摘要:
Additives for textile hot melt adhesives based on copolyamides comprising, based on the total weight of copolyamide:A. 0.05 - 2 percent by weight of at least one acid amide of the general formula ##STR1## wherein R represents a saturated or unsaturated aliphatic hydrocarbon group of 12-20 carbon atoms, R.sub.1 represents an alkyl group of 1 to 3 carbon atoms, andn represents an integer of between 3 and 6; andB. 0.05 - 2 percent by weight of a mixture of differently condensed aminoalkyl phenols of the general formula ##STR2## wherein N' CAN ASSUME THE VALUE OF 0.5 - 2,m can assume the value of 2 - 6, andR' represent an aliphatic hydrocarbon group of 8-10 carbon atoms which is in the ortho- or para-position with respect to the OH-group.
摘要:
A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): in which R1 represents H or -Z1-NH2 and Z1 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms and R2 represents H or -Z2-NH2 and Z2 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms, it being possible for R1 and R2 to be identical or different. The tie resin may also be a copolymer having polyamide blocks and polyether blocks, the polyamide blocks resulting from condensation of at least one diacid and at least one diamine of formula (1). The invention also relates to a structure comprising a fluoropolymer layer, the tie layer and a substrate layer, respectively, as well as to a structure comprising a tie layer, respectively. This structure may be placed between two substrate layers and may be in the form of a sheet, film, profile or tube. It is particularly useful in the form of a tube for transporting gasoline between the tank and the injection device in motor-vehicle engines.
摘要:
A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.
摘要:
Block co-polymers including a hydrophilic block and a hydrophobic poly(amino acid) block which further includes dihydroxyphenyl moieties are provided, as well as methods of making and using the same. Such block copolymers may be used to prepare biocompatible adhesives which display good adhesives properties in aqueous environments, including in in vivo applications.
摘要:
A composition and method for repairing damaged connective tissue is provided. The composition comprises pseudo-poly(amino acids) and/or classic poly(amino acids) that exhibit adhesiveness for connective tissues. The composition is formed into an adhesive tissue repair implant and pressed against the damaged tissue to adhere the adhesive composition to the tissue.
摘要:
Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, and the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A farmed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a′ distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b′ distributed in the dispersed domain b.
摘要:
Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A formed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a′ distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b′ distributed in the dispersed domain b.
摘要:
Aqueous dispersions of polyamide resins having improved stability with respect to gelation and phase separation are provided, along with preparative methods therefor. The improved stability of the provided aqueous dispersions is achieved by the addition to such dispersion of a chemical moiety, such as a water soluble, amphoteric amino acid, anionic and cationic salts of amino acid, or mixtures thereof, in aqueous solutions. In a preferred embodiment, a dispersion-stabilizing amount of glycine is added with the inversion water used to invert an emulsion of water in polyamide resin. The resulting emulsion of resin in water is then cooled below the resin's melting point, causing the emulsified droplets of the polyamide resin to solidify as finely divided particles which are dispersed uniformly through the aqueous phase. The stable, aqueous dispersions of this invention are useful in coatings, inks, and as coatings for hot melt adhesive applications.