Abstract:
A clamping apparatus includes a receiving frame, a guide plate, two drive assemblies, and two clamping assemblies. The receiving frame includes two parallel securing arms and a connection arm. The securing arms and the connection arm define a first receiving space. Each of the securing arms defines a slot. The guide plate is configured for mounting of a workpiece thereon. The drive assemblies are configured for cooperatively moving the guide plate between a first position and a second position. When the guide plate is located at the first position, the workpiece is loaded on the guide plate and distant from the connection arm. When the guide plate is located at the second position, the workpiece is adjacent to the connection arm and entirely received in the first receiving space and the slots. The clamping assemblies are configured for cooperatively clamping the workpiece.
Abstract:
A method for screen printing a printed circuit board substrate comprises the following steps. A printed circuit board substrate including a copper foil layer is provided. Pluralities of marks are formed on the copper foil layer. A plurality of printing screens are provided, each includes an screen pattern and an opening corresponding to a respective mark. Printing material is applied on the ith screen Si to form an ith printing pattern and cover the ith mark at the ith opening, the ith printing pattern conforms to the ith screen pattern; checking whether the ith mark is covered by the printing material when i is less than N. Printing material is applied on the (i+1)th screen Si+1 so as to form an (i+1)th printing pattern on the copper foil layer and covers the (i+1)th Mark Mi+1 at the (i+1)th opening, if the ith mark is covered by the printing material.
Abstract:
A printed circuit board comprises a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The circuit substrate comprises a base layer, a grounded circuit layer, and a connecting pad formed on the grounded circuit layer. The cloth structure comprises an anisotropic conductive adhesive connected to the connecting pad, an insulating layer, and a metallic deposition layer arranged between the anisotropic conductive adhesive and the insulating layer. The shielding structure comprises a shielding metal layer, an adhesive matrix, and a number of electrically conductive particles electrically connected to the shielding metal layer. The insulating layer defines a number of through holes corresponding to the particles, the particles is arranged in the through holes respectively and electrically connected the metallic deposition layer and the shielding metal layer. A method for manufacturing the above PCB is also provided.
Abstract:
A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.
Abstract:
An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.
Abstract:
A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.
Abstract:
An exemplary wet processing apparatus includes a conveyor, a spraying system, and a suction system. The conveyor is configured for conveying a substrate. The spraying system includes an upper spraying conduit above the conveyor and an upper spraying nozzle mounted on the upper spraying conduit. The suction system includes a suction conduit and a suction nozzle connected to the suction conduit. The suction nozzle is adjacent to the conveyor and configured for suction the wet processing liquid sprayed on the substrate. The suction conduit is connected to the spraying conduit in such a manner that the flowing of the wet processing liquid in the upper spraying conduit can create a negative pressure in the suction conduit to enable the suction nozzle to suck the wet processing liquid on the substrate.
Abstract:
An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.
Abstract:
A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.
Abstract:
An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.