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    Multilayer wiring board
    5.
    发明授权
    Multilayer wiring board 有权
    多层接线板

    公开(公告)号：US09420706B2

    公开(公告)日：2016-08-16

    申请号：US14164900

    申请日：2014-01-27

    申请人： Tatsuta Electric Wire & Cable Co., Ltd.

    发明人： Norihiro Yamaguchi ,  Hiroaki Umeda ,  Ken Yukawa

    IPC分类号： H05K1/09 ,  H05K3/46 ,  H01B1/22 ,  H05K3/40 ,  H05K1/02 ,  H05K3/00

    CPC分类号： H05K3/46 ,  H01B1/22 ,  H05K1/0298 ,  H05K1/095 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/462 ,  H05K2201/0191 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1194 ,  H05K2203/1461 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.

    摘要翻译： 在制造多层板的方法中，包括：通过激光束加工形成通孔的钻孔步骤，用含有树脂成分和金属粉末的导电膏填充通孔的步骤，以及步骤 在填充的导电糊料上和下方布置图案化板的铜层或铜层部分并对其进行压制，通过使用合金糊作为导电浆料，获得导电性和长期稳定性优异的多层印刷线路板，其中至少 使用在进行预热之前，使用比例A / B为10以上的预浸料，将金属粉末的一部分熔融并且彼此相邻的金属粉末合金化，其中A是在拐点处的储能模量， 储能模量从增加到减少变化，B是在从60℃升高的温度分布中储能模量从降低到升高的拐点处的储能模量 到200℃，并且在钻井步骤之前预热预浸料以将A / B比率降低到10以下。

    Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same
    7.
    发明授权
    Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same 有权

    公开(公告)号：US10893603B2

    公开(公告)日：2021-01-12

    申请号：US16462681

    申请日：2017-12-06

    申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

    发明人： Hiroaki Umeda ,  Kazuhiro Matsuda ,  Ken Yukawa

    IPC分类号： H05K1/02

    摘要： A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.

    HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY, AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY, AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20200084875A1

    公开(公告)日：2020-03-12

    申请号：US16462681

    申请日：2017-12-06

    申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

    发明人： Hiroaki Umeda ,  Kazuhiro Matsuda ,  Ken Yukawa

    IPC分类号： H05K1/02 ,  H01L23/373 ,  H01L23/367

    摘要： A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.