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公开(公告)号：US20240238915A1
公开(公告)日：2024-07-18
申请号：US18289495
申请日：2021-12-28
发明人： Tetsuro NISHIMURA , Kenji NAKAMURA , Junya MASUDA
CPC分类号： B23K35/264 , B23K35/025 , C22C12/00 , C22C13/02
摘要： The present invention relates to a solder paste containing solder powder and a flux, wherein the solder powder is a lead-free solder alloy having a solidus temperature of 150° C. or less, the flux contains: a rosin; a solvent; a thixotropic agent; and an organic acid and an imidazole as an activator, the organic acid includes one or more kinds of dicarboxylic acids having 4 to 6 carbon atoms, and the imidazole includes one or more kinds among imidazole compounds having 3 to 6 carbon atoms and derivatives thereof.
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公开(公告)号：US20240238914A1
公开(公告)日：2024-07-18
申请号：US18410462
申请日：2024-01-11
发明人： Takahiro Yokoyama , Shunsaku Yoshikawa , Yuki Iijima , Kanta Dei , Takahiro Matsufuji , Kota Sugisawa , Shigeto Suzuki
IPC分类号： B23K35/26 , B23K35/02 , C22C13/02 , B23K101/42
CPC分类号： B23K35/262 , B23K35/025 , C22C13/02 , B23K2101/42
摘要： A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：US20240238913A1
公开(公告)日：2024-07-18
申请号：US18410205
申请日：2024-01-11
发明人： Takahiro Yokoyama , Shunsaku Yoshikawa , Yuki Iijima , Kanta Dei , Takahiro Matsufuji , Kota Sugisawa , Shigeto Suzuki
IPC分类号： B23K35/26 , B23K1/00 , B23K35/02 , B23K101/42 , C22C13/02
CPC分类号： B23K35/262 , B23K1/0016 , B23K35/025 , C22C13/02 , B23K2101/42
摘要： A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: more than 0.008% and 0.020% or less, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：US20240075559A1
公开(公告)日：2024-03-07
申请号：US18506384
申请日：2023-11-10
CPC分类号： B23K35/0222 , B23K1/0016 , B23K1/203 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , C22C13/02 , H01L21/4853 , H01L24/00 , H01L24/29 , H01L24/48 , H05K3/3463
摘要： A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 6.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.
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公开(公告)号：US11776927B2
公开(公告)日：2023-10-03
申请号：US17376372
申请日：2021-07-15
发明人： Thomas Behrens , Alexander Heinrich , Evelyn Napetschnig , Bernhard Weidgans , Catharina Wille , Christina Yeong
CPC分类号： H01L24/29 , B23K35/262 , C22C13/02 , H01L24/83 , H01L2224/2922 , H01L2224/29211 , H01L2224/29239 , H01L2224/29244 , H01L2224/29247 , H01L2224/29255 , H01L2224/29264 , H01L2224/29269 , H01L2224/83447 , H01L2224/83455 , H01L2224/83815 , H01L2924/014 , H01L2924/0105 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079
摘要： A semiconductor device and method is disclosed. In one embodiment, the semiconductor device comprises a semiconductor die comprising a first surface and a second surface opposite to the first surface, a first metallization layer disposed on the first surface of the semiconductor die, a first solder layer disposed on the first metallization layer, wherein the first solder layer contains the compound Sn/Sb, and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body, wherein the first contact member is connected with the Ni-based layer to the first solder layer.
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6.发明授权公开(公告)号：US11732330B2
公开(公告)日：2023-08-22
申请号：US16022345
申请日：2018-06-28
发明人： Md Hasnine , Lik Wai Kho
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02 , B23K35/025 , B23K35/0227 , B23K35/0244
摘要： A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
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公开(公告)号：US20230111798A1
公开(公告)日：2023-04-13
申请号：US17959502
申请日：2022-10-04
发明人： Young Woo LEE , Seul Gi LEE , Hui Joong KIM , Jae Yool SON , Jae Hun SONG , Jeong Tak MOON
摘要： A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.
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公开(公告)号：US11607752B2
公开(公告)日：2023-03-21
申请号：US16608917
申请日：2018-09-27
申请人： KOKI Company Limited
发明人： Takehiro Wada
IPC分类号： B23K35/26 , C22C13/02 , B23K101/42
摘要： A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.
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公开(公告)号：US11325210B2
公开(公告)日：2022-05-10
申请号：US16482301
申请日：2017-12-07
发明人： Pu Xu , Siyuan Wang , Daoke Yu , Kui Chen , Jianhao Shi
摘要： A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C., tin atoms in the molten micro/nanoparticle-reinforced tin-based alloy form an intermetallic compound on a soldering pan in preference to the low-melting-point SnBi-based alloy, and the micro/nanoparticles are dispersed in soldered joints to form a “separator effect”, which blocks atoms in the SnBi-based alloy from being precipitated and bonded with the soldering pan, thereby inhibiting the growth of a Bi-rich layer, and solving the problem of brittle and unreliable soldered joints in lead-free low-temperature soldering.
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公开(公告)号：US20210317343A1
公开(公告)日：2021-10-14
申请号：US17359372
申请日：2021-06-25
IPC分类号： C09J9/02 , C09J179/08 , C09J11/06 , C09J7/35 , C22C13/02
摘要： The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).
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