PREDICTIVE ELECTRONIC THERMOMETER CIRCUIT STRUCTURE CAPABLE OF TEMPERATURE COMPENSATION

    公开(公告)号:US20230332959A1

    公开(公告)日:2023-10-19

    申请号:US17918091

    申请日:2021-07-02

    发明人: FANG LI TIANPING SHEN

    摘要: A predictive electronic thermometer circuit structure capable of temperature compensation is provided, including: a compensation module, a thermometer circuit, and a liquid crystal display (LCD) drive module. The thermometer circuit includes a temperature measurement oscillation circuit and a real measurement module. The compensation module and the real measurement module are connected in parallel between the temperature measurement oscillation circuit and the LCD drive module. The predictive electronic thermometer circuit structure controls the on and off of the compensation module and the real measurement module through a combination logic control switch respectively. When the compensation module is off and the real measurement module is on, an actual measured data is output. When the real measurement module is off and the compensation module is on, a temperature value is output after predictive compensation. The electronic thermometer has a temperature compensation function, and measures the temperature quickly and accurately.

    METHOD OF STABILIZING TEMPERATURE SENSING IN THE PRESENCE OF TEMPERATURE-SENSING COMPONENT TEMPERATURE VARIATION

    公开(公告)号:US20230314238A1

    公开(公告)日:2023-10-05

    申请号:US17707997

    申请日:2022-03-30

    IPC分类号: G01K1/20 G01J5/53 G01K11/30

    CPC分类号: G01K1/20 G01J5/53 G01K11/30

    摘要: A method of stabilizing temperature sensing in presence of temperature-sensing component temperature variation includes steps of: obtaining response value caused by black body at first temperature of a thermal imager core chip; obtaining high-temperature first-order linear function of high-temperature black body response value versus thermal imager core chip temperature; obtaining low-temperature first-order linear function of low-temperature black body response value versus thermal imager core chip temperature; obtaining response value of high-temperature first-order linear function at first temperature, response value of high-temperature first-order linear function at second temperature of the thermal imager core chip, response value of low-temperature first-order linear function at first temperature, response value of low-temperature first-order linear function at second temperature, and response value of black body and substituting the five values into an equation for correcting the response values; and obtaining instant corrected value of the response value of the black body.

    Control with enhanced sensing capabilities

    公开(公告)号:US11408622B2

    公开(公告)日:2022-08-09

    申请号:US15755652

    申请日:2016-08-25

    申请人: DELTA T, LLC

    摘要: An apparatus for controlling a device in connection with a sensed temperature in a space includes an actuator for regulating the operation of the device, a temperature sensor for providing the sensed temperature, and a thermal antenna connected to the temperature sensor. The thermal antenna may form part of the exposed face of the apparatus. A housing may include partitions, such as a plurality of circuit boards, for communicating with the actuator to provide control for the device. The partitions or circuit boards are spaced apart to form ventilation channels for ventilating heat from the housing, including byway of an encouraging convective flow.

    Fiber optic probe with dual sealing and compression element

    公开(公告)号:US11353368B2

    公开(公告)日:2022-06-07

    申请号:US16419612

    申请日:2019-05-22

    发明人: John Bergen

    IPC分类号: G01K11/32 G01K1/20

    摘要: Temperature sensing probes for sensing the temperature of a substrate based on fluorescence are disclosed. The temperature sensing probes include a fiber optic cable having at a cold end an optical interface and at a hot end a temperature sensing element for contacting a substrate. A sheath surrounds at least a portion of the hot end of the fiber optic cable. A retaining member securely and removably engages the sheath with a support member. The sheath forms a vacuum seal around the contact between the temperature sensing element and the substrate.