公开(公告)号：US12202966B2

公开(公告)日：2025-01-21

申请号：US17414822

申请日：2019-12-17

Applicant: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN

Inventor： Gael Pataut ,  David Doisneau ,  Laura Luiz ,  Julien Letessier

IPC: B60C1/00 ,  C08J5/24 ,  C08K5/14 ,  C08K5/18 ,  C08K5/23 ,  C08K5/3477 ,  C08K7/02 ,  C08L63/04 ,  C08L63/10 ,  C08L67/06 ,  C08L67/07

Abstract: A resin composition is based on a resin selected from the group consisting of vinyl ester resins and unsaturated polyester resins, a crosslinking initiator and a crosslinking agent of general formula (I) in which i is an integer between 2 and 4, X is an i-valent group comprising at least one ring of 6 atoms selected from carbon and nitrogen and comprising at least 2 heteroatoms selected from nitrogen and oxygen, and R is an acrylate group, methacrylate group, vinyl group, alkenyl group bearing an unsaturated carbon at the chain end, or alkynyl group bearing an unsaturated carbon at the chain end.

公开(公告)号：US20240327567A1

公开(公告)日：2024-10-03

申请号：US18129605

申请日：2023-03-31

Applicant: EVONIK OPERATIONS GMBH

Inventor： Shafiq Fazel ,  Emmanouil Roumpelakis ,  Gauri Sankar Lal ,  John Hartmann ,  Douglas M La Comare

IPC: C08G59/40 ,  C08G8/10 ,  C08G59/42 ,  C08G59/62 ,  C08L63/04

CPC classification number: C08G59/4021 ,  C08G8/10 ,  C08G59/4261 ,  C08G59/621 ,  C08L63/04

Abstract: The present disclosure provides for latent curing accelerators as well as compositions containing such a latent curing accelerator with a substance to be cured (e.g., an epoxy resin). The latent curing accelerators comprise a urea compound and an encapsulant system having a polyphenol resin and/or at least one additional excipient. Methods of making and use are further provided.

公开(公告)号：US12077651B2

公开(公告)日：2024-09-03

申请号：US18273600

申请日：2022-11-24

Applicant: SAES GETTERS S.P.A.

Inventor： Stefano Zilio ,  Anna Nuzzo ,  Giovanni Zafarana ,  Giorgio Macchi ,  Paolo Vacca

IPC: C08L63/00 ,  C08K3/34 ,  C08K11/00 ,  C08L63/02 ,  C08L63/04

CPC classification number: C08K3/34 ,  C08K11/00 ,  C08L63/00 ,  C08K2201/005 ,  C08L2203/20

Abstract: Getter composition to be used for controlling the amount of moisture and organic gases in sealed electronic or optoelectronic devices, said composition comprising a blend of first getter and second getter powders in a weight ratio comprised between 0.1 and 5.0, wherein the first getter is polyphenylene oxide (PPO) or Poly(2,6-diphenyl-p-phenylene oxide) (PPPO) and the second getter is a Faujasite (FAU) zeolite or a mixture of a Faujasite (FAU) zeolite and a Linde Type A (LTA) zeolite with a ratio comprised between 0.1 and 5.0. The invention also relates to a dispensable paste comprising a resin and the getter composition.

公开(公告)号：US20240191072A1

公开(公告)日：2024-06-13

申请号：US18550410

申请日：2022-03-11

Applicant: TAIYO HOLDING CO., LTD.

Inventor： Daisuke SHIBATA ,  Chiho UETA ,  Fumitaka KATO ,  Sawako SHIMADA ,  Shotaro TANE

IPC: C08L63/04 ,  C08J7/04 ,  C08K3/36 ,  C08K5/00 ,  C09D7/61 ,  C09D7/63 ,  C09D7/65 ,  C09D163/04

CPC classification number: C08L63/04 ,  C08J7/0427 ,  C08K3/36 ,  C08K5/0025 ,  C09D7/61 ,  C09D7/63 ,  C09D7/65 ,  C09D163/04 ,  C08J2363/04 ,  C08K2201/011

Abstract: Provided are a curable resin composition, a dry film, a cured product, and an electronic component including the same that have excellent resolution, higher insulation reliability, and excellent embeddability in a circuit. A curable resin composition includes: (A) a carboxyl group-containing resin; (B) a photopolymerization initiator; (C) a thermosetting resin; and (D) silica, wherein a blending amount of (D) the silica is 10 to 60% by mass relative to a total solid content of the curable resin composition, (D) the silica includes (D-1) nanosilica, (D-1) the nanosilica has an average secondary particle size of 200 nm or less, and a degree of association of (D-1) the nanosilica is 2.3 or less.

公开(公告)号：US20240182705A1

公开(公告)日：2024-06-06

申请号：US18283650

申请日：2022-01-28

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Makoto MATSUO ,  Hidetoshi SEKI

IPC: C08L63/04 ,  B29B9/06 ,  B29C45/02 ,  B29C45/14 ,  B29C48/00 ,  B29C48/05 ,  B29K63/00 ,  B29K105/16 ,  B29L31/00 ,  B29L31/34

CPC classification number: C08L63/04 ,  B29B9/06 ,  B29C45/02 ,  B29C45/14819 ,  B29C48/0022 ,  B29C48/022 ,  B29C48/05 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2995/0094 ,  B29L2031/3425 ,  B29L2031/7498 ,  C08L2203/30

Abstract: A method for producing an encapsulated structure, the method including:



a step of supplying granules or powder (1) formed from an epoxy resin composition to an extruder equipped with a screw (42) and a die (5) provided at the tip of the screw (42), and heating and melting the granules or powder (1) formed from the epoxy resin composition;
a step of extruding the molten epoxy resin composition through the die (5) having a predetermined opening shape by rotation of the screw (42);
a step of cutting the extruded epoxy resin composition (6) into a predetermined length to obtain a tablet formed from the epoxy resin composition, where the tablet has dimensions with a diameter of equal to or more than 40 mm and equal to or less than 100 mm and a length of equal to or more than 50 mm and equal to or less than 300 mm;
a step of transferring the tablet to a transfer molding machine having a molding mold (30) in which an object to be encapsulated is disposed; and
a step of obtaining an encapsulated structure by encapsulating the object to be encapsulated (11, 12) in the molding mold with the epoxy resin composition by a transfer molding method of using the transfer molding machine,
in which the epoxy resin composition includes:
an epoxy resin,
a curing agent,
an inorganic filler,
a curing accelerator, and
a wax having a melting point of equal to or higher than 30° C. and equal to or lower than 90° C.

公开(公告)号：US20230391943A1

公开(公告)日：2023-12-07

申请号：US18033094

申请日：2021-08-25

Applicant: HITACHI, LTD.

Inventor： Takeshi KONDO ,  Takahito MURAKI

IPC: C08G59/68 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08L63/04 ,  C08J5/04

CPC classification number: C08G59/685 ,  C08G59/245 ,  C08G59/42 ,  C08G59/5073 ,  C08L63/04 ,  C08J5/042 ,  C08J5/043 ,  C08J5/046

Abstract: Provided are a resin composition, a resin cured product, and a fiber reinforced resin capable of shortening a stress relaxation time. In order to solve this problem, the resin composition contains an epoxy compound having two or more epoxy groups in a molecule, an acid anhydride, and a complex in which an organic ligand is coordinated to manganese (III). The resin cured product contains a resin having an ester group and a hydroxy group, and a complex in which an organic ligand is coordinated to manganese (III). A fiber reinforced resin 101 contains a resin 1 having an ester group and a hydroxy group, fibers 2 impregnated with at least the resin, and a complex 3 in which an organic ligand is coordinated to manganese (III).

公开(公告)号：US11827773B2

公开(公告)日：2023-11-28

申请号：US16643516

申请日：2018-08-31

Applicant: CEMEDINE CO., LTD.

Inventor： Naoko Ishihara ,  Atsushi Ikeda ,  Tomonori Saito ,  Hideharu Hashimukai

IPC: C09K21/14 ,  E04B1/94 ,  C08K3/04 ,  C08L101/10 ,  C08L63/04 ,  C08L33/06 ,  C08K3/22 ,  C08K3/26 ,  C08K3/32 ,  C08K3/38

CPC classification number: C08L101/10 ,  C08K3/04 ,  C08L33/06 ,  C08L63/04 ,  C09K21/14 ,  E04B1/94 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2003/323 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035 ,  C08L101/10 ,  C08L33/06 ,  C08L63/04 ,  C08L63/00 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36

Abstract: Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600° C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.

公开(公告)号：US11680144B2

公开(公告)日：2023-06-20

申请号：US17604326

申请日：2020-04-17

Applicant: HEXCEL COMPOSITES LIMITED

Inventor： Michael Rhodes

IPC: C08J5/24 ,  B32B27/38 ,  C08G59/30 ,  C08G59/32 ,  C08G59/38 ,  C08G59/40 ,  C08G59/68 ,  C08L63/00 ,  C08L63/04

CPC classification number: C08J5/245 ,  C08J5/243 ,  C08J5/244 ,  C08J5/249 ,  C08J2363/02 ,  C08J2363/04 ,  C08J2463/02 ,  C08J2463/04

Abstract: A self-adhesive prepreg comprising a fibre reinforcement layer having a first side and a second side, wherein the first side of the fibre reinforcement layer has been pre-impregnated with a self-adhesive resin composition. The self-adhesive may be used as a structural reinforcement and is especially adapted for direct bonding to oily steel or galvanized steel in the automotive, aerospace and other sheet metal fabrication industries.

公开(公告)号：US20230125986A1

公开(公告)日：2023-04-27

申请号：US17914885

申请日：2021-03-25

Applicant: Central Glass Company, Limited

Inventor： Kensuke HIROTAKI ,  Yukari HARA ,  Takashi AOKI ,  Hirokatsu NAGURA ,  Kenji HOSOI

IPC: C08L63/04 ,  C08G59/24 ,  C08G59/30

Abstract: A novolak resin including a partial structure represented by —C(CF3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF3)H— with epihalohydrin in a presence of a base.

公开(公告)号：US11499003B2

公开(公告)日：2022-11-15

申请号：US16754888

申请日：2018-11-12

Applicant: Hilti Aktiengesellschaft

Inventor： Alexander Bornschlegl

IPC: C08G59/50 ,  C04B26/16 ,  C04B40/06 ,  C08G59/54 ,  C08G59/56 ,  C08G59/62 ,  C08L63/04 ,  C04B26/14

Abstract: A curing composition is useful for a multi-component epoxy resin compound and includes at least one first polyamine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified.