BONDING METHOD AND BONDED STRUCTURE
    3.
    发明申请
    BONDING METHOD AND BONDED STRUCTURE 审中-公开
    结合方法和结合结构

    公开(公告)号:US20100243145A1

    公开(公告)日:2010-09-30

    申请号:US12729491

    申请日:2010-03-23

    IPC分类号: B32B38/10

    摘要: A bonding method includes: preparing a first base material to have liquid repellency against a silicone material-containing liquid material; applying the liquid material to a surface of the first base material to form a liquid coating in a predetermined shape, and drying the liquid coating to obtain a bonding film with the predetermined shape; imparting energy to the bonding film to develop adhesion near a surface of the bonding film, and bonding the first base material to a second base material via the bonding film, and then separating the first and second base materials from each other to transfer the bonding film to the second base material; and imparting energy to the bonding film after the transfer to develop adhesion near a surface of the bonding film, and bonding the second base material to a third base material via the bonding film to obtain a bonded structure.

    摘要翻译: 接合方法包括:制备第一基材以对含有硅酮材料的液体材料具有疏液性; 将液体材料施加到第一基材的表面以形成预定形状的液体涂层,并干燥该液体涂层以获得具有预定形状的接合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力的能量,并且经由所述接合膜将所述第一基材接合到第二基材,然后将所述第一基材与所述第二基材分离,以将所述接合膜 到第二基材; 并且在转印之后向接合膜赋予能量以在接合膜的表面附近形成附着力,并且经由接合膜将第二基材接合到第三基材以获得接合结构。