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    Systems, structures and materials for electronic device cooling
    2.
    发明授权
    Systems, structures and materials for electronic device cooling 有权
    用于电子设备冷却的系统，结构和材料

    公开(公告)号：US09392730B2

    公开(公告)日：2016-07-12

    申请号：US14055616

    申请日：2013-10-16

    申请人： Outlast Technologies LLC

    发明人： Mark Hartmann ,  Greg Roda

    IPC分类号： H05K7/20 ,  H05K3/30 ,  G06F1/20

    CPC分类号： H05K1/0209 ,  G06F1/203 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/28 ,  H05K3/284 ,  H05K3/285 ,  H05K3/30 ,  H05K7/2039 ,  H05K7/20454 ,  Y10T29/49146 ,  H01L2924/00

    摘要： An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

    摘要翻译： 具有在运行中产生热量的一个或多个部件的电子设备包括用于温度管理和散热的结构。 用于温度管理和散热的结构包括具有与周围环境热连通的表面的传热基板和与电子设备的一个或多个部件的至少一部分物理接触的温度管理材料， 至少一部分传热基板。 温度管理材料包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度和导热填料的聚合物相变材料。

    SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING
    5.
    发明申请
    SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING 有权
    电子设备冷却系统，结构和材料

    公开(公告)号：US20140043754A1

    公开(公告)日：2014-02-13

    申请号：US14055616

    申请日：2013-10-16

    申请人： Outlast Technologies LLC

    发明人： Mark Hartmann ,  Greg Roda

    IPC分类号： H05K7/20 ,  H05K3/30

    CPC分类号： H05K1/0209 ,  G06F1/203 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/28 ,  H05K3/284 ,  H05K3/285 ,  H05K3/30 ,  H05K7/2039 ,  H05K7/20454 ,  Y10T29/49146 ,  H01L2924/00

    摘要： An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

    摘要翻译： 具有在运行中产生热量的一个或多个部件的电子设备包括用于温度管理和散热的结构。 用于温度管理和散热的结构包括具有与周围环境热连通的表面的传热基板和与电子设备的一个或多个部件的至少一部分物理接触的温度管理材料， 至少一部分传热基板。 温度管理材料包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度和导热填料的聚合物相变材料。

    Articles containing functional polymeric phase change materials and methods of manufacturing the same
    6.
    发明授权
    Articles containing functional polymeric phase change materials and methods of manufacturing the same 有权
    含有功能性聚合物相变材料的制品及其制造方法

    公开(公告)号：US09234059B2

    公开(公告)日：2016-01-12

    申请号：US12185908

    申请日：2008-08-05

    申请人： Mark Hartmann ,  Aharon Eyal

    发明人： Mark Hartmann ,  Aharon Eyal

    IPC分类号： C08F120/32 ,  D01F1/10 ,  D06M15/263 ,  D06M15/273 ,  C08F220/18 ,  C09K5/06 ,  D01F2/28 ,  D01F6/38

    CPC分类号： C09K5/063 ,  C08F8/14 ,  C08F120/32 ,  C08F220/18 ,  D01F1/10 ,  D01F2/28 ,  D01F6/38 ,  D06M15/263 ,  D06M15/273 ,  D06M2101/06 ,  D06M2400/01 ,  Y10T428/249921 ,  Y10T428/249953 ,  Y10T428/2933 ,  Y10T428/2964 ,  Y10T428/31743 ,  Y10T428/31855 ,  Y10T428/3188 ,  Y10T442/20 ,  C08F2220/1891 ,  C08F2220/325

    摘要： An article comprises a substrate and a functional polymeric phase change material bound to the substrate. In some aspects the functional polymeric phase change material is chemically bound to the substrate and can be accomplished by at least one of covalent bonding or electrovalent bonding. The functional polymeric phase change material can comprise a reactive function selected from the group consisting of an acid anhydride group, an alkenyl group, an alkynyl group, an alkyl group, an aldehyde group, an amide group, an amino group and their salts, a N-substituted amino group, an aziridine, an aryl group, a carbonyl group, a carboxy group and their salts, an epoxy group, an ester group, an ether group, a glycidyl group, a halo group, a hydride group, a hydroxy group, an isocyanate group, a thiol group, a disulfide group, a silyl or silane group, an urea group, and an urethane group, and wherein the substrate comprises at least one of cellulose, wool, fur, leather, polyester and nylon. Methods of producing the articles are also disclosed.

    摘要翻译： 一种制品包括底物和与基底结合的官能聚合物相变材料。 在一些方面，功能性聚合物相变材料化学结合到基底上，并且可以通过共价键或电价键中的至少一种来实现。 官能聚合相变材料可以包括选自酸酐基，烯基，炔基，烷基，醛基，酰胺基，氨基及其盐的反应性官能团， N-取代氨基，氮丙啶，芳基，羰基，羧基及其盐，环氧基，酯基，醚基，缩水甘油基，卤代基，氢化物基，羟基 基团，异氰酸酯基，硫醇基，二硫键，甲硅烷基或硅烷基，脲基和氨基甲酸酯基，其中所述基材包含纤维素，羊毛，毛皮，皮革，聚酯和尼龙中的至少一种。 还公开了制造物品的方法。