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公开(公告)号：US20240360832A1
公开(公告)日：2024-10-31
申请号：US18682528
申请日：2022-08-09
申请人： EBARA CORPORATION
发明人： Shuichiro HONDA , Tetsuji KASATANI , Hayato IKEDA , Mitsutaka IWAMI , Kei WATAJI , Hyuga KIKUCHI
摘要： A purge apparatus is provided. The purge apparatus is capable of preventing air from being entrained when a submersible pump is moved into a pump column, and capable of warming the submersible pump when the submersible pump is removed from the pump column to thereby prevent component of the air from being liquefied, thus preventing the liquefied gas from being emitted in the atmosphere. The purge apparatus includes a hermetic purge container configured to accommodate the submersible pump therein; a vacuum line coupled to the hermetic purge container and coupled to a vacuum source; a purge-gas supply line coupled to the hermetic purge container and coupled to a purge-gas supply source; and a purge-gas supply valve mounted to the purge-gas supply line.
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2.发明公开公开(公告)号：US20240359290A1
公开(公告)日：2024-10-31
申请号：US18642397
申请日：2024-04-22
申请人： EBARA CORPORATION
摘要： A polishing method includes: during polishing of the workpiece, creating a reference spectrum history and a monitoring spectrum history by repeatedly producing a reference spectrum and a monitoring spectrum at two points on the workpiece; calculating a plurality of reference history differences that are differences between a latest monitoring spectrum and a plurality of reference spectra in the reference spectrum history; calculating a plurality of monitoring history differences that are differences between a latest reference spectrum and a plurality of monitoring spectra in the monitoring spectrum history; calculating a film-thickness difference between a monitoring point and a reference point based on a local minimum point of a reference history difference or a monitoring history difference.
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公开(公告)号：US12128449B2
公开(公告)日：2024-10-29
申请号：US17839382
申请日：2022-06-13
申请人： EBARA CORPORATION
发明人： Hiroki Takahashi , Daichi Kondo , Yu Imamura
摘要： According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.
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公开(公告)号：US12094754B2
公开(公告)日：2024-09-17
申请号：US16823448
申请日：2020-03-19
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Takuya Inoue
IPC分类号： H01L21/687 , H02K11/24
CPC分类号： H01L21/68764 , H01L21/68728 , H02K11/24
摘要： Exemplary substrate supporting apparatus and method for attaching and/or detaching substrate are provided. In one aspect, substrate supporting apparatus has a plurality of supporting members 10 that contacts a circumferential part of a substrate W and rotate the substrate W; a pair of driven members 30 on which the plurality of supporting members 10 are provided; a connecting member 20 connecting one driven member 31 and another driven member 32; and a driving device 40 that brings the pair of driven members 30 close to each other or separates the pair of driven members 30 from each other, linearly along a first direction, by moving at least a part of the connecting member 20. Numerous other aspects are provided.
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公开(公告)号：US12083646B2
公开(公告)日：2024-09-10
申请号：US17573134
申请日：2022-01-11
申请人： EBARA CORPORATION
发明人： Hiroaki Shibue , Taro Takahashi , Toshiki Miyakawa
IPC分类号： B24B37/013 , B24B37/04
CPC分类号： B24B37/013 , B24B37/042
摘要： A polishing apparatus capable of acquiring accurate film thickness distribution information is disclosed. The polishing apparatus includes a polishing table, a plurality of film thickness sensors, and a controller. The controller analyzes film thickness distribution information of a substrate while identifying a notch position of the substrate based on the measured film thickness information, and outputs visualization information of the film thickness distribution with the notch position as a reference position.
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公开(公告)号：US20240286246A1
公开(公告)日：2024-08-29
申请号：US18441851
申请日：2024-02-14
申请人： EBARA CORPORATION
IPC分类号： B24B41/047 , B24B37/005
CPC分类号： B24B41/047 , B24B37/005
摘要： A technique is disclosed that can allow an elastic membrane to be inflated into a desired shape when a workpiece is released from a polishing head, or when the workpiece is held on the polishing head, thereby avoiding excessive stress on the workpiece. The method includes supplying a gas into a first pressure chamber and a second pressure chamber at a first flow rate and a second flow rate regulated by a first flow-rate control valve and a second flow-rate control valve to inflate an elastic membrane of a polishing head when a polished workpiece is released from the polishing head, or when a workpiece to be polished is held on the polishing head. The first pressure chamber and the second pressure chamber are formed by the elastic membrane.
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公开(公告)号：US20240279837A1
公开(公告)日：2024-08-22
申请号：US17790381
申请日：2021-06-17
申请人： EBARA CORPORATION
CPC分类号： C25D17/007 , C25D17/06 , C25D21/10
摘要： Provided is a resistor or the like that can improve uniformity of a plating film formed on a substrate. A resistor disposed between a substrate and an anode in a plating tank is provided. The resistor includes a first plurality of holes each formed on three or more reference circles being concentric and having different diameters and a second plurality of holes formed on an outer circumferential reference line surrounding the three or more reference circles, at least a part of the outer circumferential reference line being a trochoid curve.
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公开(公告)号：US20240278380A1
公开(公告)日：2024-08-22
申请号：US18571054
申请日：2022-06-14
申请人： EBARA CORPORATION
发明人： Shinro OTA , Masahiro HATAKEYAMA
IPC分类号： B24B37/013 , B24B37/04 , B24B37/10
CPC分类号： B24B37/013 , B24B37/042 , B24B37/10
摘要： The present invention relates to a polishing method and a polishing apparatus for polishing a substrate, such as a wafer. This method includes: polishing a substrate W; producing a torque waveform while polishing the substrate W; and selecting one reference torque waveform from a plurality of reference torque waveforms accumulated before the polishing of the substrate W. Polishing the substrate W includes an asperity polishing process and a flat polishing process. The asperity polishing process includes: determining film thicknesses at measurements point on the substrate W based on a film thickness of reference film data calculated based on a first relational expression; comparing the torque waveform and the selected reference torque waveform; and determining whether the asperity polishing process should be terminated. The flat polishing process includes determining film thicknesses at measurement points on the substrate W based on a film thickness of reference film data calculated based on a second relational expression.
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公开(公告)号：US20240271313A1
公开(公告)日：2024-08-15
申请号：US18017613
申请日：2022-06-17
申请人： EBARA CORPORATION
发明人： Masaki TOMITA , Kentaro YAMAMOTO
摘要： Provided is a plating apparatus that allows cleaning a contact cleaning member.
The plating apparatus includes: a plating tank configured to house a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward, the substrate holder including a contact member for feeding power to the substrate; a contact cleaning member 482 for discharging a cleaning liquid to the contact member while the contact cleaning member is at a cleaning position between the plating tank and the substrate holder; a driving mechanism 476 configured to move the contact cleaning member 482 between the cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover an upper portion of the contact cleaning member 482 while the contact cleaning member 482 is at the retracted position.-
公开(公告)号：US12053851B2
公开(公告)日：2024-08-06
申请号：US16454719
申请日：2019-06-27
申请人： EBARA CORPORATION
CPC分类号： B24B29/02 , B08B1/32 , B08B1/50 , H01L21/67046 , H01L21/67051
摘要： A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.
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