公开(公告)号：US20180099377A1

公开(公告)日：2018-04-12

申请号：US15730231

申请日：2017-10-11

申请人： DISCO CORPORATION

发明人： Kazuma Sekiya

IPC分类号： B24B53/02 ,  B24B53/12 ,  B24D7/16 ,  H01L21/02 ,  H01L21/67

摘要： A processing apparatus includes a chuck table that holds a workpiece by a holding face, a processing unit that processes the workpiece with a grinding whetstone or a polishing pad, a movement unit for moving the chuck table and the processing unit parallel to the holding face, a processing feeding unit for moving the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit to inspect a process mark of the workpiece during processing, a dressing unit to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit. When a process mark of a size exceeding a threshold value is detected on the process face of the workpiece, the control unit stops processing of the workpiece, and after the grinding whetstone or the polishing pad is dressed, restarts processing.

公开(公告)号：US09604340B2

公开(公告)日：2017-03-28

申请号：US14105232

申请日：2013-12-13

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Chang-Sheng Lin

IPC分类号： B24B37/32 ,  B24B53/017 ,  B24B53/02

CPC分类号： B24B53/017 ,  B24B37/10 ,  B24B37/32 ,  B24B53/02 ,  H01L21/30625 ,  H01L21/67253

摘要： A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.

公开(公告)号：US08678878B2

公开(公告)日：2014-03-25

申请号：US12850747

申请日：2010-08-05

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B1/00 ,  B24B53/02

CPC分类号： B24B49/186 ,  B24B53/017 ,  B24D3/28

摘要： Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles.

摘要翻译： 提供了用于评估和/或增加CMP垫修整器性能的方法和系统。 在一个方面，例如，在CMP抛光修整器中识别过度侵蚀性超研磨颗粒的方法可以包括将具有多个超研磨颗粒的CMP抛光垫修整器定位在指示剂基底上，使得多个超研磨颗粒的至少一部分 所述CMP抛光修整器与所述指示器基板接触，并且沿着第一方向移动所述CMP抛光垫修整器穿过所述指示器基板，使得所述多个超研磨颗粒的所述部分在所述基板上产生第一标记图案，其中所述第一标记图案标识 多个超研磨颗粒中的多个工作超研磨颗粒。

公开(公告)号：US08382558B2

公开(公告)日：2013-02-26

申请号：US12690408

申请日：2010-01-20

申请人： Katsuhide Watanabe ,  Ryuichi Kosuge ,  Soichi Isobe

发明人： Katsuhide Watanabe ,  Ryuichi Kosuge ,  Soichi Isobe

IPC分类号： B24B53/02 ,  B24B5/02

CPC分类号： B24B53/017

摘要： An apparatus dresses a polishing pad. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing provided in the dresser flange and configured to allow the dressing member to tilt with respect to the dresser drive shaft, and a spring mechanism configured to generate a force against a tilting motion of the dressing member.

摘要翻译： 一种装置装饰抛光垫。 该装置包括可旋转和可垂直移动的修整器驱动轴，连接到修整器驱动轴并构造成将修整构件固定到其上的修整器法兰，设置在修整器法兰中的球形轴承，并且构造成允许修整构件以 相对于修整器驱动轴，以及弹簧机构，其构造成产生抵抗修整构件的倾斜运动的力。

公开(公告)号：US20120196514A1

公开(公告)日：2012-08-02

申请号：US13363972

申请日：2012-02-01

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/02 ,  B24B1/00

CPC分类号： B24B53/007

摘要： The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein.

摘要翻译： 本发明公开了一种能够通过并入振动源来改善CMP处理的CMP装置和方法，所述振动源在基本上平行于CMP垫的工作表面的方向产生振动。 CMP装置包括CMP抛光垫修整器。 这种方法可以包括在基本上平行于CMP焊盘的工作表面的方向上振动CMP焊盘，CMP焊盘修整器或晶片的步骤，并且将CMP焊盘修整器与CMP焊盘的工作表面接合。 根据本文公开的若干方面，超磨料颗粒可以为CMP垫和修整器两者提供益处。

公开(公告)号：US20100112900A1

公开(公告)日：2010-05-06

申请号：US12265242

申请日：2008-11-05

申请人： Gul Bahar Basim ,  Serkan Kincal ,  Eugene C. Davis

发明人： Gul Bahar Basim ,  Serkan Kincal ,  Eugene C. Davis

IPC分类号： B24B49/00 ,  B24B7/20 ,  B24B49/10 ,  B24B49/16 ,  B24B53/02

CPC分类号： B24B53/017 ,  B24B49/10 ,  B24B49/16

摘要： A method of conditioning a CMP polishing pad to attain a desired thickness profile in a polished layer on a wafer is disclosed. The incoming thickness profile of the layer to be polished, the thickness profile of the polishing pad, a polish rate of layer as a function of pressure and the removal rate of polishing pad material by a conditioning block are used to compute a sweep pattern for the conditioning block which will produce a desired thickness profile on the polishing pad. The method may be applied to maintaining the desired profile on the polishing pad during the course of polishing multiple wafers. The pad profile may be adjusted to keep pressure between the pad and the wafer to a safe limit to reduce polishing defects.

摘要翻译： 公开了一种调节CMP抛光垫以在晶片上的抛光层中获得期望的厚度分布的方法。 被研磨层的入射厚度分布，抛光垫的厚度分布，作为压力的函数的层的抛光速率和由调节块的抛光垫材料的去除速率用于计算扫描图案 这将在抛光垫上产生所需的厚度分布。 该方法可以应用于在抛光多个晶片的过程中在抛光垫上保持期望的轮廓。 可以调节焊盘轮廓以将焊盘和晶片之间的压力保持在安全限度以减少抛光缺陷。

公开(公告)号：US20100075577A1

公开(公告)日：2010-03-25

申请号：US12631004

申请日：2009-12-04

申请人： Hiroshi Kojima ,  Masabumi Ito

发明人： Hiroshi Kojima ,  Masabumi Ito

IPC分类号： B24B7/24 ,  B24B53/02

CPC分类号： G03F1/24 ,  B24B37/042 ,  B24B49/16 ,  B82Y10/00 ,  B82Y40/00 ,  C03C19/00

摘要： An object of the present invention is to provide a polishing method for diminishing concave defects of a glass substrate used in a reflective mask for EUVL and the like. The invention relates to a method of polishing a glass substrate which comprises polishing a major surface of the glass substrate while feeding a polishing slurry between the glass substrate and a pad surface of a polishing pad, wherein the polishing load of the polishing pad is from 1 to 60 g/cm2. The pad surface of the polishing pact is preferably dressing-processed.

摘要翻译： 本发明的目的是提供一种用于减少用于EUVL等的反射掩模中的玻璃基板的凹陷缺陷的抛光方法。 本发明涉及一种抛光玻璃基板的方法，其中包括在玻璃基板和抛光垫的焊盘表面之间馈送抛光浆料的同时抛光玻璃基板的主表面，其中抛光垫的抛光载荷为1 至60g / cm 2。 抛光体的焊盘表面优选进行修整处理。

公开(公告)号：US20100056030A1

公开(公告)日：2010-03-04

申请号：US12549270

申请日：2009-08-27

申请人： Toshikazu TOMITA

发明人： Toshikazu TOMITA

IPC分类号： B24B53/02 ,  G01B7/30

CPC分类号： B24B55/00 ,  B24B37/04 ,  G01B7/30

摘要： To provide a shaft motion detection mechanism capable of detecting the displacement of a rotating body in a direction along a rotational axis and whether or not the rotating body is rotated, and a conditioner head capable of detecting the displacement of a polishing disk in a direction along a rotational axis and whether or not the polishing disk is rotated. A conditioner head 10 has a shaft 18 rotating around a rotational axis C, a cylindrical shaft 19 attached to the shaft 18 so as to be displaced along the rotational axis C, a frame 16 rotatably supporting the shaft 19, a plurality of projections 18c formed on the surface of the shaft 18 so as to be aligned in a circumferential direction, a projection 18d formed throughout the entire circumference on the surface of the shaft 18, and proximity sensors 30a to 30c arranged around the rotational axis C so as to face the shaft 18. The angle formed around the rotational axis C by the proximity sensors 30a and 30c is larger than the angle formed around the rotational axis C by the circumferential width of each projection 18c and the angle formed around the rotational axis C by the space between the projections 18c.

摘要翻译： 提供一种能够检测沿着旋转轴线的方向上的旋转体的位移以及旋转体是否旋转的轴运动检测机构，以及能够检测研磨盘在沿着方向的方向上的位移的调节头 旋转轴线以及抛光盘是否旋转。 调节头10具有围绕旋转轴线C旋转的轴18，安装在轴18上以便沿着旋转轴线C移位的圆筒轴19，可旋转地支撑轴19的框架16，形成有多个突起18c 在轴18的表面上沿圆周方向对齐，在轴18的表面上整个圆周上形成的突起18d以及围绕旋转轴线C布置的接近传感器30a至30c以面对 通过接近传感器30a和30c围绕旋转轴线C形成的角度大于围绕旋转轴线C形成的角度，即每个突起18c的周向宽度和围绕旋转轴线C形成的角度之间的空间 突起18c。

公开(公告)号：US20090275268A1

公开(公告)日：2009-11-05

申请号：US12503960

申请日：2009-07-16

申请人： Mizuho Ishida ,  Kara Yoshida

发明人： Mizuho Ishida ,  Kara Yoshida

IPC分类号： B24B7/24 ,  B24B37/04 ,  B24B53/02

CPC分类号： G11B5/8404 ,  B24B37/042 ,  B24B37/24 ,  B24D3/32 ,  C03C19/00

摘要： In the production of a glass substrate for magnetic disk, the present invention provides a method for producing a glass substrate for magnetic disk including a step of polishing a main surface of a circular glass substrate using a polishing pad made of a foamed resin while feeding a polishing liquid containing an abrasive, in which a polishing pad made of a foamed resin having an international rubber hardness of 45 IRHD or less, the hardness being measured at a dry state before contact with a slurry by the M method defined in JIS K6253, is used as a starting polishing pad and polishing is started after a polishing surface of the starting polishing pad is subjected to a dressing treatment to adjust the pad so that an open pore area ratio is 8% or more and an average circle equivalent diameter of open pores is 10 μm or more, in order to suppress an increase in roll-off in the polishing step of the main surface of the circular glass plate.

摘要翻译： 在制造磁盘用玻璃基板时，本发明提供一种磁盘用玻璃基板的制造方法，其特征在于，包括使用由发泡树脂构成的研磨垫对圆形玻璃基板的主面进行研磨的工序， 含有研磨剂的研磨液，其中由国际橡胶硬度为45IRHD以下的发泡树脂制成的抛光垫，通过JIS K6253中规定的M法与浆料接触之前在干燥状态下测量的硬度为 用作起始抛光垫，并且在对起始抛光垫的抛光表面进行修整处理以调整垫以使开孔面积比为8％以上，开孔的平均圆当量直径开始研磨 为了抑制圆形玻璃板的主面的研磨工序中的滚降的增加，为10μm以上。

公开(公告)号：US20090264054A1

公开(公告)日：2009-10-22

申请号：US12495893

申请日：2009-07-01

申请人： Tetsuya SHIRASU ,  Katsuhiko AOYAMA ,  Fumihiko AKABOSHI ,  Kunichirou GOTOH

发明人： Tetsuya SHIRASU ,  Katsuhiko AOYAMA ,  Fumihiko AKABOSHI ,  Kunichirou GOTOH

IPC分类号： B24B53/02 ,  B24B29/00

CPC分类号： B24B37/30

摘要： A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with the wafer is non-absorbable to a fluid. The tissue of the pedestal pad is dense and smooth, and does not have any cavity, such as fine holes, which holds the fluid.

摘要翻译： 用于临时放置和保持预抛光或后抛光的晶片（工件）的基座（工件支撑台）的顶部上布置有基座垫（工件支撑台垫）。 该基座垫由树脂形成，并且与晶片接触的基座垫的至少一个表面不能吸收流体。 基座垫的组织是致密和平滑的，并且不具有保持流体的任何空腔，例如细孔。