of the two adjacent subsections is more and less than the distinguishing threshold respectively, if so, then determining the current frame to be human voice, where the sliding maximum absolute value of the subsection is obtained by the following method: taking the maximum value of absolute intensity of every sampling point in this subsection as the initial maximum absolute value of this subsection, and taking the maximum value of the initial maximum absolute value of this subsection and m subsections following this subsection as the sliding maximum absolute value of this subsection, wherein m is a positive integer.
摘要:
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing a substrate comprising a phase change material (PCM), such as a germanium-antimony-tellurium (GST) alloy. The composition comprises a particulate abrasive material in combination with lysine, an optional oxidizing agent, and an aqueous carrier therefor. CMP methods for polishing a phase change material-containing substrate utilizing the composition are also disclosed.