中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

162 records (took 0.027 seconds)

    METHODS FOR PRODUCING PASSIVE COMPONENTS ON A SEMICONDUCTOR SUBSTRATE
    52.
    发明申请
    METHODS FOR PRODUCING PASSIVE COMPONENTS ON A SEMICONDUCTOR SUBSTRATE 审中-公开
    在半导体衬底上制造被动元件的方法

    公开(公告)号：WO02015273A2

    公开(公告)日：2002-02-21

    申请号：PCT/DE2001/002925

    申请日：2001-08-01

    IPC: H01L27/04 ,  H01L21/822 ,  H01L21/8222 ,  H01L27/01 ,  H01L27/06

    CPC classification number: H01L21/822 ,  H01L27/016 ,  Y10T29/49082 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: The invention relates to methods for producing passive components on a substrate. Said methods permit, with a low level of complexity and with good results, the production of different components, especially high-impedance and low-impedance resistor elements and/or capacitor elements having a high and some having a low capacitance per unit length on the substrate. Lift-off processes can, to a large extent, be forgone particularly in the case of critical structurings, and the components can be dry-chemically and/or wet-chemically etched in a selective manner.

    Abstract translation: 为了在衬底上生产无源元件，规定了允许以很小的努力和良好的产量生产不同元件，特别是高电阻和低电阻元件和/或电容元件的较高和电容较低的元件的方法。 在这种情况下，剥离过程在很大程度上可以省去，特别是在关键结构化的情况下，并且可以选择性地进行干法和/或湿法化学蚀刻。

    ELECTRONIC DEVICE AND PROCESS OF MAKING ELECTRONIC DEVICE
    53.
    发明申请
    ELECTRONIC DEVICE AND PROCESS OF MAKING ELECTRONIC DEVICE 审中-公开
    电子设备及制造电子设备的方法

    公开(公告)号：WO0175940A3

    公开(公告)日：2002-01-31

    申请号：PCT/US0109299

    申请日：2001-03-23

    Applicant: AVX CORP

    Inventor： HEISTAND ROBERT H II ,  GALVAGNI JOHN L ,  MEVISSEN JEFFREY P ,  KENNEDY ROBERT MOFFATT III

    IPC: H01C7/00 ,  H01C1/028 ,  H01C1/142 ,  H01C7/04 ,  H01C7/10 ,  H01C17/28 ,  H01G2/12 ,  H01C1/034 ,  H01G2/10 ,  H01G4/232

    CPC classification number: H01G2/12 ,  H01C1/028 ,  H01C1/142 ,  H01C17/288 ,  Y10T29/49082

    Abstract: An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, themistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. "BCB") resin dissolved in mesitylene solvent.

    Abstract translation: 公开了一种电子设备和制造该设备的过程。 该装置包括由布置成堆叠的多个电极板限定的多边体。 将树脂层施加到器件的导电和半导体区域，并且将金属电镀在端子上以形成导电元件。 该装置可以是具有多边体的变阻器，电阻器，电阻器或其他具有能够接收树脂涂层的微电子部件。 多面体在外表面的至少一部分上具有树脂涂层，树脂涂层基本上防止金属镀在人体外表面上。 可以使用的一种合适的树脂涂层是包含溶解在均三甲苯溶剂中的B阶二乙烯基硅氧烷 - 双（苯并环丁烯）（即“BCB”）树脂的热固性树脂。

    ELECTRICAL DEVICES AND PROCESS FOR MAKING SUCH DEVICES
    54.
    发明申请
    ELECTRICAL DEVICES AND PROCESS FOR MAKING SUCH DEVICES 审中-公开
    用于制造这种装置的电气装置和方法

    公开(公告)号：WO01020619A2

    公开(公告)日：2001-03-22

    申请号：PCT/US2000/025118

    申请日：2000-09-13

    IPC: H01C1/14 ,  H01C7/02 ,  H01C7/18 ,  H01C13/02 ,  H01C17/00 ,  H05K3/00 ,  H05K3/40

    CPC classification number: H01C1/1406 ,  H01C7/021 ,  H01C7/027 ,  H01C7/18 ,  H01C13/02 ,  H01C17/006 ,  H05K3/0052 ,  H05K3/403 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49091 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T156/1092

    Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7, 8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1), in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

    Abstract translation: 一种制造复合聚合物电路保护装置的方法，其中提供聚合物组件，然后再分成单独的装置（2）。 组件通过提供第一和第二层压板（7,8）制成，每个层压板包括具有至少一个导电表面的层状聚合物元件，在一个层压板上的至少一个导电表面上提供图案，将层压板固定在 堆叠（1），所述构造中的至少一个所述层叠体的至少一个导电表面形成所述层叠体的外部导电表面（3），并且在导电材料之间形成多个电连接（31,51） 第一层压体的表面和第二层压体的导电表面。 层状聚合物元件可以是PTC导电聚合物组合物，使得由该方法制备的各个装置表现出PTC行为。

    ELECTRICAL DEVICES
    56.
    发明申请
    ELECTRICAL DEVICES 审中-公开
    电气设备

    公开(公告)号：WO1995034084A1

    公开(公告)日：1995-12-14

    申请号：PCT/US1995007420

    申请日：1995-06-09

    Applicant: RAYCHEM CORPORATION

    Inventor： RAYCHEM CORPORATION ,  ZHANG, Michael ,  THOMPSON, Mark, S. ,  TOTH, James ,  BEADLING, William, Cardwell

    IPC: H01C17/00

    CPC classification number: H01C1/1406 ,  H01C17/006 ,  Y10T29/49082 ,  Y10T29/49085

    Abstract: Electrical devices, particularly circuit protection devices, contain conductive polymer elements whose edges are formed by breaking the conductive polymer element, along a desired path, without the introduction of any solid body into the element. The resulting cohesive failure of the conductive polymer produces a distinctive fractured surface. One method of preparing such devices involves etching fracture channels in the electrodes of a plaque containing a PTC conductive polymer element sandwiched between metal foil electrodes, and then snapping the plaque along the fracture channels to form individual devices. The figure illustrates a circuit protection device made in this way.

    Abstract translation: 电气装置，特别是电路保护装置包含导电聚合物元件，其导电聚合物元件的边缘通过沿所需的路径断开导电聚合物元件而形成，而不会将任何固体引入到元件中。 所导致的导电聚合物的内聚破坏产生明显的断裂表面。 制备这种装置的一种方法包括蚀刻含有夹在金属箔电极之间的PTC导电聚合物元件的斑块的电极中的断裂通道，然后沿着断裂通道捕获斑块以形成单独的装置。 该图示出了以这种方式制造的电路保护装置。

    PROCESS FOR TUNING A MAGNETO-RESISTIVE SENSOR
    57.
    发明申请
    PROCESS FOR TUNING A MAGNETO-RESISTIVE SENSOR 审中-公开
    方法用于匹配的磁阻传感器

    公开(公告)号：WO1995012128A1

    公开(公告)日：1995-05-04

    申请号：PCT/DE1994001172

    申请日：1994-10-07

    Applicant: ROBERT BOSCH GMBH ,  GALSTER, Rudolf ,  GERLACH, Guenter ,  DUKART, Anton ,  MARX, Klaus ,  JOST, Franz

    Inventor： ROBERT BOSCH GMBH

    IPC: G01R33/06

    CPC classification number: G01R33/09 ,  Y10T29/49082

    Abstract: The invention relates to a process for tuning a magneto-resistive sensor by means of which an offset error can be compensated without additional components. To this end, a uniform, directed magnetic field is applied to the magneto-resistive sensor (10), a given control current (I) is applied to its current contacts (22, 24) and during the measurement of a pseudo-Hall voltage, at least one of the voltage contacts (30, 32) is grooved, e.g. with a laser beam (38).

    Abstract translation: 本发明涉及一种用于调节一个磁致电阻传感器，具有偏移误差可以在没有任何附加的部件来补偿的方法。 为了这个目的，它提供了在磁阻传感器（10）进行均匀对准的磁场到其当前触点（22,24）一个定义的控制电流（I）被施加和伪霍尔电压的电压触点中的至少一个的测量（在 30，32）被切开，例如，用激光束（38）。

    METAL OXIDE VARISTORS AND METHOD THEREFOR
    58.
    发明申请
    METAL OXIDE VARISTORS AND METHOD THEREFOR 审中-公开
    金属氧化物变压器及其方法

    公开(公告)号：WO1991009407A1

    公开(公告)日：1991-06-27

    申请号：PCT/US1990007236

    申请日：1990-12-07

    Applicant: RAYCHEM CORPORATION

    Inventor： RAYCHEM CORPORATION ,  BECKER, Paul ,  POWERS, Carol ,  THOMPSON, Mark, S.

    IPC: H01C07/10

    CPC classification number: H01C7/108 ,  H01C7/112 ,  Y10T29/49082

    Abstract: A varistor comprises a primary varistor metal oxide, aluminum in an amount of about 1 to about 30 parts per million (ppm), about 0.1 to about 0.5 mole % bismuth, about 0.1 to about 1.5 mole % antimony, about 0.1 to about 1 mole % chromium, about 0.1 to about 1.0 mole % manganese, about 0.1 to about 2.0 mole % cobalt, and about 0 to about 1.0 mole % boron. Each of these elements is present in the form of its oxide and the varistor has a DC leakage current at 80 % of V1ma/cm2 of less than 1.0 x 10?-7 amp/cm2¿.

    石英卡夹装置及其制作方法与带该石英卡夹装置的OLED高温炉
    59.
    发明申请
    石英卡夹装置及其制作方法与带该石英卡夹装置的OLED高温炉 审中-公开

    公开(公告)号：WO2015096254A1

    公开(公告)日：2015-07-02

    申请号：PCT/CN2014/071142

    申请日：2014-01-22

    Applicant: 深圳市华星光电技术有限公司

    Inventor： 余威

    IPC: H01L21/68 ,  H01L21/673 ,  H01L51/56

    CPC classification number: F16M13/00 ,  H01L21/67303 ,  H01L21/67306 ,  H01L21/67309 ,  H05B3/44 ,  Y10T29/49082

    Abstract: 一种石英卡夹装置及其制作方法与带该石英卡夹装置的OLED高温炉。该石英卡夹装置包括：一底座（20）、固定安装于底座（20）上的数根石英柱（30）、位于底座（20）上方的石英底板（40）及位于石英底板（40）上方且卡夹于石英柱（30）上的数层石英卡板（50）；所述石英底板（40）上对应石英柱（30）设有数个圆孔（42），该圆孔（42）的直径大于石英柱（30）的直径，所述石英柱（30）穿过圆孔（42）并在圆孔（42）下方设有紧固部件（60），进而使石英底板（40）支撑于所述石英柱（30）上，通过扩大石英底板圆孔的直径，保证石英柱轻微倾斜时不会与石英底板发生触碰，避免石英底板因触碰产生裂纹，影响生产。

    QUICK CONNECT FITTINGS
    60.
    发明申请
    QUICK CONNECT FITTINGS 审中-公开
    快速连接配件

    公开(公告)号：WO2010019383A1

    公开(公告)日：2010-02-18

    申请号：PCT/US2009/052181

    申请日：2009-07-30

    Applicant: KANTHAL CORPORATION ,  TIERNEY, Brian, M.

    Inventor： TIERNEY, Brian, M.

    IPC: F16L37/098

    CPC classification number: F16L37/091 ,  Y10T29/49082

    Abstract: A resistor (2) assembly and method of assembling a resistor (2) to a coupling (40), comprises providing a resistor having a first end (4) and a second end (6), the resistor being tubular in shape and providing a coupling housing (10) having an open end (30) for receiving the first end of the resistor, the coupling housing (10) including a sealing member (42), a retainer (44), and a support washer (45). The retainer (44) is interposed between the support washer (45) and sealing member (42). The first end (4) of the resistor is inserted into the open end (30) of the coupling housing (10). The tube is rotated within the coupling housing (10) so that the resistor is in sealing engagement with the sealing member (42) and retained by retaining member.

    Abstract translation: 一种将电阻器（2）组装到耦合器（40）的电阻器（2）组件和方法，包括提供具有第一端（4）和第二端（6）的电阻器，所述电阻器是管状形状并提供 具有用于接收电阻器的第一端的开口端（30）的联接壳体（10），所述联接器壳体（10）包括密封构件（42），保持器（44）和支撑垫圈（45）。 保持器（44）插入在支撑垫圈（45）和密封构件（42）之间。 电阻器的第一端（4）插入到联接器壳体（10）的开口端（30）中。 管在联接壳体（10）内旋转，使得电阻器与密封构件（42）密封接合并由保持构件保持。

Patent Agency Ranking