公开(公告)号：US20160099227A1

公开(公告)日：2016-04-07

申请号：US14870802

申请日：2015-09-30

申请人： MC10, Inc.

发明人： Mitul Dalal ,  Sanjay Gupta

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/538 ,  H01L23/522

CPC分类号： H01L25/0655 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L24/92 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48499 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/85005 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/86005 ,  H01L2224/86801 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/0298 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

摘要翻译： 柔性互连，灵活的集成电路系统和设备以及制造和使用柔性集成电路的方法在本文中给出。 公开了一种灵活的集成电路系统，其包括通过离散的柔性互连电连接的第一和第二分立器件。 第一分立器件包括在其外表面上具有第一电连接焊盘的第一柔性多层集成电路（IC）封装。 第二分立器件包括在其外表面上具有第二电连接焊盘的第二柔性多层集成电路（IC）封装。 离散的柔性互连件附接到第一分立器件的第一电连接焊盘并将其电连接到第二分立器件的第二电连接焊盘。

公开(公告)号：US08822276B2

公开(公告)日：2014-09-02

申请号：US13493700

申请日：2012-06-11

申请人： Leif Bergstedt

发明人： Leif Bergstedt

IPC分类号： H01L21/00 ,  H01L23/66 ,  H01L23/482 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L23/4822 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/86 ,  H01L2223/6605 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73269 ,  H01L2224/92248 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/15798 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a method of bonding a chip to an external electric circuit. The conductors of the external electric circuit for connection to the chip are formed with physical extensions and the chip is directly bonded to these extensions. The invention also relates to an electric device comprising at least one chip and an external electric circuit. The chip is directly bonded to physical extensions of conductors of the external electric circuit.

摘要翻译： 本发明涉及将芯片接合到外部电路的方法。 用于连接到芯片的外部电路的导体形成物理扩展，并且芯片直接结合到这些扩展。 本发明还涉及包括至少一个芯片和外部电路的电气设备。 芯片直接连接到外部电路的导线的物理延伸部分。

公开(公告)号：US20120241959A1

公开(公告)日：2012-09-27

申请号：US13493700

申请日：2012-06-11

申请人： Leif Bergstedt

发明人： Leif Bergstedt

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H01L23/4822 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/86 ,  H01L2223/6605 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73269 ,  H01L2224/92248 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/15798 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a method of bonding a chip to an external electric circuit. The conductors of the external electric circuit for connection to the chip are formed with physical extensions and the chip is directly bonded to these extensions. The invention also relates to an electric device comprising at least one chip and an external electric circuit. The chip is directly bonded to physical extensions of conductors of the external electric circuit.

摘要翻译： 本发明涉及将芯片接合到外部电路的方法。 用于连接到芯片的外部电路的导体形成物理扩展，并且芯片直接结合到这些扩展。 本发明还涉及一种包括至少一个芯片和外部电路的电气设备。 芯片直接连接到外部电路的导线的物理延伸部分。

公开(公告)号：US20170186727A1

公开(公告)日：2017-06-29

申请号：US15457852

申请日：2017-03-13

申请人： MC10, Inc.

发明人： Mitul Dalal ,  Sanjay Gupta

IPC分类号： H01L25/065 ,  H01L23/66 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L25/0655 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L24/92 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48499 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/85005 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/86005 ,  H01L2224/86801 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/0298 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

公开(公告)号：US20160365295A1

公开(公告)日：2016-12-15

申请号：US15149207

申请日：2016-05-09

申请人： Infineon Technologies AG

发明人： Juergen HOEGERL ,  Edward FUERGUT

IPC分类号： H01L23/31 ,  H01L23/04 ,  H01L23/10 ,  H01L21/56 ,  H01L23/492

CPC分类号： H01L23/31 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/04 ,  H01L23/10 ,  H01L23/142 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/492 ,  H01L23/4924 ,  H01L23/4928 ,  H01L23/49562 ,  H01L23/49877 ,  H01L23/5386 ,  H01L23/544 ,  H01L24/06 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/50 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/86 ,  H01L24/89 ,  H01L24/92 ,  H01L24/97 ,  H01L29/7393 ,  H01L29/868 ,  H01L2223/54486 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/73201 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73219 ,  H01L2224/73251 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/92142 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2224/92148 ,  H01L2224/92242 ,  H01L2224/92244 ,  H01L2224/92248 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/1016 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2224/32 ,  H01L2224/69 ,  H01L2224/89 ,  H01L2224/82 ,  H01L2224/86 ,  H01L2224/45099

摘要： A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power semiconductor devices arranged on the surface of the electrically conductive plate, wherein a first controlled terminal of each power semiconductor device of the plurality of power semiconductor devices may be electrically coupled to the electrically conductive plate, a plurality of electrically conductive blocks, wherein each electrically conductive block may be electrically coupled with a respective second controlled terminal of each power semiconductor device of the plurality of power semiconductor devices; and encapsulation material encapsulating the plurality of power semiconductor devices, wherein at least one edge region of the surface of the electrically conductive plate may be free from the encapsulation material.

摘要翻译： 提供了半导体布置。 半导体布置可以包括具有表面的导电板，布置在导电板的表面上的多个功率半导体器件，其中多个功率半导体器件中的每个功率半导体器件的第一受控端可以电耦合 导电板，多个导电块，其中每个导电块可以与多个功率半导体器件中的每个功率半导体器件的相应的第二受控端电耦合; 以及封装所述多个功率半导体器件的封装材料，其中所述导电板的表面的至少一个边缘区域可以不含所述封装材料。

公开(公告)号：US09379049B2

公开(公告)日：2016-06-28

申请号：US14409135

申请日：2013-05-27

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Hiroki Ikeuchi

IPC分类号： H01L23/495 ,  H01L23/433 ,  H01L23/64 ,  H02M7/00 ,  H01L23/373 ,  H01L25/07 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L23/49568 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32245 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40095 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/83851 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2224/8482 ,  H01L2224/8485 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01004 ,  H01L2924/00014

摘要： The semiconductor apparatus includes: the first lead frame; the second lead frame; the second insulation resin which is disposed between the first lead frame and the second lead frame; the sealing resin which seals the semiconductor elements, the first lead frame and the second lead frame; the electric wiring part which electrically connects the semiconductor elements and the first lead frame; and the interlayer connecting part which electrically connects the first lead frame and the second lead frame.

摘要翻译： 该半导体装置包括：第一引线框; 第二引线框架; 所述第二绝缘树脂设置在所述第一引线框架和所述第二引线框架之间; 密封半导体元件的密封树脂，第一引线框架和第二引线框架; 将所述半导体元件和所述第一引线框架电连接的所述电线路部分; 以及电连接第一引线框和第二引线框的层间连接部。

公开(公告)号：US20150194372A1

公开(公告)日：2015-07-09

申请号：US14409135

申请日：2013-05-27

申请人： Hiroki Ikeuchi

发明人： Hiroki Ikeuchi

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32245 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40095 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/83851 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2224/8482 ,  H01L2224/8485 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01004 ,  H01L2924/00014

摘要： The semiconductor apparatus includes: the first lead frame; the second lead frame; the second insulation resin which is disposed between the first lead frame and the second lead frame; the sealing resin which seals the semiconductor elements, the first lead frame and the second lead frame; the electric wiring part which electrically connects the semiconductor elements and the first lead frame; and the interlayer connecting part which electrically connects the first lead frame and the second lead frame.

摘要翻译： 该半导体装置包括：第一引线框; 第二引线框架; 所述第二绝缘树脂设置在所述第一引线框架和所述第二引线框架之间; 密封半导体元件的密封树脂，第一引线框架和第二引线框架; 将所述半导体元件和所述第一引线框架电连接的所述电线路部分; 以及电连接第一引线框和第二引线框的层间连接部。