公开(公告)号：WO2011122883A3

公开(公告)日：2012-03-08

申请号：PCT/KR2011002239

申请日：2011-03-31

Applicant: SNU R&DB FOUNDATION ,  KWON SUNGHOON ,  LEE HOWON ,  KIM JUNHOI ,  KIM JI YUN

Inventor： KWON SUNGHOON ,  LEE HOWON ,  KIM JUNHOI ,  KIM JI YUN

IPC: G01N33/52 ,  G01N21/25 ,  G01N33/48

CPC classification number: G06K19/06196 ,  B01J19/0046 ,  B01J2219/00317 ,  B01J2219/00466 ,  B01J2219/00468 ,  B01J2219/005 ,  B01J2219/00533 ,  B01J2219/00545 ,  B01J2219/00549 ,  B01J2219/00576 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00648 ,  B01J2219/00655 ,  B01L3/502761 ,  B01L2200/0668 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2400/043 ,  B03C1/034 ,  B03C1/288 ,  B03C2201/18 ,  B03C2201/24 ,  B03C2201/26 ,  G01N33/54346 ,  G01N33/587 ,  G01N35/0098 ,  G06K7/08 ,  G06K19/022

Abstract: Provided is a method for magnetically controlling a magnetic structure, comprising: a step of providing a solution containing a magnetic structure having a magnetic axis along which magnetic nanoparticles are aligned; and a step of applying an external magnetic field to the solution so as to control the motion of the magnetic structure.

Abstract translation: 提供一种用于磁性控制磁性结构的方法，包括：提供包含磁性结构的溶液的步骤，磁性结构具有磁性粒子对准的磁性轴; 以及对溶液施加外部磁场以控制磁性结构的运动的步骤。

公开(公告)号：WO2010036051A3

公开(公告)日：2010-04-01

申请号：PCT/KR2009/005481

申请日：2009-09-25

Applicant: LG INNOTEK CO., LTD. ,  KIM, Ji Yun ,  SHIN, Hyun Sub ,  LEE, Sung Won ,  LEE, Hyung Eui ,  SEO, Yeong Uk ,  RYU, Sung Wuk ,  LEE, Hyuk Soo

Inventor： KIM, Ji Yun ,  SHIN, Hyun Sub ,  LEE, Sung Won ,  LEE, Hyung Eui ,  SEO, Yeong Uk ,  RYU, Sung Wuk ,  LEE, Hyuk Soo

IPC: H01L23/495 ,  H01L21/60

Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.

公开(公告)号：WO2009140598A1

公开(公告)日：2009-11-19

申请号：PCT/US2009/044148

申请日：2009-05-15

Applicant: BAYER HEALTHCARE LLC ,  FELDMAN, Richard ,  KIM, Ji-yun ,  JIANG, Haiyan ,  MCLEAN, Kirk ,  PAN, Junliang ,  PIERCE, Glenn ,  WU, James ,  ZHAO, Xiao-Yan

Inventor： FELDMAN, Richard ,  KIM, Ji-yun ,  JIANG, Haiyan ,  MCLEAN, Kirk ,  PAN, Junliang ,  PIERCE, Glenn ,  WU, James ,  ZHAO, Xiao-Yan

IPC: A61K38/00

CPC classification number: C07K14/755 ,  A61K38/00 ,  A61K38/37 ,  A61K38/4846 ,  C07K16/2839 ,  C07K2317/622 ,  C07K2319/30 ,  C07K2319/33

Abstract: Targeted coagulation factors comprising a coagulation factor linked with at least one domain that specifically binds to a membrane protein on a blood cell is provided. The disclosed targeted coagulation factors increase the efficiency of coagulation factors and prolong their duration of action and thus, are an improvement for the treatment of hematological diseases such as hemophilia A.

Abstract translation: 提供了包含与至少一个与血细胞上的膜蛋白特异性结合的结构域连接的凝血因子的靶向凝血因子。 所公开的靶向凝血因子增加凝血因子的效率并延长其作用时间，因此是治疗血液病如血友病A的改善。

公开(公告)号：WO2009045050A3

公开(公告)日：2009-05-22

申请号：PCT/KR2008005787

申请日：2008-10-01

Applicant: SEOUL NAT UNIV IND FOUNDATION ,  KWON SUNG HOON ,  KIM JI YUN ,  PARK WOOK ,  PARK HYUN SUNG ,  LEE SEUNG AH ,  CHUNG SU EUN

Inventor： KWON SUNG HOON ,  KIM JI YUN ,  PARK WOOK ,  PARK HYUN SUNG ,  LEE SEUNG AH ,  CHUNG SU EUN

IPC: H01L21/027

CPC classification number: B29C39/22 ,  B81C99/0095 ,  B81C2201/0159 ,  G03F7/2035

Abstract: A fluidic channel system is provided. The fluidic channel system includes a light projection apparatus, a fluidic channel, and a rail. The light projection apparatus provides light. A photocurable fluid, which is selectively cured by the light, flows inside the fluidic channel. A fine structure which is to be formed by curing the photocurable fluid moves along the rail.

Abstract translation: 提供流体通道系统。 流体通道系统包括光投射装置，流体通道和轨道。 光投射装置提供光。 通过光选择性固化的可光固化流体在流体通道内流动。 通过固化可光固化流体形成的精细结构沿轨道移动。

公开(公告)号：WO2009045050A2

公开(公告)日：2009-04-09

申请号：PCT/KR2008/005787

申请日：2008-10-01

Applicant: SEOUL NATIONAL UNIVERSITY INDUSTRY FOUNDATION ,  KWON, Sung Hoon ,  KIM, Ji Yun ,  PARK, Wook ,  PARK, Hyun Sung ,  LEE, Seung Ah ,  CHUNG, Su Eun

Inventor： KWON, Sung Hoon ,  KIM, Ji Yun ,  PARK, Wook ,  PARK, Hyun Sung ,  LEE, Seung Ah ,  CHUNG, Su Eun

IPC: H01L21/027

CPC classification number: B29C39/22 ,  B81C99/0095 ,  B81C2201/0159 ,  G03F7/2035

Abstract: A fluidic channel system is provided. The fluidic channel system includes a light projection apparatus, a fluidic channel, and a rail. The light projection apparatus provides light. A photocurable fluid, which is selectively cured by the light, flows inside the fluidic channel. A fine structure which is to be formed by curing the photocurable fluid moves along the rail.

Abstract translation: 提供流体通道系统。 流体通道系统包括光投射装置，流体通道和轨道。 光投射装置提供光。 由光选择性固化的光固化流体在流体通道内流动。 通过固化可光固化流体而形成的精细结构沿轨道移动。

公开(公告)号：WO2010036051A2

公开(公告)日：2010-04-01

申请号：PCT/KR2009005481

申请日：2009-09-25

Applicant: LG INNOTEK CO LTD ,  KIM JI YUN ,  SHIN HYUN SUB ,  LEE SUNG WON ,  LEE HYUNG EUI ,  SEO YEONG UK ,  RYU SUNG WUK ,  LEE HYUK SOO

Inventor： KIM JI YUN ,  SHIN HYUN SUB ,  LEE SUNG WON ,  LEE HYUNG EUI ,  SEO YEONG UK ,  RYU SUNG WUK ,  LEE HYUK SOO

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L21/4832 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/95 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85457 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.

Abstract translation: 本发明涉及多排引线框架和半导体封装的结构和制造方法，其特征在于在金属材料上形成焊盘部分（第一步骤）; 在第一图案形成之后执行表面电镀工艺或有机材料涂层（第二步骤）; 在金属材料上形成第二图案（第三步骤）; 并且在第二图案形成之后封装半导体芯片（第四步骤），由此通过施加渐进蚀刻来最小化底切现象。