公开(公告)号：US20180254267A1

公开(公告)日：2018-09-06

申请号：US15971274

申请日：2018-05-04

申请人： FUJI ELECTRIC CO., LTD.

发明人： Kenichiro SATO

IPC分类号： H01L25/18 ,  H01L21/67 ,  H01L23/495 ,  H01L25/07 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/18 ,  H01L21/67121 ,  H01L21/67259 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49579 ,  H01L24/05 ,  H01L24/09 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/77 ,  H01L24/84 ,  H01L24/85 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/77272 ,  H01L2224/77702 ,  H01L2224/77705 ,  H01L2224/80121 ,  H01L2224/80136 ,  H01L2224/80815 ,  H01L2224/85121 ,  H01L2224/85136 ,  H01L2224/85801 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/172 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/207

摘要： A method of manufacturing a semiconductor device that includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected through a first joining material to the conductive pattern, a second semiconductor chip with a rectangular shape disposed on the conductive pattern separated from the first semiconductor chip and connected through a second joining material to the conductive pattern, a terminal disposed above the semiconductor chips, respectively connected to the first and second semiconductor chips through third and fourth joining materials, the terminal having a through-hole above a place between the first and second semiconductor chips, the method including a positioning step in which the first and second semiconductor chips are respectively positioned at at least three positioning places, and at least one of the positioning places is positioned with a positioning member inserted into the through-hole.

公开(公告)号：US09991242B2

公开(公告)日：2018-06-05

申请号：US14620184

申请日：2015-02-11

申请人： FUJI ELECTRIC CO., LTD.

发明人： Kenichiro Sato

IPC分类号： H01L23/00 ,  H01L25/18 ,  H01L21/67 ,  H01L23/495 ,  H01L25/00 ,  H01L25/07

CPC分类号： H01L25/18 ,  H01L21/67121 ,  H01L21/67259 ,  H01L23/49541 ,  H01L23/49579 ,  H01L24/05 ,  H01L24/09 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/77 ,  H01L24/84 ,  H01L24/85 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/77272 ,  H01L2224/77702 ,  H01L2224/77705 ,  H01L2224/80121 ,  H01L2224/80136 ,  H01L2224/80815 ,  H01L2224/85121 ,  H01L2224/85136 ,  H01L2224/85801 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/172 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/207

摘要： A semiconductor device has a plurality of small-sized semiconductor chips disposed between an insulated circuit board having a conductive pattern and a terminal. The semiconductor device exhibits a high accuracy in positioning the semiconductor chips. The semiconductor device includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected to the conductive pattern through a first joining material, a second semiconductor chip with a rectangular shape, disposed on the conductive pattern separated from the first semiconductor chip and connected to the conductive pattern through a second joining material, and a terminal disposed above the first semiconductor chip and the second semiconductor chip, connected to the first semiconductor chip through a third joining material, and connected to the second semiconductor chip through a fourth joining material. The terminal has a through-hole above a place between the first semiconductor chip and the second semiconductor chip.

公开(公告)号：US20230395555A1

公开(公告)日：2023-12-07

申请号：US18087951

申请日：2022-12-23

申请人： HYUNDAI MOBIS CO., LTD.

发明人： Se Min PARK ,  Seung Jun NOH

IPC分类号： H01L23/00 ,  H01L23/367 ,  H01L25/00

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L24/73 ,  H01L24/92 ,  H01L23/367 ,  H01L24/77 ,  H01L25/50 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/73263 ,  H01L2224/9221 ,  H01L2224/37011 ,  H01L2224/77704 ,  H01L2224/77705 ,  H01L2224/83815 ,  H01L2224/84815 ,  H01L2224/83192 ,  H01L2224/40475

摘要： The present invention relates to a power module that is capable of decreasing the number of components and assembling man-hours by applying a metal clip and performing an integrated soldering process and is capable of keeping a thickness of a soldering part constant and preventing movement of chips at the time of soldering by using a soldering jig.

公开(公告)号：US20150255444A1

公开(公告)日：2015-09-10

申请号：US14620184

申请日：2015-02-11

申请人： FUJI ELECTRIC CO., LTD.

发明人： Kenichiro SATO

IPC分类号： H01L25/18 ,  H01L21/67 ,  H01L23/00 ,  H01L25/00 ,  H01L23/495

CPC分类号： H01L25/18 ,  H01L21/67121 ,  H01L21/67259 ,  H01L23/49541 ,  H01L23/49579 ,  H01L24/05 ,  H01L24/09 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/77 ,  H01L24/84 ,  H01L24/85 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/77272 ,  H01L2224/77702 ,  H01L2224/77705 ,  H01L2224/80121 ,  H01L2224/80136 ,  H01L2224/80815 ,  H01L2224/85121 ,  H01L2224/85136 ,  H01L2224/85801 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/172 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/207

摘要： A semiconductor device has a plurality of small-sized semiconductor chips disposed between an insulated circuit board having a conductive pattern and a terminal. The semiconductor device exhibits a high accuracy in positioning the semiconductor chips. The semiconductor device includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected to the conductive pattern through a first joining material, a second semiconductor chip with a rectangular shape, disposed on the conductive pattern separated from the first semiconductor chip and connected to the conductive pattern through a second joining material, and a terminal disposed above the first semiconductor chip and the second semiconductor chip, connected to the first semiconductor chip through a third joining material, and connected to the second semiconductor chip through a fourth joining material. The terminal has a through-hole above a place between the first semiconductor chip and the second semiconductor chip.

摘要翻译： 半导体器件具有设置在具有导电图案的绝缘电路板和端子之间的多个小尺寸半导体芯片。 半导体器件在半导体芯片的定位方面表现出高精度。 半导体器件包括具有导电图案的绝缘电路板，​​通过第一接合材料连接到导电图案的矩形形状的第一半导体芯片，具有矩形形状的第二半导体芯片，设置在与第一接合材料分离的导电图案上 半导体芯片，并且通过第二接合材料连接到导电图案，以及设置在第一半导体芯片和第二半导体芯片上方的端子，通过第三接合材料连接到第一半导体芯片，并且通过第二接合材料连接到第二半导体芯片 第四连接材料。 端子在第一半导体芯片和第二半导体芯片之间的位置之上具有通孔。