公开(公告)号：WO2010105157A2

公开(公告)日：2010-09-16

申请号：PCT/US2010/027141

申请日：2010-03-12

Applicant: TESSERA RESEARCH LLC ,  HABA, Belgacem ,  MARCUCCI, Brian

Inventor： HABA, Belgacem ,  MARCUCCI, Brian

IPC: H01L23/49

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly can include a microelectronic device (310) having device contacts (312) exposed at a surface (328) thereof and an interconnection element having element contacts (340) and having a face adjacent to the microelectronic device. Conductive elements (365), e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer (360) has a conductive surface (375) disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material (360) can have first and second dimensions (326, 336) in first and second horizontal directions which are smaller than first and second corresponding dimensions (324, 334) of the microelectronic device. The conductive material (360) is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

Abstract translation: 微电子组件可以包括具有在其表面（328）处暴露的器件触点（312）的微电子器件（310）和具有元件触点（340）并且具有与微电子器件相邻的面的互连元件。 导电元件（365），例如，引线键将器件触点与元件触点连接，并且具有在微电子器件的表面上方延伸的部分。 导电层（360）具有导电表面（375），该导电表面（375）以多个导电元件的行程上方或下方至少基本均匀的距离设置。 在一些情况下，导电材料（360）可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸（324,334）的第一和第二尺寸（326,336）。 导电材料（360）可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：WO1998032168A1

公开(公告)日：1998-07-23

申请号：PCT/GB1997003544

申请日：1997-12-24

Applicant: FORD MOTOR COMPANY ,  FORD MOTOR COMPANY LIMITED

Inventor： FORD MOTOR COMPANY ,  FORD MOTOR COMPANY LIMITED ,  PHAM, Cuong, Van ,  BAKER, Jay, DeAvis ,  NUNO, Rose, Lynda

IPC: H01L21/607

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/06135 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/49175 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85001 ,  H01L2224/8502 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A method is disclosed for on-line doping of metallic connecting wire for use in integrated circuits. The method comprises the steps of: providing a bonding apparatus (70) comprising a bonding tool (40), said bonding tool having a tip (44) through which a capillary (42) runs, such that metallic connecting wire (20) may be fed through said tip (44); extending an end of the connecting wire (20) a predetermined length beyond the tip (44) of said bonding tool (40); and forming a doped area on the end of said wire by: bringing the end of said wire into contact with dopant material (52), and applying predetermined amounts of pressure, heat, and ultrasonic vibration to said end of the wire (20) for a predetermined amount of time.

Abstract translation: 公开了用于在集成电路中使用的金属连接线的在线掺杂的方法。 该方法包括以下步骤：提供包括接合工具（40）的接合装置（70），所述接合工具具有尖端（44），毛细管（42）穿过该尖端，使得金属连接线（20）可以是 馈送通过所述尖端（44）; 将所述连接线（20）的端部延伸超过所述接合工具（40）的尖端（44）的预定长度; 以及通过以下方式在所述导线的端部上形成掺杂区域：使所述导线的端部与掺杂剂材料（52）接触，并且向所述导线（20）的所述端部施加预定量的压力，热和超声波振动 预定的时间量。

公开(公告)号：WO2013009082A2

公开(公告)日：2013-01-17

申请号：PCT/KR2012005479

申请日：2012-07-11

Applicant: POINT ENGINEERING CO LTD ,  NAM KI MYUNG ,  JUN YOUNG CHUL ,  SONG TAE HWAN

Inventor： NAM KI MYUNG ,  JUN YOUNG CHUL ,  SONG TAE HWAN

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/647 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48505 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated with the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprise: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, is connected to both side surfaces of the optical element substrate, respectively, and is wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which is made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and is wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means.

Abstract translation: 本发明涉及一种用于光学器件的基板，其被配置为以适配的方式连接光学元件基板和电极基板，并且同时形成一个或多个桥接垫，所述一个或多个桥接垫与光学元件基板通过 水平绝缘层，在光学元件基板上。 根据本发明第一方面的用于光学器件的基板包括：光学元件基板，其由金属板制成并且其中包含多个光学元件; 一对由绝缘材料制成以在其上表面的至少一部分上形成导电层的电极基板分别连接到光学元件基板的两个侧表面，并且电极引线接合到电极 的光学元件; 以及配合装置，其形成在电极基板和光学元件基板的侧表面上以配合光学元件基板和电极基板。 根据本发明的第二方面的用于光学器件的基板包括：由金属板制成并且其中包含多个光学元件的光学元件基板; 一对电极基板，其由金属材料分别连接到所述光学元件基板的两个侧表面，并且与所述光学元件的所述电极导线接合; 配合装置，其形成在电极基板和光学元件基板的侧表面上以配合光学元件基板和电极基板; 以及配合型垂直绝缘层，其介于所述光学元件基板和所述电极基板之间以连接至所述配合装置。

公开(公告)号：WO2014203777A1

公开(公告)日：2014-12-24

申请号：PCT/JP2014/065429

申请日：2014-06-11

Applicant: 住友ベークライト株式会社

Inventor： 伊藤　慎吾

IPC: H01L21/60 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/29 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L24/05 ,  H01L23/3128 ,  H01L23/49582 ,  H01L23/564 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/49171 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01202 ,  H01L2924/01201 ,  H01L2924/00015 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01046

Abstract: 半導体装置（１００）は、電極パッド（１２）を備える半導体チップ（１０）と、電極パッド（１２）に電気的に接続されたワイヤ（３０）と、を備える。ワイヤ（３０）は、Ａｇを主成分としてＰｄを含む第１金属材料により構成されている。電極パッド（１２）は、Ａｌを主成分とする第２金属材料により構成されている。ワイヤ（３０）と電極パッド（１２）との接合部（４０）には、Ａｇ、ＡｌおよびＰｄを含む合金層が形成されている。

Abstract translation: 半导体器件（100）具有：设置有电极焊盘（12）的半导体芯片（10）; 以及电连接到所述电极焊盘（12）的导线（30）。 导线（30）由主要由Ag构成并含有Pd的第一金属材料构成。 电极焊盘（12）由主要由Al组成的第二金属材料构成。 在导线（30）的接合部（40）和电极焊盘（12）上形成有含有Ag，Al，Pd的合金层。

公开(公告)号：WO2010105157A3

公开(公告)日：2012-02-23

申请号：PCT/US2010027141

申请日：2010-03-12

Applicant: TESSERA INC ,  HABA BELGACEM ,  MARCUCCI BRIAN

Inventor： HABA BELGACEM ,  MARCUCCI BRIAN

IPC: H01L23/49 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011

Abstract: A microelectronic assembly can include a microelectronic device (310) having device contacts (312) exposed at a surface (328) thereof and an interconnection element having element contacts (340) and having a face adjacent to the microelectronic device. Conductive elements (365), e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer (360) has a conductive surface (375) disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material (360) can have first and second dimensions (326, 336) in first and second horizontal directions which are smaller than first and second corresponding dimensions (324, 334) of the microelectronic device. The conductive material (360) is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

Abstract translation: 微电子组件可以包括具有在其表面（328）处暴露的器件触点（312）的微电子器件（310）和具有元件触点（340）并具有与微电子器件相邻的面的互连元件。 导电元件（365），例如，引线将器件触点与元件触点连接，并且具有在微电子器件的表面上方延伸的部分。 导电层（360）具有导电表面（375），该导电表面设置在多个导电元件的行程之上或之下至少基本均匀的距离处。 在一些情况下，导电材料（360）可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸（324,334）的第一和第二尺寸（326,336）。 导电材料（360）可连接到参考电位源，以便实现导电元件所需的阻抗。