公开(公告)号：US11806817B2

公开(公告)日：2023-11-07

申请号：US17794283

申请日：2021-09-22

申请人： KOKI Company Limited

发明人： Kazuhiro Yukikata ,  Takefumi Arai ,  Yuri Misumi

IPC分类号： B23K35/363 ,  B23K35/36 ,  B23K35/02 ,  B23K35/26 ,  B23K35/362 ,  C22C13/00

CPC分类号： B23K35/3613 ,  B23K35/025 ,  B23K35/262 ,  B23K35/362 ,  C22C13/00

摘要： A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.

公开(公告)号：US08652269B2

公开(公告)日：2014-02-18

申请号：US13121734

申请日：2009-09-25

申请人： Tetsuro Nishimura ,  Mitsuhiro Kawahara ,  Masuml Asakawa ,  Toshimi Shimizu

发明人： Tetsuro Nishimura ,  Mitsuhiro Kawahara ,  Masuml Asakawa ,  Toshimi Shimizu

IPC分类号： B23K35/36 ,  B23K35/363

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3484 ,  H05K3/3489

摘要： Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.

摘要翻译： 本文公开了基于助焊剂的焊剂和焊膏。 助焊剂随着年龄，“皮肤表面”和“粗糙和破碎”而没有粘度变化，并且具有优异的可印刷性和可焊性。 助熔剂含有树脂，触变剂，活化剂，溶剂和吡喃葡萄糖胺型纳米管。 焊膏还含有焊料粉末。 优选地，焊料粉末不含铅。

公开(公告)号：US20120315497A1

公开(公告)日：2012-12-13

申请号：US13577716

申请日：2010-02-10

申请人： Andreas Becker ,  Thomas Born ,  Alfred Ottmann ,  Hans-Walter Swidersky ,  Placido Garcia-Juan

发明人： Andreas Becker ,  Thomas Born ,  Alfred Ottmann ,  Hans-Walter Swidersky ,  Placido Garcia-Juan

IPC分类号： B23K35/363 ,  B32B15/04 ,  B23K1/20

CPC分类号： B23K35/3605 ,  B23K1/19 ,  B23K35/362 ,  B23K2103/10 ,  F28F21/08

摘要： Aluminum parts, e.g., heat exchangers, with improved resistance towards corrosion caused by contact with stationary water or aqueous compositions such as cooling water can be obtained by addition of Li compounds in specific amounts to the flux used for brazing the parts. LiF and especially Li fluoroaluminates are very suitable. The flux and the Li salt can be dispersed in water or an aqueous composition separately.

摘要翻译： 可以通过将特定量的Li化合物与用于钎焊零件的助焊剂相加来获得具有改善的耐受与静止水或含水组合物如冷却水接触的腐蚀的铝部件，例如热交换器。 LiF，特别是Li氟铝酸盐是非常合适的。 助熔剂和Li盐可以分散在水或水性组合物中。

公开(公告)号：US20120255992A1

公开(公告)日：2012-10-11

申请号：US13516840

申请日：2010-12-16

申请人： Alfred Ottmann

发明人： Alfred Ottmann

IPC分类号： B23K35/363 ,  B23K1/00

CPC分类号： B23K35/36 ,  B23K35/3605 ,  B23K35/365

摘要： Aqueous flux preparations with increased dynamic viscosity are provided. In the flux preparations, irreversibly dehydrated K2AlF5 (also denoted as orthorhombic K2AlF5 or phase II salt) provides for an increase of the dynamic viscosity if the aqueous flux preparations are aged, i.e., a contact between water comprised in the preparation and irreversibly dehydrated K2AlF5 is maintained for a certain time span, preferably for at least 12 minutes. The higher viscosity improves the brazing process, for example because less flux preparation drops off from the parts to be brazed.

摘要翻译： 提供了具有增加的动态粘度的水性助焊剂制剂。 在助焊剂制剂中，不可逆脱水的K2AlF5（也称为斜方晶K2AlF5或II相盐）提供如果水性助焊剂制剂老化的动态粘度增加，即制剂中包含的水与不可逆脱水的K2AlF5之间的接触是 保持一段时间，优选至少12分钟。 较高的粘度改善了钎焊过程，例如因为较少的助熔剂从待钎焊的部件脱落。

公开(公告)号：US20120248176A1

公开(公告)日：2012-10-04

申请号：US13078824

申请日：2011-04-01

申请人： DERRICK Matthew HERRON ,  NING-CHENG LEE ,  FENGYING ZHOU

发明人： DERRICK Matthew HERRON ,  NING-CHENG LEE ,  FENGYING ZHOU

IPC分类号： B23K1/20 ,  B23K35/24 ,  B23K35/363

CPC分类号： B23K35/025 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/30 ,  B23K35/32

摘要： A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal functions of a solder joint while being more impact resistant. Furthermore, the solder joint retains its capabilities over the service life of a high-end product such as a computer or a cell phone. The solder meets the requirements of the soldering industry both today and into the future, including but not limited to an ability to be printed or dispensed with standard methods and conformity to health and safety standards.

摘要翻译： 提供了可以在高端应用中使用的焊料，其产生更耐冲击的焊点。 焊点具有很强的互连，可以在更耐冲击的同时执行焊接接头的所有正常功能。 此外，焊接点在诸如计算机或蜂窝电话的高端产品的使用寿命中保持其能力。 该焊料符合当今和未来焊接行业的要求，包括但不限于印刷或分配标准方法和符合健康和安全标准的能力。

公开(公告)号：US20120217289A1

公开(公告)日：2012-08-30

申请号：US13034932

申请日：2011-02-25

申请人： Kang-Wook Lee ,  Jae-Woong Nah ,  Nathalie Normand ,  Valerie Oberson

发明人： Kang-Wook Lee ,  Jae-Woong Nah ,  Nathalie Normand ,  Valerie Oberson

IPC分类号： B23K35/363 ,  B23K1/20

CPC分类号： B23K1/0016 ,  B23K35/3601 ,  B23K35/362

摘要： The present invention is directed to flux compositions and uses thereof. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

摘要翻译： 本发明涉及助焊剂组合物及其用途。 一种组合物包含活化剂，中等粘度溶剂为聚合物，高粘度溶剂为包含第一单体和第二单体的共聚物。 另一组合物包含活化剂和包含含有第一单体和第二单体的共聚物的高粘度溶剂。 另一组合物包含6-12重量％的戊二酸，庚二酸，酒石酸或其混合物的活化剂和88-94重量％的中等粘度溶剂，其包含具有羟基端基的聚合物。 另一种组合物包含液态的活化剂，其包含聚（乙二醇） - 二酸，以及包含具有羟基端基的聚合物的中等粘度溶剂。 还提供了一种用于接合物体的焊接方法，包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分，并且连接物体。

公开(公告)号：US20110162871A1

公开(公告)日：2011-07-07

申请号：US13001820

申请日：2009-06-26

申请人： Rolf Diehm ,  Wolfgang Ludeck ,  Andrey Prihodovsky ,  Wolfgang Schmitt ,  Hubert Trageser ,  Andreas Fix ,  Matthias Hutter ,  Uwe Pape ,  Patrick Zerrer ,  Hartmut Meier ,  Bernd Müller ,  Ulrich Wittreich ,  Dirk Wormuth

发明人： Rolf Diehm ,  Wolfgang Ludeck ,  Andrey Prihodovsky ,  Wolfgang Schmitt ,  Hubert Trageser ,  Andreas Fix ,  Matthias Hutter ,  Uwe Pape ,  Patrick Zerrer ,  Hartmut Meier ,  Bernd Müller ,  Ulrich Wittreich ,  Dirk Wormuth

IPC分类号： H01B5/00 ,  B23K35/363 ,  B23K1/20

CPC分类号： B23K35/3618 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K2101/36 ,  H05K3/282 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/0224 ,  H05K2203/0425

摘要： Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.

摘要翻译： 提供诸如焊膏的焊料和用于焊接连接的接触表面，其中使用金属硬脂酸酯作为焊剂。 金属硬脂酸酯作为固体层施加在焊料颗粒上或作为接触表面，或作为粘合剂中的分散体或溶液存在。 有利地，这样的材料允许避免使用经典助焊剂。 特别地，可以提供非树脂焊料材料。 导致焊料材料的简化存储和加工性能，同时产生较好的焊接连接。 使用金属硬脂酸盐作为助熔剂的能力是实现的，如果使用的金属的第一氧化物由比第一氧化铬（优选低于钛的第一氧化钛）低的氧活性（ao）的纯金属形成， 如果金属硬脂酸酯以足够的量存在。

公开(公告)号：US07678203B2

公开(公告)日：2010-03-16

申请号：US11072842

申请日：2005-03-04

申请人： Matthew Jay James ,  Patrick J. Coyne

发明人： Matthew Jay James ,  Patrick J. Coyne

IPC分类号： B23K35/363

CPC分类号： B23K35/362

摘要： A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly formulated for limited pass welding applications which exhibit high impact strength, good slag detachability, low weld metal hydrogen and nitrogen absorption, and facilitates in the formation of smooth and consistent weld beads.

摘要翻译： 一种用于管焊或一侧焊接应用的焊剂，包括气体释放剂，高熔点化合物和低熔点化合物。 焊接焊剂特别适用于具有高冲击强度，良好的熔渣分离性能，低焊接金属氢气和氮气吸收性的有限焊接应用，并且有助于形成光滑且一致的焊缝。

公开(公告)号：US20080135133A1

公开(公告)日：2008-06-12

申请号：US11661322

申请日：2005-08-22

申请人： Takashi Hagiwara

发明人： Takashi Hagiwara

IPC分类号： B23K35/363

CPC分类号： B23K35/362 ,  H05K3/3489 ,  H05K2203/124

摘要： [Problems] Addition of an organic acid such as a dicarboxylic acid to a soldering flux in order to improve wettability causes a reaction with copper oxide to form a metallic soap of copper having a green color. Although this metallic soap of copper is not corrosive and does not decrease reliability, its external appearance is impossible to distinguish it from verdigris which is indicative of corrosion. There is need for a soldering flux which does not form a metallic soap of copper.[Means for Solving the Problems] Addition of a tetrazole or a tetrazole derivative to a soldering flux can prevent carboxyl groups from reacting exclusively with copper ions, thereby suppressing the formation of a metallic soap of copper having a green color. Among tetrazoles and tetrazole derivatives, 5-phenyl-1H-tetrazole and its derivatives which have hydrogen as a substituent in the 1-position and a phenyl, group which strongly attracts electron in the 5-position are effective at improving soldering since they result in an increased polarity in the solvent.

摘要翻译： [问题]为了提高润湿性，向助焊剂中添加二羧酸等有机酸进行与氧化铜的反应，形成具有绿色的铜的金属皂。 虽然这种铜金属皂不具有腐蚀性并且不会降低可靠性，但是其外观是不可能将其与指示腐蚀的白to石区分开来的。 需要不形成铜的金属皂的助焊剂。 解决问题的手段向助焊剂中添加四唑或四唑衍生物可以防止羧基仅与铜离子反应，从而抑制具有绿色的铜的金属皂的形成。 在四唑和四唑衍生物中，在1-位具有氢作为取代基的5-苯基-1H-四唑及其衍生物和在5位上强吸引电子的苯基是有效的，因为它们导致了 在溶剂中极性增加。

公开(公告)号：US20080073414A1

公开(公告)日：2008-03-27

申请号：US11860395

申请日：2007-09-24

申请人： Shun Saito ,  Katsumi Nakasato ,  Yukihiro Kato ,  Isao Nakata

发明人： Shun Saito ,  Katsumi Nakasato ,  Yukihiro Kato ,  Isao Nakata

IPC分类号： B23K31/02 ,  B23K1/00 ,  B23K35/363 ,  B23K1/08

CPC分类号： B23K1/008 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  H05K3/3484

摘要： Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.

摘要翻译： 提供焊剂助焊剂组合物，焊膏和使用其的焊接方法，其表现出优异的润湿性，提供高可靠性的焊点，并具有优良的储存稳定性。 助熔剂组合物含有至少一种具有至少一个选自羧酸化合物和乙烯基醚化合物反应得到的化合物（X）的封端羧基的化合物，通过羧酸酐反应获得的化合物（Y） 化合物和羟基乙烯基醚化合物，以及通过酸酐和多元醇反应获得的化合物（Z），然后用二乙烯基醚化合物进行加成聚合，并且助熔剂组合物不固化。