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公开(公告)号:US11753722B2
公开(公告)日:2023-09-12
申请号:US17174005
申请日:2021-02-11
Inventor: Hong-gun Kim , Hun Jeong , Leeku Kwac , Seonghun Back , Bobby Singh Soram
CPC classification number: C23C18/1893 , C23C18/1657 , C23C18/38 , C23F1/10 , B82Y30/00 , B82Y40/00
Abstract: Provided is a method of preparing a nanocomposite material plated with a network-type metal layer through silica self-cracks and a wearable electronics carbon fiber prepared therefrom. The present disclosure provides a nanocomposite material having excellent electrical conductivity and bending resistance by plating a network-type metal layer on a substrate having a flat surface and/or a curved surface through a method of preparing the nanocomposite material in which the network-type metal layer is plated on silica self-cracks by applying a silica coating solution on the substrate having a flat or curved surface, performing drying after the applying of the silica coating solution to form the silica self-cracks having random crack directions and sizes, and performing electroless metal plating on the surface of the substrate. Further, the present disclosure provides a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance.
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公开(公告)号:US11753561B2
公开(公告)日:2023-09-12
申请号:US16766432
申请日:2018-11-20
Applicant: PPG Industries Ohio, Inc.
Inventor: Paul F. Cheetham , Shawn R. DeBerry
CPC classification number: C09D11/52 , C09D11/037 , C23F1/02 , C23F1/10 , G06F3/044 , H05K1/09 , H05K3/067 , G06F2203/04102 , G06F2203/04103 , G06F2203/04112 , H01Q1/38 , H05K2201/0388 , H05K2203/0545
Abstract: A patterning paste is disclosed for patterning metal nanowires, the patterning paste including a complexing agent containing guanidine thiocyanate. A method of selectively patterning a substrate having metal nanowires includes: providing a substrate having a surface bearing metal nanowires; and selectively applying the patterning paste to the substrate such that the metal nanowires are selectively cut into a pattern. A consumer electronic product includes: a substrate having a surface bearing metal nanowires. The metal nanowires of the substrate are selectively patterned by applying the patterning paste to the substrate such that the metal nanowires are selectively cut into the pattern.
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公开(公告)号:US10961453B2
公开(公告)日:2021-03-30
申请号:US16541787
申请日:2019-08-15
Applicant: Fujifilm Electronic Materials U.S.A., Inc.
Inventor: Tomonori Takahashi , Frank Gonzalez
Abstract: The present disclosure is directed to etching compositions that are useful, e.g., for selectively removing tungsten (W) and/or titanium nitride (TiN) from a semiconductor substrate as an intermediate step in a multistep semiconductor manufacturing process.
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公开(公告)号:US10953467B2
公开(公告)日:2021-03-23
申请号:US15500664
申请日:2015-07-31
Applicant: Oxford University Innovation Limited , Vitaliy Babenko , Nicole Grobert
Inventor: Vitaliy Babenko , Nicole Grobert
IPC: C23C16/26 , C23C16/04 , C23C16/01 , C23C16/34 , B22F7/00 , B22F3/24 , C22C1/08 , C01B21/064 , B22F3/11 , C01B32/194 , C01B32/186 , B01J21/18 , B01J23/72 , B01J23/755 , B01J27/24 , B01J35/00 , B01J37/02 , B01J37/08 , B22F1/00 , B22F3/26 , C23C16/56 , C23F1/10 , H01B1/04 , H01B1/06 , H01B13/34 , H01G11/30 , H01G11/36 , H01G11/86 , H01M4/04 , H01M4/133 , H01M4/136 , H01M4/1393 , H01M4/1397 , H01M4/583 , H01M10/0525 , H01M4/02
Abstract: According to the present invention, there are provided processes for preparing a porous composite material comprising a metal and a two-dimensional nanomaterial. In one aspect, the processes comprise the steps of: providing a powder comprising metal particles; heating the powder such that the metal particles fuse to form a porous scaffold; and forming a two-dimensional nanomaterial on a surface of the porous scaffold by chemical vapour deposition (CVD). Also provided are materials obtainable by the present processes, and products comprising said materials.
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公开(公告)号:US20210032489A1
公开(公告)日:2021-02-04
申请号:US16766432
申请日:2018-11-20
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor: Paul F. CHEETHAM , Shawn R. DEBERRY
Abstract: A patterning paste is disclosed for patterning metal nanowires, the patterning paste including a complexing agent containing guanidine thiocyanate. A method of selectively patterning a substrate having metal nanowires includes: providing a substrate having a surface bearing metal nanowires; and selectively applying the patterning paste to the substrate such that the metal nanowires are selectively cut into a pattern. A consumer electronic product includes: a substrate having a surface bearing metal nanowires. The metal nanowires of the substrate are selectively patterned by applying the patterning paste to the substrate such that the metal nanowires are selectively cut into the pattern.
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公开(公告)号:US20200270740A1
公开(公告)日:2020-08-27
申请号:US15781873
申请日:2017-11-14
Inventor: Fengli JI , Yinan LIANG
Abstract: A mask and a manufacturing method thereof are disclosed. The mask includes a mask substrate; the mask substrate includes a mask area; the mask area includes an active area and a dummy area located at a periphery of the active area; a plurality of via holes penetrating the mask substrate is disposed in both of the active area and the dummy area; the plurality of via holes disposed in the dummy area is filled with a blocking material.
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公开(公告)号:US10577696B2
公开(公告)日:2020-03-03
申请号:US15387456
申请日:2016-12-21
Applicant: ENF TECHNOLOGY CO., LTD.
Inventor: Seul Ki Kim , Se Hoon Kim
IPC: C23F1/00 , C23F1/02 , C23F1/10 , C23F1/14 , C23F1/16 , C23F1/18 , C23F1/44 , C23F1/46 , C23F4/00 , H01L21/04 , H01L21/306 , H01L21/3213 , H01L21/768
Abstract: Provided is a copper etchant composition including: a first organic acid containing one or more amine groups, and one or more carboxylic acid groups; a second organic acid; an amine compound; hydrogen peroxide; and a phosphate compound, which has the increased number of processing sheets and etching uniformity, when etching copper.
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公开(公告)号:US10457866B2
公开(公告)日:2019-10-29
申请号:US15560332
申请日:2016-03-04
Applicant: Central Glass Company, Limited
Inventor: Yosuke Nakamura , Masaki Fujiwara , Hiroyuki Oomori , Akifumi Yao
IPC: C07C17/383 , C07C21/18 , C09K13/08 , C23F1/10 , C23F1/12 , H01L21/306 , H01L21/3065 , H01L21/3105 , H01L21/311 , H01L21/3213
Abstract: What is disclosed is a dry etching gas containing 1,3,3,3-tetrafluoropropene, wherein 1,3,3,3-tetrafluoropropene has purity of 99.5 mass % or more, and a total of concentration of each mixed metal component of Fe, Ni, Cr, Al, and Mo is 500 mass ppb or less. Furthermore, regarding to the dry etching gas, it is preferable that a content of nitrogen is 0.5 volume % or less, and that a content of water is 0.05 mass % or less. In a dry etching with a plasma gas obtained by making a dry etching gas into plasma, the dry etching gas of the present invention can improve etching selectivity of silicon-based material with respect to a mask.
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公开(公告)号:US10294422B2
公开(公告)日:2019-05-21
申请号:US15197941
申请日:2016-06-30
Applicant: Hailiang Wang
Inventor: Hailiang Wang
Abstract: This invention in general relates to a transparent conductive layer comprising a silver nanowire. This invention further relates to an etching composition suitable for etching a transparent conductive layer comprising a silver nanowire to form a pattern. This invention further relates to a transparent conductive electrode manufactured by etching a transparent conductive film comprising a silver nanowire. The etching composition may comprise an oxidizing agent and a ligand. The oxidizing agent may be a first chemical compound that can react with silver metal to form a silver compound; and the ligand may be a second chemical compound that can react with the silver compound to form a water soluble coordination complex of the silver ion.
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公开(公告)号:US10180749B2
公开(公告)日:2019-01-15
申请号:US15077484
申请日:2016-03-22
Applicant: Samsung Display Co., Ltd.
Inventor: In-Nam Lee , Sung-Ku Kang , Joo-Han Bae , Dong-Eun Lee , Byeong-Jin Lee , Choon-Hyop Lee
Abstract: A touch screen panel includes: a substrate; electrode patterns disposed on the substrate; insulation patterns disposed partially covering the electrode patterns, the insulation patterns defining openings, wherein at least a part of top surfaces of the electrode patterns are exposed through the openings; connecting conductive patterns disposed on the insulation patterns, the connecting conductive patterns filling at least a part of the openings and being electrically connected to the electrode patterns; and wirings disposed on at least a portion of the connecting conductive patterns.
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