公开(公告)号：US20230088061A1

公开(公告)日：2023-03-23

申请号：US18071318

申请日：2022-11-29

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Dong Hyeon Park ,  Min Ho Kim ,  Dong Su Ryu ,  Seok Ho Na ,  Choong Hoe Kim ,  Yun Seok Song ,  Woo Kyung Ju ,  Dong Joo Park

IPC分类号： H01L23/00 ,  B23K1/005 ,  B23K26/067 ,  B23K26/06

摘要： In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.

公开(公告)号：US20230069985A1

公开(公告)日：2023-03-09

申请号：US17799268

申请日：2021-02-05

申请人： EO TECHNICS CO., LTD.

发明人： Kyu Dong SUNG ,  Jeen HUR ,  Eun Kyong MOON ,  Hans Juergen KAHLERT

IPC分类号： B23K26/067 ,  H01L21/02

摘要： Provided are a variable pulse width flat-top laser device and an operation method therefor. A variable pulse width flat-top laser device includes a light source unit including first and second laser light sources driven at different times to respectively emit pulse-type first and second laser beams, a beam shaping unit configured to shape the first and second laser beams emitted from the light source unit into flat-top laser beams, a combination/split unit located between the light source unit and the beam shaping unit, and including a first beam combination/split unit configured to combine optical paths of the first and second laser beams and split a combined optical path into at least two optical paths so that the split at least two optical paths are directed to different regions of an incident surface of the beam shaping unit, and an imaging optical system configured to time-sequentially overlay the flat-top laser beams shaped by the beam shaping unit on a target object to form an image.

公开(公告)号：US20230068211A1

公开(公告)日：2023-03-02

申请号：US17830349

申请日：2022-06-02

申请人： SKIILEUX ELECTRICITY INC.

发明人： SHENG-HSIANG YU ,  SHANG-WEI TSAI ,  TE-FU CHANG ,  CHENG-CHIEH CHANG

IPC分类号： B32B43/00 ,  B23K26/067 ,  B23K26/53

摘要： A device for transferring electronic component, comprising: an energy source used to project an energy beam; a first frame used to carry a carrier loaded with electronic component; a second frame used to carry a substrate for receiving the aforesaid electronic component; a beam splitting element arranged between the first frame and the energy source; and a focusing device arranged between the first frame and the beam splitting element. The present invention also relates to a method of transferring electronic component. The device for transferring electronic component and the method for transferring electronic component of the present invention can be applied in the manufacturing process of display.

公开(公告)号：US20230054345A1

公开(公告)日：2023-02-23

申请号：US17817389

申请日：2022-08-04

申请人： DISCO CORPORATION

发明人： Koji TOYAMA ,  Nobuyuki KIMURA ,  Koichi KATAYAMA ,  Keiji NOMARU

IPC分类号： B23K26/067 ,  B23K26/0622 ,  B23K26/06

摘要： A pulse duration measuring apparatus includes a polarizing beam splitter for splitting a pulsed laser beam into a first laser beam and a second laser beam, a first mirror for reflecting the first laser beam traveling toward the polarizing beam splitter, a second mirror for reflecting the second laser beam traveling toward the polarizing beam splitter, a first quarter wavelength plate disposed between the polarizing beam splitter and the first mirror, a second quarter wavelength plate disposed between the polarizing beam splitter and the second mirror, an optical path length changing unit for moving the first mirror or the second mirror to change the length of the respective optical paths, a nonlinear crystal body for allowing a combined laser beam to pass therethrough, and a photodetector for measuring an optical intensity of the combined laser beam that has passed through the nonlinear crystal body.

公开(公告)号：US20230047722A1

公开(公告)日：2023-02-16

申请号：US17580708

申请日：2022-01-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： SANGMIN LEE ,  SEULGI LEE ,  SUNGWOOK JUNG ,  HYUKJUN KWON ,  HYANGROK LEE

IPC分类号： G02B27/09 ,  G02B27/28 ,  G02B27/10 ,  G02B27/14 ,  G02B3/00 ,  B23K26/00 ,  B23K26/067 ,  B23K26/06

摘要： A method of operating an apparatus for laser annealing, includes reducing temporal or spatial coherency of a plurality of laser beams by beam superimposing; and reducing an electric field inner product magnitude of beams having the reduced temporal or spatial coherency by a fly eye lens array to reduce coherency, and/or by modifying a polarization state between the beams by beam superimposing.

公开(公告)号：US20230036386A1

公开(公告)日：2023-02-02

申请号：US17872375

申请日：2022-07-25

申请人： CORNING INCORPORATED

发明人： Lauren Leigh Taylor ,  Craig John Mancusi Ungaro

IPC分类号： B23K26/06 ,  B23K26/066 ,  B23K26/067 ,  B23K26/55 ,  B23K26/073

摘要： A method of processing a transparent workpiece that includes directing a laser beam combination comprising a first beam and a second beam into the transparent workpiece simultaneously, the first beam passing through an impingement surface of the transparent workpiece at a first impingement location and the second beam passing through the impingement surface at a second impingement location. The first beam forms a first laser beam focal line in the transparent workpiece and generates a first induced absorption to produce a first defect segment within the transparent workpiece, the first defect segment having a first chamfer angle and the second beam forms a second laser beam focal line in the transparent workpiece and generates a second induced absorption to produce a second defect segment within the transparent workpiece, the second defect segment having a second chamfer angle, the second chamfer angle differing from the first chamfer angle.

公开(公告)号：US11532476B2

公开(公告)日：2022-12-20

申请号：US17235178

申请日：2021-04-20

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Akifumi Sangu ,  Gyoowan Han ,  Jekil Ryu ,  Kyungjae Lee

IPC分类号： H01L21/02 ,  G02B27/28 ,  G01J1/42 ,  G02B27/10 ,  B23K26/064 ,  H01L27/12 ,  B23K26/067 ,  H01L21/67 ,  B23K26/03 ,  B23K26/08 ,  B23K26/70 ,  B23K26/352 ,  B23K26/06 ,  B23K26/354 ,  B23K26/00 ,  B23K101/40 ,  B23K103/00

摘要： A laser crystallizing apparatus includes a first light source unit configured to emit a first input light having a linearly polarized laser beam shape. A second light source unit is configured to emit a second input light having a linearly polarized laser beam shape. A polarization optical system is configured to rotate the first input light and/or the second input light at a predetermined rotation angle. An optical system is configured to convert the first input light and the second input light, which pass through the polarization optical system, into an output light. A target substrate is seated on a stage and output light is directed onto the target substrate. A monitoring unit is configured to receive the first input light or the second input light from the polarization optical system and measure a laser beam quality thereof.

公开(公告)号：US20220379402A1

公开(公告)日：2022-12-01

申请号：US17642065

申请日：2020-09-17

申请人： BYSTRONIC LASER AG

发明人： Colin WORATZ

IPC分类号： B23K26/067 ,  B23K26/38

摘要： A machining apparatus for laser machining a work-piece, in particular for laser cutting, is provided, having a device for generating a machining laser beam, for rough machining the work-piece, in particular for producing cuts with cut edges in the workpiece, and having a device for splitting the machining laser beam into at least two energy intensity ranges, wherein a first energy intensity range for rough machining of the workpiece has a greater time-integrated radiation energy than at least one second energy intensity range for at least partially fine machining a cut edge. Further provided is a method a for laser machining a workpiece.

公开(公告)号：US20220314364A1

公开(公告)日：2022-10-06

申请号：US17595764

申请日：2021-04-06

申请人： PHILOPTICS CO., LTD.

发明人： Sangwon SHIM ,  Doyeoun HWANG ,  Yu Jin NAM ,  Sang-gil RYU ,  Sungju YU ,  Min Hwan CHOI

IPC分类号： B23K26/082 ,  B23K26/06 ,  B23K26/046 ,  B23K26/073 ,  B23K26/067

摘要： A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.

公开(公告)号：US20220297236A1

公开(公告)日：2022-09-22

申请号：US17838243

申请日：2022-06-12

申请人： Samsung Display Co., Ltd.

发明人： Taekil OH ,  Gyoowan HAN ,  Wonyong KIM ,  Seungho Myoung ,  Jaeseok Park ,  Alexander VORONOV ,  Jinhong JEUN

IPC分类号： B23K26/362 ,  C22C38/08 ,  B23K26/067 ,  B23K26/082 ,  B23K26/06 ,  B23K26/382

摘要： An apparatus for manufacturing a deposition mask including a stage on which a mask substrate is mounted, a light source configured to irradiate a laser beam, a beam splitter configured to split the irradiated laser beam into a plurality of laser beams, a scanner configured to simultaneously scan the plurality of laser beams onto the mask substrate, and a tuner configured to finely change irradiation states of the plurality of laser beams to correspond to shapes of a plurality of pattern holes, while the plurality of laser beams are scanned.