CLAMPING APPARATUS
    1.
    发明申请
    CLAMPING APPARATUS 失效
    夹紧装置

    公开(公告)号:US20120146277A1

    公开(公告)日:2012-06-14

    申请号:US13094808

    申请日:2011-04-26

    Inventor: CHIEN-PANG CHENG

    CPC classification number: H05K13/0069

    Abstract: A clamping apparatus includes a receiving frame, a guide plate, two drive assemblies, and two clamping assemblies. The receiving frame includes two parallel securing arms and a connection arm. The securing arms and the connection arm define a first receiving space. Each of the securing arms defines a slot. The guide plate is configured for mounting of a workpiece thereon. The drive assemblies are configured for cooperatively moving the guide plate between a first position and a second position. When the guide plate is located at the first position, the workpiece is loaded on the guide plate and distant from the connection arm. When the guide plate is located at the second position, the workpiece is adjacent to the connection arm and entirely received in the first receiving space and the slots. The clamping assemblies are configured for cooperatively clamping the workpiece.

    Abstract translation: 夹紧装置包括接收框架,导向板,两个驱动组件和两个夹紧组件。 接收框架包括两个平行的固定臂和连接臂。 固定臂和连接臂限定第一容纳空间。 每个固定臂限定一个槽。 引导板构造成用于在其上安装工件。 驱动组件构造成用于在第一位置和第二位置之间协调地移动引导板。 当导板位于第一位置时,工件被装载在引导板上并远离连接臂。 当导板位于第二位置时,工件与连接臂相邻并且完全接收在第一容纳空间和槽中。 夹紧组件被构造成用于协同地夹紧工件。

    METHOD FOR SCREEN PRINTING PRINTED CIRCUIT BOARD SUBSTRATE
    2.
    发明申请
    METHOD FOR SCREEN PRINTING PRINTED CIRCUIT BOARD SUBSTRATE 失效
    印刷印刷电路板基板的方法

    公开(公告)号:US20120055356A1

    公开(公告)日:2012-03-08

    申请号:US13171464

    申请日:2011-06-29

    Applicant: XIAO-FEI ZHENG

    Inventor: XIAO-FEI ZHENG

    CPC classification number: H05K3/1216 H05K1/0269 H05K2201/09936 H05K2203/166

    Abstract: A method for screen printing a printed circuit board substrate comprises the following steps. A printed circuit board substrate including a copper foil layer is provided. Pluralities of marks are formed on the copper foil layer. A plurality of printing screens are provided, each includes an screen pattern and an opening corresponding to a respective mark. Printing material is applied on the ith screen Si to form an ith printing pattern and cover the ith mark at the ith opening, the ith printing pattern conforms to the ith screen pattern; checking whether the ith mark is covered by the printing material when i is less than N. Printing material is applied on the (i+1)th screen Si+1 so as to form an (i+1)th printing pattern on the copper foil layer and covers the (i+1)th Mark Mi+1 at the (i+1)th opening, if the ith mark is covered by the printing material.

    Abstract translation: 丝网印刷印刷电路板基板的方法包括以下步骤。 提供了包括铜箔层的印刷电路板基板。 在铜箔层上形成多个标记。 提供了多个印刷屏幕,每个印刷屏幕包括一个屏幕图案和一个对应于相应标记的开口。 打印材料应用于第i个屏幕Si上,形成第i个印刷图案,并在第i个开口处覆盖第i个印记,第i个打印图案符合第i个屏幕图案; 检查当i小于N时第i个标记是否被打印材料覆盖。在第(i + 1)个屏幕Si + 1上施加印刷材料,以便在铜上形成第(i + 1)印刷图案 如果第i个标记被打印材料覆盖,则在第(i + 1)个开口处覆盖第(i + 1)个Mark Mi + 1。

    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
    3.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
    印刷电路板及其制造方法

    公开(公告)号:US20120048603A1

    公开(公告)日:2012-03-01

    申请号:US13117159

    申请日:2011-05-27

    Applicant: FENG-YAN HUANG

    Inventor: FENG-YAN HUANG

    Abstract: A printed circuit board comprises a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The circuit substrate comprises a base layer, a grounded circuit layer, and a connecting pad formed on the grounded circuit layer. The cloth structure comprises an anisotropic conductive adhesive connected to the connecting pad, an insulating layer, and a metallic deposition layer arranged between the anisotropic conductive adhesive and the insulating layer. The shielding structure comprises a shielding metal layer, an adhesive matrix, and a number of electrically conductive particles electrically connected to the shielding metal layer. The insulating layer defines a number of through holes corresponding to the particles, the particles is arranged in the through holes respectively and electrically connected the metallic deposition layer and the shielding metal layer. A method for manufacturing the above PCB is also provided.

    Abstract translation: 印刷电路板包括电路基板,导电布结构和屏蔽结构。 电路基板包括形成在接地电路层上的基极层,接地电路层和连接焊盘。 布结构包括连接到连接垫的各向异性导电粘合剂,绝缘层和布置在各向异性导电粘合剂和绝缘层之间的金属沉积层。 屏蔽结构包括屏蔽金属层,粘合剂基质和电连接到屏蔽金属层的多个导电颗粒。 绝缘层限定了与颗粒相对应的多个通孔,颗粒分别布置在通孔中并电连接金属沉积层和屏蔽金属层。 还提供了制造上述PCB的方法。

    PRINTED CIRCUIT BOARD WITH FINS AND METHOD FOR MANUFACTURING SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD WITH FINS AND METHOD FOR MANUFACTURING SAME 有权
    具有FINS的印刷电路板及其制造方法

    公开(公告)号:US20110253423A1

    公开(公告)日:2011-10-20

    申请号:US13049906

    申请日:2011-03-17

    Inventor: CHIEN-PANG CHENG

    Abstract: A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.

    Abstract translation: 印刷电路板包括绝缘层,信号迹线,接地迹线和鳍片。 绝缘层具有第一表面和相对的第二表面。 在绝缘层的第一表面上形成信号迹线和接地迹线。 第一个翅片直接形成在地面上。 还提供了制造印刷电路板的方法。

    ELECTROPLATING APPARATUS
    5.
    发明申请
    ELECTROPLATING APPARATUS 失效
    电镀设备

    公开(公告)号:US20110233052A1

    公开(公告)日:2011-09-29

    申请号:US12913782

    申请日:2010-10-28

    Inventor: CHIEN-PANG CHENG

    CPC classification number: C25D17/04

    Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

    Abstract translation: 电镀设备包括电镀槽,第一支撑杆,第一保持元件,两个第二支撑杆,多个隔开的横梁,多个第二保持元件和电源。 第一保持元件从第一支撑杆悬挂在箱中,并且第一保持元件构造成用于沿着第一支撑杆定位工件以保持板状工件。 第二保持元件从相应的横梁悬挂,每个第二保持元件布置在第一和第二支撑杆之间,并且构造成用于保持金属块。 电源包括用于通过第一支撑杆和第一保持元件与工件电连接的阴极和用于通过第二支撑杆和第二保持元件电连接到金属块的阳极。

    APPARATUS FOR WET PROCESSING SUBSTRATE
    7.
    发明申请
    APPARATUS FOR WET PROCESSING SUBSTRATE 有权
    湿处理基板装置

    公开(公告)号:US20110024042A1

    公开(公告)日:2011-02-03

    申请号:US12766903

    申请日:2010-04-25

    Abstract: An exemplary wet processing apparatus includes a conveyor, a spraying system, and a suction system. The conveyor is configured for conveying a substrate. The spraying system includes an upper spraying conduit above the conveyor and an upper spraying nozzle mounted on the upper spraying conduit. The suction system includes a suction conduit and a suction nozzle connected to the suction conduit. The suction nozzle is adjacent to the conveyor and configured for suction the wet processing liquid sprayed on the substrate. The suction conduit is connected to the spraying conduit in such a manner that the flowing of the wet processing liquid in the upper spraying conduit can create a negative pressure in the suction conduit to enable the suction nozzle to suck the wet processing liquid on the substrate.

    Abstract translation: 一种示例性的湿式加工设备包括输送机,喷涂系统和抽吸系统。 输送机构造成用于输送基底。 喷涂系统包括在输送机上方的上部喷洒管道和安装在上部喷洒管道上的上部喷洒喷嘴。 抽吸系统包括抽吸管道和连接到抽吸管道的吸嘴。 吸嘴与输送机相邻,构造成用于抽吸喷涂在基底上的湿处理液。 吸入管道以这样的方式连接到喷射管道,使得上部喷洒管道中的湿处理液体的流动可以在吸入管道中产生负压,以使吸嘴能够吸收基底上的湿处理液体。

    Method for manufacturing printed circuit boards using legend printing stencil
    8.
    发明授权
    Method for manufacturing printed circuit boards using legend printing stencil 有权
    使用传说印刷模板制造印刷电路板的方法

    公开(公告)号:US07854197B2

    公开(公告)日:2010-12-21

    申请号:US11940910

    申请日:2007-11-15

    Abstract: An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.

    Abstract translation: 提供了用于印刷用于制造多个印刷电路板的电路基板的示例性图案印刷模版。 模板包括至少第一印刷部分,至少第二印刷部分和第一印刷部分和第二印刷部分之间的连接部分。 第一印刷部分和第二印刷部分各自在其中限定多个图例孔。 第一印刷部分和第二部分被配置为附接在电路基板的相应的电路板单元上并覆盖其上,以在电路板单元上打印图例。 接合部分在其中限定槽,并且被配置用于附接在电路基板的对应连接部分上并覆盖其上,以在连接部分上印刷图例油墨层。 还提供了使用该模板制造多个印刷电路板的方法。

    Method for manufacturing rigid-flexible printed circuit board
    9.
    发明授权
    Method for manufacturing rigid-flexible printed circuit board 有权
    硬质柔性印刷电路板的制造方法

    公开(公告)号:US07789989B2

    公开(公告)日:2010-09-07

    申请号:US12270612

    申请日:2008-11-13

    Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

    Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先,提供柔性基板。 其次,在柔性基板中限定至少一个狭缝。 第三,提供具有对应于柔性基板的结构的刚性基板。 第四,将柔性基板层合到刚性基板上以获得层压基板。 第五,去除刚性基板的一部分。 第六,层叠基板沿着假想边界线切割以去除层叠基板的废弃部分。 因此,获得刚性柔性印刷电路板。

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