公开(公告)号：US20170186727A1

公开(公告)日：2017-06-29

申请号：US15457852

申请日：2017-03-13

申请人： MC10, Inc.

发明人： Mitul Dalal ,  Sanjay Gupta

IPC分类号： H01L25/065 ,  H01L23/66 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L25/0655 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L24/92 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48499 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/85005 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/86005 ,  H01L2224/86801 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/0298 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

公开(公告)号：US20160099227A1

公开(公告)日：2016-04-07

申请号：US14870802

申请日：2015-09-30

申请人： MC10, Inc.

发明人： Mitul Dalal ,  Sanjay Gupta

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/538 ,  H01L23/522

CPC分类号： H01L25/0655 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L24/92 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48499 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/85005 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/86005 ,  H01L2224/86801 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/0298 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

摘要翻译： 柔性互连，灵活的集成电路系统和设备以及制造和使用柔性集成电路的方法在本文中给出。 公开了一种灵活的集成电路系统，其包括通过离散的柔性互连电连接的第一和第二分立器件。 第一分立器件包括在其外表面上具有第一电连接焊盘的第一柔性多层集成电路（IC）封装。 第二分立器件包括在其外表面上具有第二电连接焊盘的第二柔性多层集成电路（IC）封装。 离散的柔性互连件附接到第一分立器件的第一电连接焊盘并将其电连接到第二分立器件的第二电连接焊盘。