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公开(公告)号：US20230299035A1
公开(公告)日：2023-09-21
申请号：US17698134
申请日：2022-03-18
申请人： Meta Platforms, Inc.
IPC分类号： H01L23/00 , H01L23/552
CPC分类号： H01L24/40 , H01L23/552 , H01L24/77 , H01L24/84 , H01L2224/40227 , H01L2224/77343 , H01L2224/7755 , H01L2224/84047 , H01L2224/8412 , H01L2224/84207 , H01L2924/3025
摘要： Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of contacts of the integrated circuit die and a second contact of a plurality of contacts of the package substrate.
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公开(公告)号：US11764184B1
公开(公告)日：2023-09-19
申请号：US18300379
申请日：2023-04-13
发明人： Chen-Nan Lai , Yisheng Wu
IPC分类号： H01L23/00
CPC分类号： H01L24/77 , H01L24/27 , H01L24/35 , H01L24/40 , H01L24/50 , H01L24/75 , H01L24/79 , H01L24/83 , H01L24/84 , H01L24/86 , H01L2224/40229 , H01L2224/7755 , H01L2224/77252 , H01L2224/84203 , H01L2924/40
摘要： The present disclosure provides a chip packaging device, a chip packaging method, and a package chip, and is related to a technical field of chip packaging. The chip packaging device includes conductive sheets, a vacuum suction movable assembly defining a variable suction surface, and a heating assembly. The variable suction surface sucks the plurality of conductive sheets. A first end of each of the conductive sheets is disposed above a corresponding bonding pads. A second end of each of the conductive sheets is disposed above a corresponding welding pin, so that when the variable suction surface is pressed down, the first end of each of the conductive sheets is pressed onto the corresponding bonding pad, and the second end of each of the conductive sheets is pressed onto the corresponding welding pin. The heating assembly heats solders on the bonding pads and the welding pins.
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公开(公告)号：US20230154889A1
公开(公告)日：2023-05-18
申请号：US17954215
申请日：2022-09-27
发明人： Manabu ISHIKAWA
IPC分类号： H01L23/00 , H01L25/07 , H01L21/48 , H01L23/373
CPC分类号： H01L24/84 , H01L24/37 , H01L24/40 , H01L24/77 , H01L25/072 , H01L21/4882 , H01L23/3735 , H01L2224/37147 , H01L2224/37124 , H01L2224/84201 , H01L2224/77754 , H01L2224/7755 , H01L2224/40499 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29109 , H01L2224/29139 , H01L2224/29147 , H01L2924/0132 , H01L2924/0133 , H01L2224/40225 , H01L2224/32225 , H01L2224/73263 , H01L2224/92246 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/92 , H01L24/48 , H01L2224/48225 , H01L2224/73221
摘要： A semiconductor device manufacturing method, includes: a preparing process for preparing a conductive plate, a semiconductor chip arranged over the conductive plate with a first bonding material therebetween, and a connection terminal including a bonding portion arranged over the semiconductor chip with a second bonding material therebetween; a first jig arrangement process for arranging a first guide jig, through which a first guide hole pierces, over the conductive plate, such that the first guide hole corresponds to the bonding portion in a plan view of the semiconductor device; and a first pressing process for inserting a pillar-shaped pressing jig, which includes a pressing portion at a lower end portion thereof, into the first guide hole, and pressing the bonding portion of the connection terminal to a side of the conductive plate with the pressing portion.
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4.发明申请公开(公告)号：US20150206830A1
公开(公告)日：2015-07-23
申请号：US14422351
申请日：2012-09-24
发明人： Keita Takada , Tadatoshi Danno , Toshiyuki Hata
IPC分类号： H01L23/495 , H01L23/31 , H01L21/56
CPC分类号： H01L23/49524 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/77 , H01L24/84 , H01L24/92 , H01L2224/05554 , H01L2224/29111 , H01L2224/32245 , H01L2224/3701 , H01L2224/37147 , H01L2224/40091 , H01L2224/40095 , H01L2224/40132 , H01L2224/40245 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/7755 , H01L2224/77611 , H01L2224/83801 , H01L2224/8385 , H01L2224/84005 , H01L2224/84205 , H01L2224/84345 , H01L2224/85005 , H01L2224/85205 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/0132 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01047 , H01L2924/0105 , H01L2924/207 , H01L2924/206
摘要： A lead frame having a first chip-mounting part on which a first semiconductor chip is mounted and having a second chip-mounting part on which a second semiconductor chip is mounted is prepared. Moreover, a process is provided, the process connecting a first electrode pad, which is formed on a top surface of the first semiconductor chip, with a first end of a first metal ribbon and connecting a ribbon-connecting surface on the second chip-mounting part with a second end of the first metal ribbon on the opposite side of the first end. Moreover, in a plan view, the ribbon-connecting surface of the second chip-mounting part is positioned between the first semiconductor chip and the second semiconductor chip. Moreover, the height of the ribbon-connecting surface is positioned at a position higher than the height of a mounting surface of the second semiconductor chip of the second chip-mounting part.
摘要翻译： 一种具有第一芯片安装部分的引线框架，其上安装有第一半导体芯片，并且具有安装有第二半导体芯片的第二芯片安装部件。 此外，提供了一种处理，其将形成在第一半导体芯片的顶表面上的第一电极焊盘与第一金属带的第一端连接并将第二芯片安装上的带状连接表面连接 第一金属带的第二端在第一端的相对侧上。 此外，在平面图中，第二芯片安装部分的带状连接表面位于第一半导体芯片和第二半导体芯片之间。 此外，带状连接表面的高度位于比第二芯片安装部件的第二半导体芯片的安装表面的高度高的位置。
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