公开(公告)号：US09502387B2

公开(公告)日：2016-11-22

申请号：US14990547

申请日：2016-01-07

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H05K1/11 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H05K1/02 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0271 ,  H05K1/11 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10613 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

公开(公告)号：US20160118369A1

公开(公告)日：2016-04-28

申请号：US14990547

申请日：2016-01-07

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0271 ,  H05K1/11 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10613 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

公开(公告)号：US09237647B2

公开(公告)日：2016-01-12

申请号：US14025414

申请日：2013-09-12

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H05K1/11 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0271 ,  H05K1/11 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10613 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

Abstract translation: 本文公开了一种装置，其包括第一封装，第一封装具有设置在其上的多个连接器的第一侧和通过连接器安装在第一封装上的第二封装。 模制化合物设置在第一包装的第一侧上，并且在第一包装和第二包装之间。 多个应力消除结构（SRS）设置在模制化合物中，多个SRS在模制化合物中包括不含金属的空腔，并且与多个连接器中的每一个间隔开。

公开(公告)号：US10008480B2

公开(公告)日：2018-06-26

申请号：US15722758

申请日：2017-10-02

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H05K1/11 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H05K1/02 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0271 ,  H05K1/11 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10613 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

公开(公告)号：US20180026014A1

公开(公告)日：2018-01-25

申请号：US15722758

申请日：2017-10-02

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L25/065 ,  H01L23/00 ,  H05K1/11 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H05K1/02

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0271 ,  H05K1/11 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10613 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

公开(公告)号：US09668347B2

公开(公告)日：2017-05-30

申请号：US14484537

申请日：2014-09-12

Applicant: DAI-ICHI SEIKO CO., LTD.

Inventor： Takayoshi Endo ,  Kenya Ando

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/70 ,  H01R12/72 ,  H01R43/02 ,  H01R43/16 ,  H01R4/02 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01R4/02 ,  H01R12/707 ,  H01R12/724 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/303 ,  H05K2201/10439 ,  H05K2201/10613 ,  Y10T29/49149 ,  Y10T29/49204

Abstract: The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.

公开(公告)号：US09060422B2

公开(公告)日：2015-06-16

申请号：US14076728

申请日：2013-11-11

Applicant: Yu-Syuan Chen

Inventor： Yu-Syuan Chen

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0213 ,  H01R4/34 ,  H01R9/24 ,  H05K2201/10613

Abstract: A wiring seat includes an insulative base and a connecting member. The insulative base has a fixing hole and an engagement hole or a through hole beside the fixing hole. The connecting member has a conductive body. The conductive body is bendingly extended with a positioning sheet engaging with the engagement hole or a terminal pin passing the through hole. The conductive body has a passing hole corresponding to the fixing hole.

Abstract translation: 配线座包括绝缘基座和连接构件。 绝缘基座具有固定孔和固定孔旁边的接合孔或通孔。 连接构件具有导电体。 导电体通过与接合孔接合的定位片或通过通孔的端子销弯曲地延伸。 导电体具有与固定孔对应的通孔。

公开(公告)号：US09780076B2

公开(公告)日：2017-10-03

申请号：US15356268

申请日：2016-11-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H05K1/11 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H05K1/02 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0271 ,  H05K1/11 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10613 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

公开(公告)号：US20170069605A1

公开(公告)日：2017-03-09

申请号：US15356268

申请日：2016-11-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0271 ,  H05K1/11 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10613 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

Abstract translation: 本文公开了一种装置，其包括第一封装，第一封装具有设置在其上的多个连接器的第一侧和通过连接器安装在第一封装上的第二封装。 模制化合物设置在第一包装的第一侧上，并且在第一包装和第二包装之间。 多个应力消除结构（SRS）设置在模制化合物中，多个SRS在模制化合物中包括不含金属的空腔，并且与多个连接器中的每一个间隔开。

公开(公告)号：US20150129294A1

公开(公告)日：2015-05-14

申请号：US14076728

申请日：2013-11-11

Applicant: YU-SYUAN CHEN

Inventor： YU-SYUAN CHEN

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H01R4/34 ,  H01R9/24 ,  H05K2201/10613

Abstract: A wiring seat includes an insulative base and a connecting member. The insulative base has a fixing hole and an engagement hole or a through hole beside the fixing hole. The connecting member has a conductive body. The conductive body is bendingly extended with a positioning sheet engaging with the engagement hole or a terminal pin passing the through hole. The conductive body has a passing hole corresponding to the fixing hole.

Abstract translation: 配线座包括绝缘基座和连接构件。 绝缘基座具有固定孔和固定孔旁边的接合孔或通孔。 连接构件具有导电体。 导电体通过与接合孔接合的定位片或通过通孔的端子销弯曲地延伸。 导电体具有与固定孔对应的通孔。