公开(公告)号：WO2010105157A2

公开(公告)日：2010-09-16

申请号：PCT/US2010/027141

申请日：2010-03-12

Applicant: TESSERA RESEARCH LLC ,  HABA, Belgacem ,  MARCUCCI, Brian

Inventor： HABA, Belgacem ,  MARCUCCI, Brian

IPC: H01L23/49

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly can include a microelectronic device (310) having device contacts (312) exposed at a surface (328) thereof and an interconnection element having element contacts (340) and having a face adjacent to the microelectronic device. Conductive elements (365), e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer (360) has a conductive surface (375) disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material (360) can have first and second dimensions (326, 336) in first and second horizontal directions which are smaller than first and second corresponding dimensions (324, 334) of the microelectronic device. The conductive material (360) is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

Abstract translation: 微电子组件可以包括具有在其表面（328）处暴露的器件触点（312）的微电子器件（310）和具有元件触点（340）并且具有与微电子器件相邻的面的互连元件。 导电元件（365），例如，引线键将器件触点与元件触点连接，并且具有在微电子器件的表面上方延伸的部分。 导电层（360）具有导电表面（375），该导电表面（375）以多个导电元件的行程上方或下方至少基本均匀的距离设置。 在一些情况下，导电材料（360）可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸（324,334）的第一和第二尺寸（326,336）。 导电材料（360）可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：WO2010105152A3

公开(公告)日：2011-10-27

申请号：PCT/US2010027135

申请日：2010-03-12

Applicant: TESSERA INC ,  HABA BELGACEM ,  MARCUCCI BRIAN

Inventor： HABA BELGACEM ,  MARCUCCI BRIAN

IPC: H01L23/49 ,  H01L23/66

CPC classification number: B81B7/0006 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00011 ,  H01L2224/4554

Abstract: A microelectronic assembly can include a microelectronic device, e.g., semiconductor chip (910), connected together with an interconnection element (930), e.g., substrate, the latter having signal contacts (990) and reference contacts (980). The reference contacts can be connectable to a source of reference potential such as ground or a voltage source other than ground such as a voltage source used for power. Signal conductors, e.g., signal wirebonds (965) can be connected to device contacts (912) exposed at a surface of the microelectronic device (910). Reference conductors, e.g., reference wirebonds (975) can be provided, at least one of which can be connected with two reference contacts (980) of the interconnection element (930). The reference wirebond (975) can have a run which extends at an at least substantially uniform spacing from a signal conductor, e.g., signal wirebond (965) that is connected to the microelectronic device over at least a substantial portion of the length of the signal conductor. In such manner a desired impedance may be achieved for the signal conductor.

Abstract translation: 微电子组件可以包括与互连元件（930）例如衬底连接在一起的微电子器件，例如半导体芯片（910），衬底具有信号触点（990）和参考触点（980）。 参考触点可以连接到参考电位源，例如接地或除接地之外的电压源，例如用于电源的电压源。 诸如信号引线键（965）的信号导体可以连接到暴露在微电子器件（910）的表面处的器件触点（912）。 可以提供参考导体，例如参考导线键（975），其中的至少一个可以与互连元件（930）的两个参考触点（980）连接。 参考引线键（975）可以​​具有以与信号导体至少基本均匀的间隔延伸的行程，例如在信号长度的至少大部分上连接到微电子器件的信号引线键（965） 导体。 以这种方式，可以为信号导体实现期望的阻抗。

公开(公告)号：WO2010105157A3

公开(公告)日：2012-02-23

申请号：PCT/US2010027141

申请日：2010-03-12

Applicant: TESSERA INC ,  HABA BELGACEM ,  MARCUCCI BRIAN

Inventor： HABA BELGACEM ,  MARCUCCI BRIAN

IPC: H01L23/49 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011

Abstract: A microelectronic assembly can include a microelectronic device (310) having device contacts (312) exposed at a surface (328) thereof and an interconnection element having element contacts (340) and having a face adjacent to the microelectronic device. Conductive elements (365), e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer (360) has a conductive surface (375) disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material (360) can have first and second dimensions (326, 336) in first and second horizontal directions which are smaller than first and second corresponding dimensions (324, 334) of the microelectronic device. The conductive material (360) is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

Abstract translation: 微电子组件可以包括具有在其表面（328）处暴露的器件触点（312）的微电子器件（310）和具有元件触点（340）并具有与微电子器件相邻的面的互连元件。 导电元件（365），例如，引线将器件触点与元件触点连接，并且具有在微电子器件的表面上方延伸的部分。 导电层（360）具有导电表面（375），该导电表面设置在多个导电元件的行程之上或之下至少基本均匀的距离处。 在一些情况下，导电材料（360）可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸（324,334）的第一和第二尺寸（326,336）。 导电材料（360）可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：WO2010105152A2

公开(公告)日：2010-09-16

申请号：PCT/US2010/027135

申请日：2010-03-12

Applicant: TESSERA RESEARCH LLC ,  HABA, Belgacem ,  MARCUCCI, Brian

Inventor： HABA, Belgacem ,  MARCUCCI, Brian

IPC: H01L23/49

CPC classification number: B81B7/0006 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00011 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly can include a microelectronic device, e.g., semiconductor chip (910), connected together with an interconnection element (930), e.g., substrate, the latter having signal contacts (990) and reference contacts (980). The reference contacts can be connectable to a source of reference potential such as ground or a voltage source other than ground such as a voltage source used for power. Signal conductors, e.g., signal wirebonds (965) can be connected to device contacts (912) exposed at a surface of the microelectronic device (910). Reference conductors, e.g., reference wirebonds (975) can be provided, at least one of which can be connected with two reference contacts (980) of the interconnection element (930). The reference wirebond (975) can have a run which extends at an at least substantially uniform spacing from a signal conductor, e.g., signal wirebond (965) that is connected to the microelectronic device over at least a substantial portion of the length of the signal conductor. In such manner a desired impedance may be achieved for the signal conductor.

Abstract translation: 微电子组件可以包括与互连元件（930）例如衬底连接在一起的微电子器件，例如半导体芯片（910），衬底具有信号触点（990）和参考触点（980）。 参考触点可以连接到参考电位源，例如接地或除接地之外的电压源，例如用于电源的电压源。 诸如信号引线键（965）的信号导体可以连接到暴露在微电子器件（910）的表面处的器件触点（912）。 可以提供参考导体，例如参考导线键（975），其中的至少一个可以与互连元件（930）的两个参考触点（980）连接。 参考引线键（975）可以​​具有以与信号导体至少基本均匀的间隔延伸的行程，例如在信号长度的至少大部分上连接到微电子器件的信号引线键（965） 导体。 以这种方式，可以为信号导体实现期望的阻抗。