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    High thermal conductivity prepreg and uses of the same
    6.
    发明授权
    High thermal conductivity prepreg and uses of the same 有权

    公开(公告)号：US11306239B2

    公开(公告)日：2022-04-19

    申请号：US16359825

    申请日：2019-03-20

    申请人： TAIWAN UNION TECHNOLOGY CORPORATION

    发明人： Chih-Wei Liao ,  Chen-Hua Yu

    IPC分类号： B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B27/12 ,  B32B27/38 ,  C08J5/24 ,  H05K1/03 ,  C09K5/14 ,  C08J5/08 ,  H05K1/02 ,  H05K3/02 ,  B32B5/02 ,  B32B15/20

    摘要： A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.

    METAL-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    METAL-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210060900A1

    公开(公告)日：2021-03-04

    申请号：US16783909

    申请日：2020-02-06

    申请人： TAIWAN UNION TECHNOLOGY CORPORATION

    发明人： Shi-Ing HUANG ,  Shur-Fen LIU ,  Kai-Hsiang LIN

    IPC分类号： B32B15/085 ,  B32B27/32 ,  B32B5/02 ,  B32B15/20 ,  B32B27/12 ,  H05K3/02 ,  H05K1/03

    摘要： A metal-clad laminate, a printed circuit board using the same and a method for manufacturing the metal-clad laminate. The metal-clad laminate comprises: a first dielectric layer, comprising a first dielectric material and not comprising a reinforcing fabric, the first dielectric material comprising 20 wt % to 60 wt % of a first fluoropolymer and 40 wt % to 80 wt % of a first filler; a second dielectric layer disposed on one side of the first dielectric layer and comprising a reinforcing fabric and a second dielectric material formed on the surface of the reinforcing fabric, wherein the thickness of the reinforcing fabric is not higher than 65 μm and the second dielectric material comprises 55 wt % to 100 wt % of a second fluoropolymer and 0 to 45 wt % of a second filler; and a metal foil disposed on the other side of the second dielectric layer that is opposite to the first dielectric layer.

    Resin composition and uses of the same
    10.
    发明授权
    Resin composition and uses of the same 有权

    公开(公告)号：US10793716B2

    公开(公告)日：2020-10-06

    申请号：US13834341

    申请日：2013-03-15

    申请人： Taiwan Union Technology Corporation

    发明人： Meng-Huei Chen ,  Shur-Fen Liu

    IPC分类号： C08L71/12 ,  B32B15/14 ,  C08J5/24 ,  B32B15/20 ,  B32B5/02

    摘要： A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): (b) a nonpolar elastomer containing vinyl group, wherein the content of the vinyl group is no more than 60%; and (c) a peroxide as a polymerization initiator, wherein, R1, R2, A1, A2, and n are as defined in the specification; and the content of component (b) is about 2% to about 100% based on the weight of component (a), and the content of component (c) is about 0.01% to about 10% based on the total weight of component (a) and component (b).